KR101194452B1 - 광전자 기기 상의 마이크로 광학 기기 - Google Patents

광전자 기기 상의 마이크로 광학 기기 Download PDF

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Publication number
KR101194452B1
KR101194452B1 KR1020067019870A KR20067019870A KR101194452B1 KR 101194452 B1 KR101194452 B1 KR 101194452B1 KR 1020067019870 A KR1020067019870 A KR 1020067019870A KR 20067019870 A KR20067019870 A KR 20067019870A KR 101194452 B1 KR101194452 B1 KR 101194452B1
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South Korea
Prior art keywords
optical
layer
transparent material
wafer
layers
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Expired - Lifetime
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KR1020067019870A
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English (en)
Korean (ko)
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KR20070004774A (ko
Inventor
하르트무트 루트만
마르쿠스 로씨
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헵타곤 마이크로 옵틱스 피티이. 리미티드
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/026—Wafer-level processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Optical Integrated Circuits (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Hybrid Cells (AREA)
  • Optical Measuring Cells (AREA)
KR1020067019870A 2004-02-27 2005-02-25 광전자 기기 상의 마이크로 광학 기기 Expired - Lifetime KR101194452B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP04405110.0 2004-02-27
EP04405110A EP1569276A1 (en) 2004-02-27 2004-02-27 Micro-optics on optoelectronics
PCT/CH2005/000109 WO2005083789A2 (en) 2004-02-27 2005-02-25 Micro-optics on optoelectronics

Publications (2)

Publication Number Publication Date
KR20070004774A KR20070004774A (ko) 2007-01-09
KR101194452B1 true KR101194452B1 (ko) 2012-10-24

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KR1020067019870A Expired - Lifetime KR101194452B1 (ko) 2004-02-27 2005-02-25 광전자 기기 상의 마이크로 광학 기기

Country Status (9)

Country Link
US (1) US7457490B2 (https=)
EP (2) EP1569276A1 (https=)
JP (1) JP4903685B2 (https=)
KR (1) KR101194452B1 (https=)
CN (1) CN1947254B (https=)
AT (1) ATE498910T1 (https=)
DE (1) DE602005026367D1 (https=)
TW (1) TWI362058B (https=)
WO (1) WO2005083789A2 (https=)

