KR101229856B1 - 시트 첩부장치 및 첩부방법 - Google Patents

시트 첩부장치 및 첩부방법 Download PDF

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Publication number
KR101229856B1
KR101229856B1 KR1020077030784A KR20077030784A KR101229856B1 KR 101229856 B1 KR101229856 B1 KR 101229856B1 KR 1020077030784 A KR1020077030784 A KR 1020077030784A KR 20077030784 A KR20077030784 A KR 20077030784A KR 101229856 B1 KR101229856 B1 KR 101229856B1
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KR
South Korea
Prior art keywords
sheet
plate
tension
sticking
unwinding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020077030784A
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English (en)
Korean (ko)
Other versions
KR20080025700A (ko
Inventor
히데아키 노나카
칸 나카타
켄지 코바야시
Original Assignee
린텍 가부시키가이샤
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Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20080025700A publication Critical patent/KR20080025700A/ko
Application granted granted Critical
Publication of KR101229856B1 publication Critical patent/KR101229856B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020077030784A 2005-07-07 2006-06-26 시트 첩부장치 및 첩부방법 Expired - Fee Related KR101229856B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00198806 2005-07-07
JP2005198806A JP4441450B2 (ja) 2005-07-07 2005-07-07 シート貼付装置及び貼付方法
PCT/JP2006/312685 WO2007007531A1 (ja) 2005-07-07 2006-06-26 シート貼付装置及び貼付方法

Publications (2)

Publication Number Publication Date
KR20080025700A KR20080025700A (ko) 2008-03-21
KR101229856B1 true KR101229856B1 (ko) 2013-02-05

Family

ID=37636928

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077030784A Expired - Fee Related KR101229856B1 (ko) 2005-07-07 2006-06-26 시트 첩부장치 및 첩부방법

Country Status (7)

Country Link
US (1) US7789121B2 (enExample)
JP (1) JP4441450B2 (enExample)
KR (1) KR101229856B1 (enExample)
CN (1) CN101213647B (enExample)
DE (1) DE112006001813T5 (enExample)
TW (1) TWI395285B (enExample)
WO (1) WO2007007531A1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4452691B2 (ja) 2005-08-04 2010-04-21 リンテック株式会社 シート切断装置及び切断方法
KR101282699B1 (ko) 2005-08-11 2013-07-05 린텍 가부시키가이샤 시트 첩부 장치 및 첩부 방법
JP4795772B2 (ja) 2005-10-24 2011-10-19 リンテック株式会社 シート切断用テーブル及びシート貼付装置
JP4868591B2 (ja) * 2007-02-23 2012-02-01 株式会社タカトリ 基板へのテープの貼付方法及び装置
JP4963613B2 (ja) * 2007-02-27 2012-06-27 リンテック株式会社 シート貼付装置、シート貼付方法
JP2008270543A (ja) * 2007-04-20 2008-11-06 Disco Abrasive Syst Ltd 接着フィルムの貼着方法
JP5113599B2 (ja) * 2008-04-08 2013-01-09 リンテック株式会社 シート貼付装置及び貼付方法
JP4913772B2 (ja) * 2008-04-16 2012-04-11 リンテック株式会社 シート貼付装置及び貼付方法
JP5596446B2 (ja) * 2010-07-12 2014-09-24 リンテック株式会社 シート貼付装置及び貼付方法
JP5554166B2 (ja) * 2010-07-12 2014-07-23 リンテック株式会社 シート貼付装置
JP5261534B2 (ja) * 2011-05-18 2013-08-14 リンテック株式会社 検査装置
JP6002551B2 (ja) * 2012-11-14 2016-10-05 リンテック株式会社 シート貼付装置及び貼付方法、並びに、押圧装置及び押圧方法
JP6148903B2 (ja) * 2013-05-28 2017-06-14 リンテック株式会社 シート貼付装置および貼付方法
JP6216582B2 (ja) * 2013-09-13 2017-10-18 リンテック株式会社 シート貼付装置および貼付方法
JP6543140B2 (ja) * 2015-08-31 2019-07-10 リンテック株式会社 シート貼付装置およびシート貼付方法
JP7278930B2 (ja) * 2019-11-29 2023-05-22 川崎重工業株式会社 保持装置、ロボット、及びロボットシステム
JP7457524B2 (ja) * 2020-02-21 2024-03-28 株式会社ディスコ 剥離装置
JP6857763B2 (ja) * 2020-03-17 2021-04-14 リンテック株式会社 シート貼付装置および貼付方法
JP7490517B2 (ja) 2020-09-29 2024-05-27 リンテック株式会社 貼付装置および貼付方法
CN112331589B (zh) * 2020-10-26 2023-08-22 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 一种辊压单元、划槽晶圆分离装置及划槽晶圆分离方法
KR102692146B1 (ko) * 2021-02-04 2024-08-06 한미반도체 주식회사 마스킹 테이프 박리장치
JP7682636B2 (ja) * 2021-02-05 2025-05-26 株式会社東京精密 ダイシングテープの張力異常検知装置及び方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5961768A (en) * 1996-08-09 1999-10-05 Lintec Corporation Apparatus for applying adhesive sheets
JP2004047976A (ja) * 2002-05-21 2004-02-12 Nitto Denko Corp 保護テープ貼付方法およびその装置
JP2005116928A (ja) * 2003-10-10 2005-04-28 Lintec Corp マウント装置及びマウント方法
JP2005136306A (ja) * 2003-10-31 2005-05-26 Lintec Corp 貼合装置及び貼合方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06268047A (ja) * 1993-03-16 1994-09-22 Sharp Corp 半導体レーザチップの供給方法及び供給装置
ITFI20020088A1 (it) * 2002-05-29 2003-12-01 Perini Fabio Spa Dispositivo e metodo per il controllo della tensione di un materiale nastrifore

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5961768A (en) * 1996-08-09 1999-10-05 Lintec Corporation Apparatus for applying adhesive sheets
JP2004047976A (ja) * 2002-05-21 2004-02-12 Nitto Denko Corp 保護テープ貼付方法およびその装置
JP2005116928A (ja) * 2003-10-10 2005-04-28 Lintec Corp マウント装置及びマウント方法
JP2005136306A (ja) * 2003-10-31 2005-05-26 Lintec Corp 貼合装置及び貼合方法

Also Published As

Publication number Publication date
US7789121B2 (en) 2010-09-07
CN101213647B (zh) 2010-12-22
JP2007019239A (ja) 2007-01-25
DE112006001813T5 (de) 2008-05-15
TWI395285B (zh) 2013-05-01
WO2007007531A1 (ja) 2007-01-18
JP4441450B2 (ja) 2010-03-31
US20090065126A1 (en) 2009-03-12
TW200715457A (en) 2007-04-16
KR20080025700A (ko) 2008-03-21
CN101213647A (zh) 2008-07-02

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