CN1947254B - 光电子器件上的微光学元件 - Google Patents

光电子器件上的微光学元件 Download PDF

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Publication number
CN1947254B
CN1947254B CN2005800133746A CN200580013374A CN1947254B CN 1947254 B CN1947254 B CN 1947254B CN 2005800133746 A CN2005800133746 A CN 2005800133746A CN 200580013374 A CN200580013374 A CN 200580013374A CN 1947254 B CN1947254 B CN 1947254B
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CN
China
Prior art keywords
optical
layer
wafer
replication
optoelectronic
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Expired - Lifetime
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CN2005800133746A
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English (en)
Chinese (zh)
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CN1947254A (zh
Inventor
H·鲁德曼
M·罗西
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Ams Sensors Singapore Pte Ltd
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Heptagon Oy
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/026—Wafer-level processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Optical Integrated Circuits (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Hybrid Cells (AREA)
  • Optical Measuring Cells (AREA)
CN2005800133746A 2004-02-27 2005-02-25 光电子器件上的微光学元件 Expired - Lifetime CN1947254B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP04405110.0 2004-02-27
EP04405110A EP1569276A1 (en) 2004-02-27 2004-02-27 Micro-optics on optoelectronics
PCT/CH2005/000109 WO2005083789A2 (en) 2004-02-27 2005-02-25 Micro-optics on optoelectronics

Publications (2)

Publication Number Publication Date
CN1947254A CN1947254A (zh) 2007-04-11
CN1947254B true CN1947254B (zh) 2010-12-29

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2005800133746A Expired - Lifetime CN1947254B (zh) 2004-02-27 2005-02-25 光电子器件上的微光学元件

Country Status (9)

Country Link
US (1) US7457490B2 (https=)
EP (2) EP1569276A1 (https=)
JP (1) JP4903685B2 (https=)
KR (1) KR101194452B1 (https=)
CN (1) CN1947254B (https=)
AT (1) ATE498910T1 (https=)
DE (1) DE602005026367D1 (https=)
TW (1) TWI362058B (https=)
WO (1) WO2005083789A2 (https=)

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TWI478808B (zh) 2007-12-19 2015-04-01 Heptagon Micro Optics Pte Ltd 製造光學元件的方法
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WO2011156926A1 (en) 2010-06-14 2011-12-22 Heptagon Oy Method of manufacturing a plurality of optical devices
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CN103959465B (zh) * 2011-10-06 2019-06-07 新加坡恒立私人有限公司 用于物体的晶片级制造的方法以及相应的中间产品
CN104106135B (zh) * 2011-12-22 2018-02-23 新加坡恒立私人有限公司 光电模块、尤其是闪光灯模块及其制造方法
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TWI707483B (zh) 2012-07-17 2020-10-11 新加坡商新加坡恒立私人有限公司 發射可變強度分布的光線的光電模組
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US10403671B2 (en) * 2013-12-10 2019-09-03 Ams Sensors Singapore Pte. Ltd. Wafer-level optical modules and methods for manufacturing the same
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DE102016103123A1 (de) * 2016-02-23 2017-08-24 Vishay Semiconductor Gmbh Optoelektronische Vorrichtung
CN109155258B (zh) 2016-04-08 2022-04-26 赫普塔冈微光有限公司 具有孔径的薄光电模块及其制造
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Also Published As

Publication number Publication date
CN1947254A (zh) 2007-04-11
DE602005026367D1 (de) 2011-03-31
US7457490B2 (en) 2008-11-25
EP1719178A2 (en) 2006-11-08
EP1719178B1 (en) 2011-02-16
WO2005083789A2 (en) 2005-09-09
JP4903685B2 (ja) 2012-03-28
EP1569276A1 (en) 2005-08-31
JP2007524243A (ja) 2007-08-23
TW200532761A (en) 2005-10-01
KR20070004774A (ko) 2007-01-09
WO2005083789A3 (en) 2006-05-11
ATE498910T1 (de) 2011-03-15
KR101194452B1 (ko) 2012-10-24
US20070009223A1 (en) 2007-01-11
TWI362058B (en) 2012-04-11

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