KR101258328B1 - 루테늄 산화물을 갖는 무연 저항 조성물 - Google Patents

루테늄 산화물을 갖는 무연 저항 조성물 Download PDF

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Publication number
KR101258328B1
KR101258328B1 KR1020107025882A KR20107025882A KR101258328B1 KR 101258328 B1 KR101258328 B1 KR 101258328B1 KR 1020107025882 A KR1020107025882 A KR 1020107025882A KR 20107025882 A KR20107025882 A KR 20107025882A KR 101258328 B1 KR101258328 B1 KR 101258328B1
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South Korea
Prior art keywords
oxide
composition
weight
borosilicate glass
cuo
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Expired - Fee Related
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KR1020107025882A
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English (en)
Korean (ko)
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KR20100134767A (ko
Inventor
마크 에이치. 라브란슈
케네스 워렌 행
알프레드 티. 워커
유코 오가타
Original Assignee
이 아이 듀폰 디 네모아 앤드 캄파니
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/04—Frit compositions, i.e. in a powdered or comminuted form containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/22—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions containing two or more distinct frits having different compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
    • H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
    • H01C17/0654—Oxides of the platinum group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Glass Compositions (AREA)
  • Non-Adjustable Resistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Conductive Materials (AREA)
KR1020107025882A 2008-04-18 2009-04-17 루테늄 산화물을 갖는 무연 저항 조성물 Expired - Fee Related KR101258328B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US4628208P 2008-04-18 2008-04-18
US61/046,282 2008-04-18
US12/425,048 US8257619B2 (en) 2008-04-18 2009-04-16 Lead-free resistive composition
US12/425,048 2009-04-16
PCT/US2009/040960 WO2009129463A1 (en) 2008-04-18 2009-04-17 Lead-free resistive compositions having ruthenium oxide

Publications (2)

Publication Number Publication Date
KR20100134767A KR20100134767A (ko) 2010-12-23
KR101258328B1 true KR101258328B1 (ko) 2013-04-25

Family

ID=40823428

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107025882A Expired - Fee Related KR101258328B1 (ko) 2008-04-18 2009-04-17 루테늄 산화물을 갖는 무연 저항 조성물

Country Status (7)

Country Link
US (1) US8257619B2 (enExample)
EP (1) EP2274249A1 (enExample)
JP (2) JP2011518104A (enExample)
KR (1) KR101258328B1 (enExample)
CN (1) CN101990522B (enExample)
TW (1) TW201000424A (enExample)
WO (1) WO2009129463A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012127468A2 (en) * 2011-03-24 2012-09-27 Ben-Gurion University Of The Negev Research And Development Authority Coatings for solar applications
RU2638070C2 (ru) * 2011-09-13 2017-12-11 Ферро Корпорейшн Индукционная пайка неорганических подложек
KR101351916B1 (ko) * 2011-11-01 2014-02-17 중원대학교 산학협력단 루테늄산염수용액을 이용한 이산화루테늄 제조 방법
US9236155B2 (en) * 2013-02-04 2016-01-12 E I Du Pont De Nemours And Company Copper paste composition and its use in a method for forming copper conductors on substrates
WO2014119592A1 (ja) * 2013-02-04 2014-08-07 独立行政法人産業技術総合研究所 抵抗体、誘電体等の電子部品用無機材料ペースト及び該無機材料ペーストの製造方法
WO2016039108A1 (ja) * 2014-09-12 2016-03-17 昭栄化学工業株式会社 厚膜抵抗体及びその製造方法
MY183351A (en) * 2014-09-12 2021-02-18 Shoei Chemical Ind Co Resistive composition
DE102015110607A1 (de) * 2015-07-01 2017-01-05 Epcos Ag Verfahren zur Herstellung eines elektrischen Bauelements
JP2017048061A (ja) * 2015-08-31 2017-03-09 日本電気硝子株式会社 ガラスペースト組成物及び被膜形成ガラス部材の製造方法
JP6708093B2 (ja) * 2016-10-20 2020-06-10 住友金属鉱山株式会社 抵抗ペースト及びその焼成により作製される抵抗体
CN106601331A (zh) * 2016-10-25 2017-04-26 东莞珂洛赫慕电子材料科技有限公司 一种具有低tcr值的高温无铅钌浆及其制备方法
JP6931455B2 (ja) * 2017-02-17 2021-09-08 住友金属鉱山株式会社 抵抗体用組成物及びこれを含んだ抵抗体ペーストとそれを用いた厚膜抵抗体
US10115505B2 (en) 2017-02-23 2018-10-30 E I Du Pont De Nemours And Company Chip resistor
WO2021145269A1 (ja) * 2020-01-16 2021-07-22 ナミックス株式会社 導電性ペースト、電極及びチップ抵抗器
CN114831350A (zh) * 2021-02-02 2022-08-02 深圳麦克韦尔科技有限公司 发热组件及电子雾化装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0132810A1 (en) * 1983-07-25 1985-02-13 E.I. Du Pont De Nemours And Company Borosilicate glass composition
US5534194A (en) * 1993-03-30 1996-07-09 E. I. Du Pont De Nemours And Company Thick film resistor composition containing pyrochlore and silver-containing binder
JP2005244115A (ja) * 2004-02-27 2005-09-08 Tdk Corp 抵抗体ペースト、抵抗体及び電子部品
JP2006287173A (ja) * 2004-09-01 2006-10-19 Tdk Corp 厚膜抵抗体ペーストおよび厚膜抵抗体

