CN1947254A - 光电子器件上的微光学元件 - Google Patents
光电子器件上的微光学元件 Download PDFInfo
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- CN1947254A CN1947254A CNA2005800133746A CN200580013374A CN1947254A CN 1947254 A CN1947254 A CN 1947254A CN A2005800133746 A CNA2005800133746 A CN A2005800133746A CN 200580013374 A CN200580013374 A CN 200580013374A CN 1947254 A CN1947254 A CN 1947254A
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- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10K50/00—Organic light-emitting devices
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- H10K50/85—Arrangements for extracting light from the devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Optical Integrated Circuits (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Optical Measuring Cells (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Hybrid Cells (AREA)
- Micromachines (AREA)
Abstract
Description
Claims (28)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04405110A EP1569276A1 (en) | 2004-02-27 | 2004-02-27 | Micro-optics on optoelectronics |
EP04405110.0 | 2004-02-27 | ||
PCT/CH2005/000109 WO2005083789A2 (en) | 2004-02-27 | 2005-02-25 | Micro-optics on optoelectronics |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1947254A true CN1947254A (zh) | 2007-04-11 |
CN1947254B CN1947254B (zh) | 2010-12-29 |
Family
ID=34746192
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2005800133746A Active CN1947254B (zh) | 2004-02-27 | 2005-02-25 | 光电子器件上的微光学元件 |
Country Status (9)
Country | Link |
---|---|
US (1) | US7457490B2 (zh) |
EP (2) | EP1569276A1 (zh) |
JP (1) | JP4903685B2 (zh) |
KR (1) | KR101194452B1 (zh) |
CN (1) | CN1947254B (zh) |
AT (1) | ATE498910T1 (zh) |
DE (1) | DE602005026367D1 (zh) |
TW (1) | TWI362058B (zh) |
WO (1) | WO2005083789A2 (zh) |
Cited By (6)
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CN103579216A (zh) * | 2012-08-10 | 2014-02-12 | 矽格股份有限公司 | 光学元件封装模块 |
CN103959465A (zh) * | 2011-10-06 | 2014-07-30 | 新加坡恒立私人有限公司 | 用于物体的晶片级制造的方法以及相应的中间产品 |
CN104360571A (zh) * | 2010-02-02 | 2015-02-18 | 苹果公司 | 光学设备和成像系统 |
US9329080B2 (en) | 2012-02-15 | 2016-05-03 | Aplle Inc. | Modular optics for scanning engine having beam combining optics with a prism intercepted by both beam axis and collection axis |
US9746369B2 (en) | 2012-02-15 | 2017-08-29 | Apple Inc. | Integrated optoelectronic modules based on arrays of emitters and microlenses |
CN107210310A (zh) * | 2015-01-06 | 2017-09-26 | 胡夫·许尔斯贝克和福斯特有限及两合公司 | 用以照射用于车辆的传感器设备的光学设备 |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
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US6297548B1 (en) | 1998-06-30 | 2001-10-02 | Micron Technology, Inc. | Stackable ceramic FBGA for high thermal applications |
KR20080074186A (ko) * | 2005-11-22 | 2008-08-12 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 발광 모듈, 조명 장치, 및 적층 시트 요소 제조 방법 |
JP2007258672A (ja) * | 2006-02-22 | 2007-10-04 | Sharp Corp | 発光ダイオード及びその製造方法 |
JP4765663B2 (ja) * | 2006-02-23 | 2011-09-07 | パナソニック電工株式会社 | 赤外線通信用モジュールの製造方法 |
US7785915B2 (en) * | 2006-10-30 | 2010-08-31 | Aptina Imaging Corporation | Wafer level method of locating focal plane of imager devices |
US20080181558A1 (en) * | 2007-01-31 | 2008-07-31 | Hartwell Peter G | Electronic and optical circuit integration through wafer bonding |
US7754600B2 (en) | 2007-03-01 | 2010-07-13 | Hewlett-Packard Development Company, L.P. | Methods of forming nanostructures on metal-silicide crystallites, and resulting structures and devices |
US20090032925A1 (en) * | 2007-07-31 | 2009-02-05 | England Luke G | Packaging with a connection structure |
WO2009028391A1 (ja) | 2007-08-31 | 2009-03-05 | Konica Minolta Opto, Inc. | 成形方法、光学素子製造方法、及びアレイ状光学素子 |
EP2060493B1 (en) * | 2007-11-13 | 2010-06-23 | Oy M. Haloila Ab | Film delivery device and use of same |
TWI481496B (zh) | 2007-12-19 | 2015-04-21 | Heptagon Micro Optics Pte Ltd | 製造光學元件的方法 |
