CN100541947C - 具有集成透镜的垂直腔表面发射激光器 - Google Patents
具有集成透镜的垂直腔表面发射激光器 Download PDFInfo
- Publication number
- CN100541947C CN100541947C CNB2005100516001A CN200510051600A CN100541947C CN 100541947 C CN100541947 C CN 100541947C CN B2005100516001 A CNB2005100516001 A CN B2005100516001A CN 200510051600 A CN200510051600 A CN 200510051600A CN 100541947 C CN100541947 C CN 100541947C
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- Prior art keywords
- lens
- optical device
- convex structure
- laser optical
- laser
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/42—Arrays of surface emitting lasers
- H01S5/423—Arrays of surface emitting lasers having a vertical cavity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18386—Details of the emission surface for influencing the near- or far-field, e.g. a grating on the surface
- H01S5/18388—Lenses
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Lens Barrels (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
Description
Claims (48)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/794,252 US7223619B2 (en) | 2004-03-05 | 2004-03-05 | VCSEL with integrated lens |
US10/794,252 | 2004-03-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1722553A CN1722553A (zh) | 2006-01-18 |
CN100541947C true CN100541947C (zh) | 2009-09-16 |
Family
ID=34912223
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100516001A Expired - Fee Related CN100541947C (zh) | 2004-03-05 | 2005-03-07 | 具有集成透镜的垂直腔表面发射激光器 |
Country Status (4)
Country | Link |
---|---|
US (2) | US7223619B2 (zh) |
JP (1) | JP2005252257A (zh) |
CN (1) | CN100541947C (zh) |
DE (1) | DE102004063569B4 (zh) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7460578B2 (en) * | 2005-04-11 | 2008-12-02 | Finisar Corporation | On-chip lenses for diverting vertical cavity surface emitting laser beams |
JP2007101789A (ja) * | 2005-10-03 | 2007-04-19 | Seiko Epson Corp | 光伝送モジュール、光伝送モジュールの製造方法、光伝送装置および電子機器 |
WO2007044436A2 (en) * | 2005-10-05 | 2007-04-19 | Massachusetts Institute Of Technology | Ultra-high-q surface-tension-induced monolithically integrated on-chip resonator and associated devices |
US20070115617A1 (en) | 2005-11-22 | 2007-05-24 | Nlight Photonics Corporation | Modular assembly utilizing laser diode subassemblies with winged mounting blocks |
JP2009192873A (ja) * | 2008-02-15 | 2009-08-27 | Seiko Epson Corp | 光源装置、画像表示装置及びモニタ装置 |
US20090284837A1 (en) * | 2008-05-13 | 2009-11-19 | Micron Technology, Inc. | Method and apparatus providing uniform separation of lens wafer and structure bonded thereto |
US7920329B2 (en) * | 2008-06-20 | 2011-04-05 | Aptina Imaging Corporation | Embedded lens for achromatic wafer-level optical module and methods of forming the same |
US8080460B2 (en) * | 2008-11-26 | 2011-12-20 | Micron Technology, Inc. | Methods of forming diodes |
JP2012529069A (ja) * | 2009-06-02 | 2012-11-15 | フラウンホーファー−ゲゼルシャフト・ツール・フェルデルング・デル・アンゲヴァンテン・フォルシュング・アインゲトラーゲネル・フェライン | レンズ及びその製造方法 |
WO2010139343A1 (en) | 2009-06-02 | 2010-12-09 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Lens and method for manufacturing same |
US8260097B2 (en) | 2010-06-16 | 2012-09-04 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd | Opto-electronic alignment system and method |
US8989530B2 (en) * | 2010-07-22 | 2015-03-24 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Optoelectronic modules and submount for same and a method for manufacturing an array of optical devices |
US8437085B1 (en) | 2011-09-23 | 2013-05-07 | Applied Micro Circuits Corporation | Optical element assembly with integrally formed microlens |
US20130272018A1 (en) * | 2011-11-29 | 2013-10-17 | Vladimir Khubiryants | Light Source Including a Ball Lens for Use With a Scope |
US9324667B2 (en) * | 2012-01-13 | 2016-04-26 | Freescale Semiconductor, Inc. | Semiconductor devices with compliant interconnects |
US9563028B2 (en) | 2013-01-31 | 2017-02-07 | Ccs Technology, Inc. | Method to manufacture an optoelectronic assembly |
US9547231B2 (en) | 2013-06-12 | 2017-01-17 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Device and method for making photomask assembly and photodetector device having light-collecting optical microstructure |
US9008139B2 (en) | 2013-06-28 | 2015-04-14 | Jds Uniphase Corporation | Structure and method for edge-emitting diode package having deflectors and diffusers |
KR102282827B1 (ko) * | 2014-07-23 | 2021-07-28 | 에이엠에스 센서스 싱가포르 피티이. 리미티드. | 수직 정렬 피처들을 포함하는 광 방출기 및 광 검출기 모듈들 |
TWI762532B (zh) * | 2016-12-01 | 2022-05-01 | 新加坡商海特根微光學公司 | 光電模組和光電成形模具及用於製造該光電模組及該光電成形模具的製程 |
DE102017100997A1 (de) | 2017-01-19 | 2018-07-19 | Osram Opto Semiconductors Gmbh | Halbleiterlaser und Verfahren zur Herstellung eines solchen Halbleiterlasers |
