KR101244591B1 - 기판 처리 장치 - Google Patents

기판 처리 장치 Download PDF

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Publication number
KR101244591B1
KR101244591B1 KR1020080061035A KR20080061035A KR101244591B1 KR 101244591 B1 KR101244591 B1 KR 101244591B1 KR 1020080061035 A KR1020080061035 A KR 1020080061035A KR 20080061035 A KR20080061035 A KR 20080061035A KR 101244591 B1 KR101244591 B1 KR 101244591B1
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KR
South Korea
Prior art keywords
substrate
cup
annular space
exhaust
wall portion
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KR1020080061035A
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English (en)
Korean (ko)
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KR20090013024A (ko
Inventor
노리히로 이토
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도쿄엘렉트론가부시키가이샤
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Publication of KR20090013024A publication Critical patent/KR20090013024A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Coating Apparatus (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020080061035A 2007-07-31 2008-06-26 기판 처리 장치 Active KR101244591B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-00198826 2007-07-31
JP2007198826A JP4825178B2 (ja) 2007-07-31 2007-07-31 基板処理装置

Publications (2)

Publication Number Publication Date
KR20090013024A KR20090013024A (ko) 2009-02-04
KR101244591B1 true KR101244591B1 (ko) 2013-03-25

Family

ID=40176161

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080061035A Active KR101244591B1 (ko) 2007-07-31 2008-06-26 기판 처리 장치

Country Status (5)

Country Link
US (1) US8042560B2 (enExample)
JP (1) JP4825178B2 (enExample)
KR (1) KR101244591B1 (enExample)
DE (1) DE102008035802A1 (enExample)
TW (1) TW200921771A (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4920643B2 (ja) * 2008-07-09 2012-04-18 東京エレクトロン株式会社 液処理装置および液処理方法
JP2011054619A (ja) * 2009-08-31 2011-03-17 Hitachi Kokusai Electric Inc 基板処理装置
TWI445065B (zh) * 2009-12-18 2014-07-11 J E T Co Ltd Substrate processing device
JP5726636B2 (ja) * 2011-05-24 2015-06-03 東京エレクトロン株式会社 液処理装置、液処理方法
US9242279B2 (en) 2011-05-24 2016-01-26 Tokyo Electron Limited Liquid processing apparatus and liquid processing method
JP5726637B2 (ja) * 2011-05-24 2015-06-03 東京エレクトロン株式会社 液処理装置、液処理方法
JP6057624B2 (ja) 2012-09-03 2017-01-11 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ カップおよび基板処理装置
KR20150000548A (ko) * 2013-06-24 2015-01-05 삼성전자주식회사 기판 처리 장치
JP6250973B2 (ja) * 2013-08-08 2017-12-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6234736B2 (ja) * 2013-08-30 2017-11-22 芝浦メカトロニクス株式会社 スピン処理装置
JP6229933B2 (ja) 2013-09-27 2017-11-15 株式会社Ｓｃｒｅｅｎホールディングス 処理カップ洗浄方法、基板処理方法および基板処理装置
JP6359925B2 (ja) 2014-09-18 2018-07-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6308141B2 (ja) * 2015-02-03 2018-04-11 東京エレクトロン株式会社 基板処理装置、基板処理方法、及び記憶媒体
JP7314634B2 (ja) 2019-06-11 2023-07-26 東京エレクトロン株式会社 塗布装置及び塗布方法
KR102346529B1 (ko) * 2019-06-24 2021-12-31 세메스 주식회사 액 공급 유닛, 그리고 이를 가지는 기판 처리 장치 및 방법
CN113019827A (zh) * 2021-03-06 2021-06-25 山东阅航环保科技有限公司 一种方便上色的中空玻璃风干装置
JP2024060970A (ja) * 2022-10-20 2024-05-07 東京エレクトロン株式会社 カップ、液処理装置及び液処理方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100212023B1 (ko) * 1995-05-24 1999-08-02 히가시 데쓰로 레지스트 도포장치

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05146736A (ja) * 1991-11-27 1993-06-15 Sharp Corp スピン式コーテイング装置
KR100284559B1 (ko) 1994-04-04 2001-04-02 다카시마 히로시 처리방법 및 처리장치
JP3102831B2 (ja) 1994-06-20 2000-10-23 大日本スクリーン製造株式会社 回転処理装置
JP2003264167A (ja) 1996-10-07 2003-09-19 Tokyo Electron Ltd 液処理方法及びその装置
TW418452B (en) 1997-10-31 2001-01-11 Tokyo Electron Ltd Coating process
JP2000138163A (ja) 1998-10-30 2000-05-16 Tokyo Electron Ltd 液処理装置
JP3587723B2 (ja) 1999-04-30 2004-11-10 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP4593713B2 (ja) * 2000-02-04 2010-12-08 芝浦メカトロニクス株式会社 スピン処理装置
JP2002368066A (ja) 2001-06-06 2002-12-20 Tokyo Electron Ltd 処理装置
JP3890025B2 (ja) 2003-03-10 2007-03-07 東京エレクトロン株式会社 塗布処理装置及び塗布処理方法
JP3890026B2 (ja) 2003-03-10 2007-03-07 東京エレクトロン株式会社 液処理装置および液処理方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100212023B1 (ko) * 1995-05-24 1999-08-02 히가시 데쓰로 레지스트 도포장치

Also Published As

Publication number Publication date
DE102008035802A1 (de) 2009-02-05
KR20090013024A (ko) 2009-02-04
US20090031948A1 (en) 2009-02-05
JP4825178B2 (ja) 2011-11-30
TWI374485B (enExample) 2012-10-11
US8042560B2 (en) 2011-10-25
JP2009038083A (ja) 2009-02-19
TW200921771A (en) 2009-05-16

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