JP5538102B2 - 基板洗浄方法および基板洗浄装置 - Google Patents

基板洗浄方法および基板洗浄装置 Download PDF

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Publication number
JP5538102B2
JP5538102B2 JP2010154509A JP2010154509A JP5538102B2 JP 5538102 B2 JP5538102 B2 JP 5538102B2 JP 2010154509 A JP2010154509 A JP 2010154509A JP 2010154509 A JP2010154509 A JP 2010154509A JP 5538102 B2 JP5538102 B2 JP 5538102B2
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Prior art keywords
substrate
nozzle
liquid
gas
rinse liquid
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Japanese (ja)
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JP2012019002A5 (enExample
JP2012019002A (ja
Inventor
聡 宮城
将彦 春本
定保 須山
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Screen Semiconductor Solutions Co Ltd
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Screen Semiconductor Solutions Co Ltd
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=45437688&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP5538102(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Screen Semiconductor Solutions Co Ltd filed Critical Screen Semiconductor Solutions Co Ltd
Priority to JP2010154509A priority Critical patent/JP5538102B2/ja
Priority to US13/116,793 priority patent/US9028621B2/en
Priority to KR1020110053954A priority patent/KR101250722B1/ko
Publication of JP2012019002A publication Critical patent/JP2012019002A/ja
Publication of JP2012019002A5 publication Critical patent/JP2012019002A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning By Liquid Or Steam (AREA)
JP2010154509A 2010-07-07 2010-07-07 基板洗浄方法および基板洗浄装置 Active JP5538102B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010154509A JP5538102B2 (ja) 2010-07-07 2010-07-07 基板洗浄方法および基板洗浄装置
US13/116,793 US9028621B2 (en) 2010-07-07 2011-05-26 Substrate cleaning method and substrate cleaning device
KR1020110053954A KR101250722B1 (ko) 2010-07-07 2011-06-03 기판세정방법 및 기판세정장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010154509A JP5538102B2 (ja) 2010-07-07 2010-07-07 基板洗浄方法および基板洗浄装置

Publications (3)

Publication Number Publication Date
JP2012019002A JP2012019002A (ja) 2012-01-26
JP2012019002A5 JP2012019002A5 (enExample) 2013-05-30
JP5538102B2 true JP5538102B2 (ja) 2014-07-02

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JP2010154509A Active JP5538102B2 (ja) 2010-07-07 2010-07-07 基板洗浄方法および基板洗浄装置

Country Status (3)

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US (1) US9028621B2 (enExample)
JP (1) JP5538102B2 (enExample)
KR (1) KR101250722B1 (enExample)

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KR20170134925A (ko) * 2016-05-27 2017-12-07 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
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JP7175423B2 (ja) 2020-03-05 2022-11-18 東京エレクトロン株式会社 基板処理方法、及び基板処理装置
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CN113391528A (zh) * 2020-03-11 2021-09-14 长鑫存储技术有限公司 改善光阻显影均匀性的方法
TWI819992B (zh) * 2020-09-18 2023-10-21 日商斯庫林集團股份有限公司 基板洗淨裝置及基板處理裝置
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Also Published As

Publication number Publication date
KR20120004922A (ko) 2012-01-13
US20120006361A1 (en) 2012-01-12
JP2012019002A (ja) 2012-01-26
US9028621B2 (en) 2015-05-12
KR101250722B1 (ko) 2013-04-03

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