KR101250722B1 - 기판세정방법 및 기판세정장치 - Google Patents

기판세정방법 및 기판세정장치 Download PDF

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Publication number
KR101250722B1
KR101250722B1 KR1020110053954A KR20110053954A KR101250722B1 KR 101250722 B1 KR101250722 B1 KR 101250722B1 KR 1020110053954 A KR1020110053954 A KR 1020110053954A KR 20110053954 A KR20110053954 A KR 20110053954A KR 101250722 B1 KR101250722 B1 KR 101250722B1
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substrate
nozzle
rinse liquid
gas
liquid
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KR20120004922A (ko
Inventor
타다시 미야기
마사히코 하루모토
사다야스 스야마
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가부시키가이샤 소쿠도
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Cleaning Or Drying Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020110053954A 2010-07-07 2011-06-03 기판세정방법 및 기판세정장치 Active KR101250722B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010154509A JP5538102B2 (ja) 2010-07-07 2010-07-07 基板洗浄方法および基板洗浄装置
JPJP-P-2010-154509 2010-07-07

Publications (2)

Publication Number Publication Date
KR20120004922A KR20120004922A (ko) 2012-01-13
KR101250722B1 true KR101250722B1 (ko) 2013-04-03

Family

ID=45437688

Family Applications (1)

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KR1020110053954A Active KR101250722B1 (ko) 2010-07-07 2011-06-03 기판세정방법 및 기판세정장치

Country Status (3)

Country Link
US (1) US9028621B2 (enExample)
JP (1) JP5538102B2 (enExample)
KR (1) KR101250722B1 (enExample)