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JP2007258672A (ja) * 2006-02-22 2007-10-04 Sharp Corp 発光ダイオード及びその製造方法
JP4765663B2 (ja) * 2006-02-23 2011-09-07 パナソニック電工株式会社 赤外線通信用モジュールの製造方法
US7785915B2 (en) * 2006-10-30 2010-08-31 Aptina Imaging Corporation Wafer level method of locating focal plane of imager devices
US20080181558A1 (en) * 2007-01-31 2008-07-31 Hartwell Peter G Electronic and optical circuit integration through wafer bonding
US7754600B2 (en) 2007-03-01 2010-07-13 Hewlett-Packard Development Company, L.P. Methods of forming nanostructures on metal-silicide crystallites, and resulting structures and devices
US20090032925A1 (en) * 2007-07-31 2009-02-05 England Luke G Packaging with a connection structure
US20100323105A1 (en) 2007-08-31 2010-12-23 Shigeru Hosoe Molding method, optical element manufacturing method, and arrayed optical element
ES2347023T3 (es) * 2007-11-13 2010-10-22 Oy M. Haloila Ab Dispositivo de suministro de pelicula y uso del mismo.
TWI478808B (zh) 2007-12-19 2015-04-01 Heptagon Micro Optics Pte Ltd 製造光學元件的方法
TWI481496B (zh) 2007-12-19 2015-04-21 Heptagon Micro Optics Pte Ltd 製造光學元件的方法
SG142321A1 (en) 2008-04-24 2009-11-26 Micron Technology Inc Pre-encapsulated cavity interposer
GB2460822A (en) * 2008-06-03 2009-12-16 Cambridge Display Tech Ltd Organic electroluminescent device
US7920342B2 (en) * 2008-07-01 2011-04-05 Aptina Imaging Corporation Over-molded glass lenses and method of forming the same
US8542310B2 (en) 2008-07-04 2013-09-24 Konica Minolta Opto, Inc. Imaging lens, manufacturing method and imaging unit therefor
CN101364568B (zh) * 2008-07-10 2011-11-30 旭丽电子(广州)有限公司 镜头模块的制造方法及以该方法所制成的镜头模块
TWI419557B (zh) * 2008-07-11 2013-12-11 Lite On Electronics Guangzhou 鏡頭模組、其製作方法及形成多個鏡頭模組的晶圓結構
WO2010020062A1 (en) 2008-08-20 2010-02-25 Heptagon Oy Method of manufacturing a pluralty of optical devices
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US20110187878A1 (en) * 2010-02-02 2011-08-04 Primesense Ltd. Synchronization of projected illumination with rolling shutter of image sensor
WO2011156926A1 (en) 2010-06-14 2011-12-22 Heptagon Oy Method of manufacturing a plurality of optical devices
CN103975436B (zh) 2011-07-19 2019-05-10 新加坡恒立私人有限公司 制造无源光学器件和包含该无源光学器件的装置的方法
SG193151A1 (en) 2011-07-19 2013-09-30 Heptagon Micro Optics Pte Ltd Opto-electronic modules and methods of manufacturing the same and appliances and devices comprising the same
WO2013020238A1 (en) * 2011-08-10 2013-02-14 Heptagon Micro Optics Pte. Ltd. Opto-electronic module and method for manufacturing the same
DE102011113483B4 (de) * 2011-09-13 2023-10-19 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen einer Mehrzahl von optoelektronischen Bauelementen und optoelektronisches Bauelement
CN103959465B (zh) * 2011-10-06 2019-06-07 新加坡恒立私人有限公司 用于物体的晶片级制造的方法以及相应的中间产品
CN104106135B (zh) * 2011-12-22 2018-02-23 新加坡恒立私人有限公司 光电模块、尤其是闪光灯模块及其制造方法
JP5985661B2 (ja) 2012-02-15 2016-09-06 アップル インコーポレイテッド 走査深度エンジン
US9329080B2 (en) 2012-02-15 2016-05-03 Aplle Inc. Modular optics for scanning engine having beam combining optics with a prism intercepted by both beam axis and collection axis
US9634051B2 (en) 2012-07-17 2017-04-25 Heptagon Micro Optics Pte. Ltd. Optical devices, in particular computational cameras, and methods for manufacturing the same
TW201417250A (zh) * 2012-07-17 2014-05-01 海特根微光學公司 光學模組，特別是光電模組，及其製造方法
TWI707483B (zh) 2012-07-17 2020-10-11 新加坡商新加坡恒立私人有限公司 發射可變強度分布的光線的光電模組
TWM448798U (zh) * 2012-08-10 2013-03-11 麥瑟半導體股份有限公司 光學元件封裝模組
DE102012109183A1 (de) * 2012-09-27 2014-03-27 Osram Opto Semiconductors Gmbh Optoelektronische Vorrichtung
US8606057B1 (en) 2012-11-02 2013-12-10 Heptagon Micro Optics Pte. Ltd. Opto-electronic modules including electrically conductive connections for integration with an electronic device
US10403671B2 (en) * 2013-12-10 2019-09-03 Ams Sensors Singapore Pte. Ltd. Wafer-level optical modules and methods for manufacturing the same
WO2016068876A1 (en) 2014-10-28 2016-05-06 Hewlett Packard Enterprise Development Lp Photonic interposer with wafer bonded microlenses
DE102014116134A1 (de) 2014-11-05 2016-05-12 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement
EP3243119A1 (de) 2015-01-06 2017-11-15 Huf Hülsbeck & Fürst GmbH & Co. KG Optische vorrichtung zur belichtung einer sensorvorrichtung für ein fahrzeug
RU2713080C1 (ru) 2015-10-01 2020-02-03 Конинклейке Филипс Н.В. Светоизлучающее устройство
DE102016103123A1 (de) * 2016-02-23 2017-08-24 Vishay Semiconductor Gmbh Optoelektronische Vorrichtung
CN109155258B (zh) 2016-04-08 2022-04-26 赫普塔冈微光有限公司 具有孔径的薄光电模块及其制造
DE102017100997A1 (de) 2017-01-19 2018-07-19 Osram Opto Semiconductors Gmbh Halbleiterlaser und Verfahren zur Herstellung eines solchen Halbleiterlasers
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JP2004063751A (ja) 2002-07-29 2004-02-26 Fuji Photo Film Co Ltd 固体撮像素子およびその製造方法

Also Published As

Publication number Publication date
CN1947254A (zh) 2007-04-11
DE602005026367D1 (de) 2011-03-31
US7457490B2 (en) 2008-11-25
EP1719178A2 (en) 2006-11-08
EP1719178B1 (en) 2011-02-16
WO2005083789A2 (en) 2005-09-09
JP4903685B2 (ja) 2012-03-28
CN1947254B (zh) 2010-12-29
EP1569276A1 (en) 2005-08-31
JP2007524243A (ja) 2007-08-23
TW200532761A (en) 2005-10-01
KR20070004774A (ko) 2007-01-09
WO2005083789A3 (en) 2006-05-11
ATE498910T1 (de) 2011-03-15
US20070009223A1 (en) 2007-01-11
TWI362058B (en) 2012-04-11

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