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4051074A (en) * 1975-10-29 1977-09-27 Shoei Kagaku Kogyo Kabushiki Kaisha Resistor composition and method for its manufacture
US4312770A (en) * 1979-07-09 1982-01-26 General Motors Corporation Thick film resistor paste and resistors therefrom
US4651126A (en) * 1985-05-02 1987-03-17 Shailendra Kumar Electrical resistor material, resistor made therefrom and method of making the same
JPH05335110A (ja) 1992-05-11 1993-12-17 Du Pont Japan Ltd 厚膜抵抗体組成物
US5474711A (en) * 1993-05-07 1995-12-12 E. I. Du Pont De Nemours And Company Thick film resistor compositions
US5491118A (en) * 1994-12-20 1996-02-13 E. I. Du Pont De Nemours And Company Cadmium-free and lead-free thick film paste composition
WO1999063553A1 (en) 1998-05-29 1999-12-09 E.I. Du Pont De Nemours And Company Thick film resistor compositions for making heat-transfer tapes and use thereof
DE60021828D1 (de) * 1999-10-28 2005-09-15 Murata Manufacturing Co Dickschicht-Widerstand und Keramiksubstrat
JP3731803B2 (ja) * 1999-10-28 2006-01-05 株式会社村田製作所 厚膜抵抗体
TW200419593A (en) * 2002-11-21 2004-10-01 Tdk Corp Resistive paste, resistor body and electronic device
TW200612443A (en) * 2004-09-01 2006-04-16 Tdk Corp Thick-film resistor paste and thick-film resistor
CN100511496C (zh) * 2004-09-01 2009-07-08 Tdk株式会社 厚膜电阻浆料和厚膜电阻
JP2007103594A (ja) * 2005-10-03 2007-04-19 Shoei Chem Ind Co 抵抗体組成物並びに厚膜抵抗体
CN102007080B (zh) * 2008-04-18 2014-05-07 E.I.内穆尔杜邦公司 使用含铜玻璃料的电阻器组合物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0132810A1 (en) * 1983-07-25 1985-02-13 E.I. Du Pont De Nemours And Company Borosilicate glass composition
US5534194A (en) * 1993-03-30 1996-07-09 E. I. Du Pont De Nemours And Company Thick film resistor composition containing pyrochlore and silver-containing binder
JP2005244115A (ja) * 2004-02-27 2005-09-08 Tdk Corp 抵抗体ペースト、抵抗体及び電子部品
JP2006287173A (ja) * 2004-09-01 2006-10-19 Tdk Corp 厚膜抵抗体ペーストおよび厚膜抵抗体

Also Published As

Publication number Publication date
US8257619B2 (en) 2012-09-04
JP2011518104A (ja) 2011-06-23
WO2009129463A1 (en) 2009-10-22
TW201000424A (en) 2010-01-01
US20110089381A1 (en) 2011-04-21
CN101990522A (zh) 2011-03-23
CN101990522B (zh) 2014-05-07
JP2014144910A (ja) 2014-08-14
KR20100134767A (ko) 2010-12-23
EP2274249A1 (en) 2011-01-19

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