TWI478808B (zh) | 2007-12-19 | 2015-04-01 | Heptagon Micro Optics Pte Ltd | 製造光學元件的方法 |
SG142321A1 (en) | 2008-04-24 | 2009-11-26 | Micron Technology Inc | Pre-encapsulated cavity interposer |
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US7920342B2 (en) * | 2008-07-01 | 2011-04-05 | Aptina Imaging Corporation | Over-molded glass lenses and method of forming the same |
CN102077121B (zh) | 2008-07-04 | 2013-10-23 | 柯尼卡美能达精密光学株式会社 | 摄像镜头、其制造方法以及摄像单元 |
CN101364568B (zh) * | 2008-07-10 | 2011-11-30 | 旭丽电子(广州)有限公司 | 镜头模块的制造方法及以该方法所制成的镜头模块 |
TWI419557B (zh) * | 2008-07-11 | 2013-12-11 | Lite On Electronics Guangzhou | 鏡頭模組、其製作方法及形成多個鏡頭模組的晶圓結構 |
US8828174B2 (en) | 2008-08-20 | 2014-09-09 | Heptagon Micro Optics Pte. Ltd. | Method of manufacturing a plurality of optical devices |
JP5715747B2 (ja) * | 2008-09-30 | 2015-05-13 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 回路装置およびその製造方法 |
WO2011156926A1 (en) | 2010-06-14 | 2011-12-22 | Heptagon Oy | Method of manufacturing a plurality of optical devices |
WO2013010284A2 (en) | 2011-07-19 | 2013-01-24 | Heptagon Micro Optics Pte. Ltd. | Opto-electronic modules and methods of manufacturing the same and appliances and devices comprising the same |
WO2013010285A1 (en) | 2011-07-19 | 2013-01-24 | Heptagon Micro Optics Pte. Ltd. | Method for manufacturing passive optical components, and devices comprising the same |
KR101890457B1 (ko) * | 2011-08-10 | 2018-08-21 | 헵타곤 마이크로 옵틱스 피티이. 리미티드 | 광전자 모듈 및 그것을 제조하기 위한 방법 |
DE102011113483B4 (de) * | 2011-09-13 | 2023-10-19 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zum Herstellen einer Mehrzahl von optoelektronischen Bauelementen und optoelektronisches Bauelement |
KR102177372B1 (ko) * | 2011-12-22 | 2020-11-12 | 헵타곤 마이크로 옵틱스 피티이. 리미티드 | 광전자 모듈, 특히 플래시 모듈, 및 그것을 제조하기 위한 방법 |
TW201417250A (zh) * | 2012-07-17 | 2014-05-01 | 海特根微光學公司 | 光學模組,特別是光電模組,及其製造方法 |
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2005
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- 2005-02-25 CN CN2005800133746A patent/CN1947254B/zh active Active
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- 2005-02-25 AT AT05706528T patent/ATE498910T1/de not_active IP Right Cessation
- 2005-02-25 JP JP2007500029A patent/JP4903685B2/ja active Active
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CN104360571A (zh) * | 2010-02-02 | 2015-02-18 | 苹果公司 | 光学设备和成像系统 |
CN104360571B (zh) * | 2010-02-02 | 2016-05-11 | 苹果公司 | 光学设备和成像系统 |
CN103959465A (zh) * | 2011-10-06 | 2014-07-30 | 新加坡恒立私人有限公司 | 用于物体的晶片级制造的方法以及相应的中间产品 |
CN103959465B (zh) * | 2011-10-06 | 2019-06-07 | 新加坡恒立私人有限公司 | 用于物体的晶片级制造的方法以及相应的中间产品 |
US9329080B2 (en) | 2012-02-15 | 2016-05-03 | Aplle Inc. | Modular optics for scanning engine having beam combining optics with a prism intercepted by both beam axis and collection axis |
US9746369B2 (en) | 2012-02-15 | 2017-08-29 | Apple Inc. | Integrated optoelectronic modules based on arrays of emitters and microlenses |
CN103579216A (zh) * | 2012-08-10 | 2014-02-12 | 矽格股份有限公司 | 光学元件封装模块 |
CN107210310A (zh) * | 2015-01-06 | 2017-09-26 | 胡夫·许尔斯贝克和福斯特有限及两合公司 | 用以照射用于车辆的传感器设备的光学设备 |
US10692912B2 (en) | 2015-01-06 | 2020-06-23 | Huf Hülsbeck & Fürst Gmbh & Co. Kg | Optical device for exposure of a sensor device for a vehicle |
Also Published As
Publication number | Publication date |
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EP1569276A1 (en) | 2005-08-31 |
TWI362058B (en) | 2012-04-11 |
TW200532761A (en) | 2005-10-01 |
WO2005083789A3 (en) | 2006-05-11 |
CN1947254B (zh) | 2010-12-29 |
KR101194452B1 (ko) | 2012-10-24 |
DE602005026367D1 (de) | 2011-03-31 |
ATE498910T1 (de) | 2011-03-15 |
EP1719178B1 (en) | 2011-02-16 |
EP1719178A2 (en) | 2006-11-08 |
US7457490B2 (en) | 2008-11-25 |
JP2007524243A (ja) | 2007-08-23 |
KR20070004774A (ko) | 2007-01-09 |
US20070009223A1 (en) | 2007-01-11 |
JP4903685B2 (ja) | 2012-03-28 |
WO2005083789A2 (en) | 2005-09-09 |
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