BR112012011692B1 - material de conexão de circuito e estrutura de conexão para membro de circuito usando o mesmo - Google Patents

material de conexão de circuito e estrutura de conexão para membro de circuito usando o mesmo Download PDF

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Publication number
BR112012011692B1
BR112012011692B1 BR112012011692-4A BR112012011692A BR112012011692B1 BR 112012011692 B1 BR112012011692 B1 BR 112012011692B1 BR 112012011692 A BR112012011692 A BR 112012011692A BR 112012011692 B1 BR112012011692 B1 BR 112012011692B1
Authority
BR
Brazil
Prior art keywords
circuit
connection material
circuit connection
conductive particles
connection
Prior art date
Application number
BR112012011692-4A
Other languages
English (en)
Portuguese (pt)
Other versions
BR112012011692A2 (pt
Inventor
Takashi Nakazawa
Kouji Kobayashi
Original Assignee
Hitachi Chemical Company, Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd filed Critical Hitachi Chemical Company, Ltd
Publication of BR112012011692A2 publication Critical patent/BR112012011692A2/pt
Publication of BR112012011692B1 publication Critical patent/BR112012011692B1/pt

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/106—Esters of polycondensation macromers
    • C08F222/1065—Esters of polycondensation macromers of alcohol terminated (poly)urethanes, e.g. urethane(meth)acrylates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F230/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
    • C08F230/02—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
BR112012011692-4A 2009-11-16 2010-11-15 material de conexão de circuito e estrutura de conexão para membro de circuito usando o mesmo BR112012011692B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009261000 2009-11-16
JP2009-261000 2009-11-16
PCT/JP2010/070286 WO2011059084A1 (ja) 2009-11-16 2010-11-15 回路接続材料及びそれを用いた回路部材の接続構造

Publications (2)

Publication Number Publication Date
BR112012011692A2 BR112012011692A2 (pt) 2018-03-27
BR112012011692B1 true BR112012011692B1 (pt) 2020-11-17

Family

ID=43991737

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112012011692-4A BR112012011692B1 (pt) 2009-11-16 2010-11-15 material de conexão de circuito e estrutura de conexão para membro de circuito usando o mesmo

Country Status (6)

Country Link
JP (2) JP5518747B2 (zh)
KR (1) KR101342255B1 (zh)
CN (1) CN102598419B (zh)
BR (1) BR112012011692B1 (zh)
TW (1) TWI494402B (zh)
WO (1) WO2011059084A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013031702A1 (ja) * 2011-08-26 2013-03-07 旭化成イーマテリアルズ株式会社 太陽電池セル接続構造体の製造方法
JP6231256B2 (ja) * 2011-12-15 2017-11-15 デクセリアルズ株式会社 異方性導電接着剤、及び電子部品の接続方法
JP2013182823A (ja) * 2012-03-02 2013-09-12 Dexerials Corp 接続体の製造方法、及び異方性導電接着剤
JP6102105B2 (ja) * 2012-07-19 2017-03-29 日立化成株式会社 フィルム状回路接続材料及び回路接続構造体
CN104541416B (zh) 2012-08-24 2017-07-04 迪睿合电子材料有限公司 各向异性导电膜的制造方法和各向异性导电膜
KR101716945B1 (ko) * 2012-08-24 2017-03-15 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름 및 그의 제조 방법
JP2014192486A (ja) * 2013-03-28 2014-10-06 Dexerials Corp 回路部材の接続方法、及び接合体
JP2016181511A (ja) * 2015-03-23 2016-10-13 デクセリアルズ株式会社 導電性粒子、異方性導電接着剤及び接続構造体
KR102376223B1 (ko) * 2015-09-04 2022-03-17 쇼와덴코머티리얼즈가부시끼가이샤 접착제 조성물, 이방 도전성 접착제 조성물, 회로 접속 재료 및 접속체
US20180175290A1 (en) * 2016-12-19 2018-06-21 Arm Ltd. Forming nucleation layers in correlated electron material devices
JP7446095B2 (ja) 2019-12-03 2024-03-08 デクセリアルズ株式会社 フィルム巻装体及び接続体の製造方法

Family Cites Families (14)

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JPS63308880A (ja) * 1987-06-11 1988-12-16 Sony Chem Corp 異方性導電接着体
JP2905121B2 (ja) * 1995-07-19 1999-06-14 ソニーケミカル株式会社 異方性導電接着フィルム
JPH0955279A (ja) * 1995-08-10 1997-02-25 Hitachi Chem Co Ltd 電極の接続方法および該方法で得た電極の接続構造
JP3738655B2 (ja) * 2000-03-31 2006-01-25 ソニーケミカル株式会社 異方性導電接着材料及び接続方法
JP2003100367A (ja) * 2001-09-20 2003-04-04 Denso Corp 導電性接着剤、この接着剤を用いた回路基板間の接続方法および回路基板間の接続構造
JP2005071817A (ja) * 2003-08-25 2005-03-17 Asahi Kasei Electronics Co Ltd 異方導電性フィルム
JP2005197032A (ja) * 2004-01-05 2005-07-21 Asahi Kasei Electronics Co Ltd 異方導電性フィルム
EP1754762A4 (en) * 2004-06-09 2009-07-22 Hitachi Chemical Co Ltd ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING CONSTRUCTION FOR CIRCUIT ELEMENT AND SEMICONDUCTOR DEVICE
JP2006108523A (ja) * 2004-10-08 2006-04-20 Hitachi Chem Co Ltd 異方性導電フィルムを用いた電気部品の接続方法
JP4860163B2 (ja) * 2005-02-15 2012-01-25 積水化学工業株式会社 導電性微粒子の製造方法
WO2009048070A1 (ja) * 2007-10-12 2009-04-16 Hitachi Chemical Company, Ltd. 回路接続材料及びそれを用いた回路部材の接続構造
JP4872949B2 (ja) * 2007-10-12 2012-02-08 日立化成工業株式会社 回路接続材料及びそれを用いた回路部材の接続構造
KR101180571B1 (ko) * 2007-10-31 2012-09-06 히다치 가세고교 가부시끼가이샤 회로 접속 재료 및 회로 부재의 접속 구조
JP2009242508A (ja) * 2008-03-31 2009-10-22 Asahi Kasei E-Materials Corp 接着剤及び接合体

Also Published As

Publication number Publication date
CN102598419A (zh) 2012-07-18
CN102598419B (zh) 2015-04-29
KR20120088782A (ko) 2012-08-08
JP2013138013A (ja) 2013-07-11
KR101342255B1 (ko) 2013-12-16
BR112012011692A2 (pt) 2018-03-27
WO2011059084A1 (ja) 2011-05-19
TWI494402B (zh) 2015-08-01
JP5716763B2 (ja) 2015-05-13
JP5518747B2 (ja) 2014-06-11
TW201134904A (en) 2011-10-16
JPWO2011059084A1 (ja) 2013-04-04

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06T Formal requirements before examination [chapter 6.20 patent gazette]
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B25G Requested change of headquarter approved

Owner name: HITACHI CHEMICAL COMPANY, LTD (JP)

B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 17/11/2020, OBSERVADAS AS CONDICOES LEGAIS.

B25D Requested change of name of applicant approved

Owner name: SHOWA DENKO MATERIALS CO., LTD. (JP)

B25D Requested change of name of applicant approved

Owner name: RESONAC CORPORATION (JP)

B25G Requested change of headquarter approved

Owner name: RESONAC CORPORATION (JP)