DE102017112235A1 (de) | 2017-06-02 | 2018-12-06 | Osram Opto Semiconductors Gmbh | Laserdiode und Verfahren zum Herstellen einer Laserdiode |
KR102612511B1 (ko) * | 2019-09-18 | 2023-12-08 | 에이엠에스-오스람 인터내셔널 게엠베하 | 접촉 엘리먼트를 포함하는 광전자 반도체 칩 및 광전자 반도체 칩을 제조하는 방법 |
US11551963B2 (en) * | 2020-02-14 | 2023-01-10 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and method of manufacturing the same |
WO2022020257A1 (en) * | 2020-07-20 | 2022-01-27 | Apple Inc. | Photonic integrated circuits with controlled collapse chip connections |
US20230106189A1 (en) * | 2021-10-01 | 2023-04-06 | Lawrence Livermore National Security, Llc | Patterning of diode/substrate interface to reduce thermal lensing |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4501637A (en) * | 1981-06-12 | 1985-02-26 | Motorola, Inc. | LED having self-aligned lens |
US4616899A (en) | 1984-08-31 | 1986-10-14 | Gte Laboratories Incorporated | Methods of and apparatus for coupling an optoelectronic component to an optical fiber |
DE3532821A1 (de) | 1985-09-13 | 1987-03-26 | Siemens Ag | Leuchtdiode (led) mit sphaerischer linse |
JP3277573B2 (ja) * | 1992-10-30 | 2002-04-22 | 住友電気工業株式会社 | 半導体レーザモジュール |
US5311611A (en) | 1993-05-04 | 1994-05-10 | Ail Systems, Inc. | Imaging ball lens optically immersed with a fiber optic faceplate |
US5500540A (en) * | 1994-04-15 | 1996-03-19 | Photonics Research Incorporated | Wafer scale optoelectronic package |
US5940564A (en) * | 1997-08-05 | 1999-08-17 | Picolight, Inc. | Device for coupling a light source or receiver to an optical waveguide |
KR100276968B1 (ko) | 1998-07-11 | 2001-01-15 | 윤덕용 | 정렬 허용공차를 확대시킬 수 있는 광 연결구조 |
US6670105B2 (en) | 1998-09-18 | 2003-12-30 | Canon Kabushiki Kaisha | Method of manufacturing diffractive optical element |
US6243508B1 (en) | 1999-06-01 | 2001-06-05 | Picolight Incorporated | Electro-opto-mechanical assembly for coupling a light source or receiver to an optical waveguide |
JP2001156396A (ja) * | 1999-11-24 | 2001-06-08 | Seiko Epson Corp | 面発光レーザおよびその製造方法 |
US6658040B1 (en) | 2000-07-28 | 2003-12-02 | Agilent Technologies, Inc. | High speed VCSEL |
US6759687B1 (en) * | 2000-10-13 | 2004-07-06 | Agilent Technologies, Inc. | Aligning an optical device system with an optical lens system |
AUPR245601A0 (en) * | 2001-01-10 | 2001-02-01 | Silverbrook Research Pty Ltd | An apparatus (WSM09) |
US6661951B1 (en) | 2001-03-12 | 2003-12-09 | Thomas H. Blair | Optoelectric alignment apparatus |
JP3956647B2 (ja) | 2001-05-25 | 2007-08-08 | セイコーエプソン株式会社 | 面発光レ−ザの製造方法 |
JP4537664B2 (ja) * | 2002-04-17 | 2010-09-01 | 株式会社リコー | 光路偏向素子、光路偏向装置、画像表示装置、光書込み装置、光インターコネクション装置、光学素子及びその製造方法 |
GB0209016D0 (en) * | 2002-04-19 | 2002-05-29 | Zarlink Semiconductor Ab | Optical transducer with farfield modifier |
JP2003322770A (ja) * | 2002-05-07 | 2003-11-14 | Matsushita Electric Ind Co Ltd | 光送受信モジュール及びその実装方法 |
US7202941B2 (en) * | 2002-11-26 | 2007-04-10 | Munro James F | Apparatus for high accuracy distance and velocity measurement and methods thereof |
US6953990B2 (en) * | 2003-09-19 | 2005-10-11 | Agilent Technologies, Inc. | Wafer-level packaging of optoelectronic devices |
US6998691B2 (en) * | 2003-09-19 | 2006-02-14 | Agilent Technologies, Inc. | Optoelectronic device packaging with hermetically sealed cavity and integrated optical element |
US6900509B2 (en) * | 2003-09-19 | 2005-05-31 | Agilent Technologies, Inc. | Optical receiver package |
US6982437B2 (en) * | 2003-09-19 | 2006-01-03 | Agilent Technologies, Inc. | Surface emitting laser package having integrated optical element and alignment post |
US7027694B2 (en) * | 2003-11-20 | 2006-04-11 | Agilent Technologies, Inc. | Alignment assembly and method for an optics module |
US7455462B2 (en) * | 2004-08-20 | 2008-11-25 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Zone two fiber optic cable |
-
2004
- 2004-03-05 US US10/794,252 patent/US7223619B2/en active Active
- 2004-12-30 DE DE102004063569A patent/DE102004063569B4/de not_active Expired - Fee Related
-
2005
- 2005-03-01 JP JP2005056506A patent/JP2005252257A/ja active Pending
- 2005-03-07 CN CNB2005100516001A patent/CN100541947C/zh not_active Expired - Fee Related
-
2007
- 2007-03-09 US US11/684,375 patent/US7535949B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7535949B2 (en) | 2009-05-19 |
US7223619B2 (en) | 2007-05-29 |
DE102004063569A1 (de) | 2005-09-29 |
CN1722553A (zh) | 2006-01-18 |
JP2005252257A (ja) | 2005-09-15 |
DE102004063569B4 (de) | 2010-11-11 |
US20050195882A1 (en) | 2005-09-08 |
US20070147460A1 (en) | 2007-06-28 |
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