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US8900307B2 (en) 2007-06-26 2014-12-02 DePuy Synthes Products, LLC Highly lordosed fusion cage
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JP5441997B2 (ja) 2008-04-05 2014-03-12 ジンテス ゲゼルシャフト ミット ベシュレンクテル ハフツング 拡張可能な椎骨間インプラント
US9282979B2 (en) 2010-06-24 2016-03-15 DePuy Synthes Products, Inc. Instruments and methods for non-parallel disc space preparation
US8979860B2 (en) 2010-06-24 2015-03-17 DePuy Synthes Products. LLC Enhanced cage insertion device
EP2588034B1 (en) 2010-06-29 2018-01-03 Synthes GmbH Distractible intervertebral implant
US9402732B2 (en) 2010-10-11 2016-08-02 DePuy Synthes Products, Inc. Expandable interspinous process spacer implant
JP5528486B2 (ja) * 2012-02-07 2014-06-25 東京エレクトロン株式会社 基板処理装置、これを備える塗布現像装置、及び基板処理方法
US20140067069A1 (en) 2012-08-30 2014-03-06 Interventional Spine, Inc. Artificial disc
KR101486331B1 (ko) * 2012-11-07 2015-01-26 주식회사 케이씨텍 기판 건조장치
US9717601B2 (en) 2013-02-28 2017-08-01 DePuy Synthes Products, Inc. Expandable intervertebral implant, system, kit and method
US9522070B2 (en) 2013-03-07 2016-12-20 Interventional Spine, Inc. Intervertebral implant
JP2014194965A (ja) * 2013-03-28 2014-10-09 Dainippon Screen Mfg Co Ltd 基板処理装置
JP6007925B2 (ja) * 2013-05-28 2016-10-19 東京エレクトロン株式会社 基板洗浄装置、基板洗浄方法及び記憶媒体
US9704730B2 (en) * 2013-05-28 2017-07-11 Tokyo Electron Limited Substrate cleaning apparatus, substrate cleaning method and non-transitory storage medium
JP5995881B2 (ja) * 2014-01-09 2016-09-21 東京エレクトロン株式会社 基板洗浄方法、基板洗浄装置、及びコンピュータ読み取り可能な記録媒体
JP2015173369A (ja) * 2014-03-12 2015-10-01 ソニー株式会社 信号処理装置、信号処理方法、およびプログラム
JP6386769B2 (ja) 2014-04-16 2018-09-05 株式会社荏原製作所 基板乾燥装置、制御プログラム、及び基板乾燥方法
JP6148210B2 (ja) * 2014-06-17 2017-06-14 東京エレクトロン株式会社 現像方法及びコンピュータ読み取り可能な記録媒体
JP6454245B2 (ja) * 2014-10-21 2019-01-16 東京エレクトロン株式会社 基板液処理方法及び基板液処理装置並びに基板液処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体
US11426290B2 (en) 2015-03-06 2022-08-30 DePuy Synthes Products, Inc. Expandable intervertebral implant, system, kit and method
KR20170134925A (ko) * 2016-05-27 2017-12-07 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
US11510788B2 (en) 2016-06-28 2022-11-29 Eit Emerging Implant Technologies Gmbh Expandable, angularly adjustable intervertebral cages
JP7023877B2 (ja) 2016-06-28 2022-02-22 イーアイティー・エマージング・インプラント・テクノロジーズ・ゲーエムベーハー 拡張可能かつ角度調節可能な関節運動式の椎間ケージ
US10395930B2 (en) * 2016-12-30 2019-08-27 Semes Co., Ltd. Substrate treating apparatus and substrate treating method
US10398563B2 (en) 2017-05-08 2019-09-03 Medos International Sarl Expandable cage
US11344424B2 (en) 2017-06-14 2022-05-31 Medos International Sarl Expandable intervertebral implant and related methods
JP7073658B2 (ja) 2017-09-25 2022-05-24 東京エレクトロン株式会社 基板処理方法、基板処理装置、及び記憶媒体
EP3479912A1 (en) * 2017-11-07 2019-05-08 Satisloh AG Cleaning station for optical elements
JP7218098B2 (ja) * 2018-05-31 2023-02-06 株式会社デンソーテン 塗布装置および塗布方法
US11355366B2 (en) 2018-08-30 2022-06-07 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for shuttered wafer cleaning
JP7138539B2 (ja) * 2018-10-18 2022-09-16 東京エレクトロン株式会社 基板処理装置及び基板処理方法
US11446156B2 (en) 2018-10-25 2022-09-20 Medos International Sarl Expandable intervertebral implant, inserter instrument, and related methods
JP7308048B2 (ja) * 2019-02-15 2023-07-13 株式会社Ｓｃｒｅｅｎホールディングス 液処理装置および液処理方法
JP7308105B2 (ja) * 2019-09-02 2023-07-13 東京エレクトロン株式会社 現像処理方法及び現像処理装置
JP7265467B2 (ja) * 2019-12-17 2023-04-26 株式会社荏原製作所 レジスト除去システムおよびレジスト除去方法
US10998218B1 (en) * 2019-12-29 2021-05-04 Nanya Technology Corporation Wet cleaning apparatus and manufacturing method using the same
KR20250069975A (ko) * 2020-03-05 2025-05-20 도쿄엘렉트론가부시키가이샤 기판 처리 방법 및 기판 처리 장치
US11426286B2 (en) 2020-03-06 2022-08-30 Eit Emerging Implant Technologies Gmbh Expandable intervertebral implant
CN113391528A (zh) * 2020-03-11 2021-09-14 长鑫存储技术有限公司 改善光阻显影均匀性的方法
TWI819992B (zh) * 2020-09-18 2023-10-21 日商斯庫林集團股份有限公司 基板洗淨裝置及基板處理裝置
KR102504087B1 (ko) * 2020-12-29 2023-02-24 세메스 주식회사 기판 처리 장치 및 방법
US11850160B2 (en) 2021-03-26 2023-12-26 Medos International Sarl Expandable lordotic intervertebral fusion cage
US11752009B2 (en) 2021-04-06 2023-09-12 Medos International Sarl Expandable intervertebral fusion cage
JP7781577B2 (ja) * 2021-09-22 2025-12-08 キオクシア株式会社 基板処理装置及び基板処理方法
US12090064B2 (en) 2022-03-01 2024-09-17 Medos International Sarl Stabilization members for expandable intervertebral implants, and related systems and methods
US12138745B2 (en) 2023-03-22 2024-11-12 Yield Engineering Systems, Inc. Apparatus and method for coating removal
CN117116741B (zh) * 2023-08-09 2024-07-09 中环领先半导体科技股份有限公司 一种晶圆键合前的清洗方法及清洗装置

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JP2012019002A (ja) 2012-01-26
KR20120004922A (ko) 2012-01-13
US20120006361A1 (en) 2012-01-12
US9028621B2 (en) 2015-05-12
JP5538102B2 (ja) 2014-07-02

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