KR101167384B1 - 반도체 구성요소를 구비한 반도체 장치 및 그 제조 방법 - Google Patents

반도체 구성요소를 구비한 반도체 장치 및 그 제조 방법 Download PDF

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Publication number
KR101167384B1
KR101167384B1 KR1020107003112A KR20107003112A KR101167384B1 KR 101167384 B1 KR101167384 B1 KR 101167384B1 KR 1020107003112 A KR1020107003112 A KR 1020107003112A KR 20107003112 A KR20107003112 A KR 20107003112A KR 101167384 B1 KR101167384 B1 KR 101167384B1
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layer
lower layer
insulating
insulating film
semiconductor
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Korean (ko)
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KR20100038232A (ko
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히로야스 죠벳토
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가부시키가이샤 테라미크로스
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H10W70/614—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together the multiple chips being integrally enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7424—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used as a support during the manufacture of self-supporting substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/743—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9413—Dispositions of bond pads on encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/142—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations exposing the passive side of the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/288—Configurations of stacked chips characterised by arrangements for thermal management of the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020107003112A 2007-08-24 2008-08-21 반도체 구성요소를 구비한 반도체 장치 및 그 제조 방법 Expired - Fee Related KR101167384B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2007-217876 2007-08-24
JP2007217876A JP4752825B2 (ja) 2007-08-24 2007-08-24 半導体装置の製造方法
PCT/JP2008/065348 WO2009028578A2 (en) 2007-08-24 2008-08-21 Semiconductor device including semiconductor constituent and manufacturing method thereof

Publications (2)

Publication Number Publication Date
KR20100038232A KR20100038232A (ko) 2010-04-13
KR101167384B1 true KR101167384B1 (ko) 2012-07-19

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KR1020107003112A Expired - Fee Related KR101167384B1 (ko) 2007-08-24 2008-08-21 반도체 구성요소를 구비한 반도체 장치 및 그 제조 방법

Country Status (6)

Country Link
US (2) US7727862B2 (enExample)
JP (1) JP4752825B2 (enExample)
KR (1) KR101167384B1 (enExample)
CN (1) CN101785106B (enExample)
TW (1) TW200917395A (enExample)
WO (1) WO2009028578A2 (enExample)

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EP2244288A4 (en) * 2008-02-14 2011-11-02 Mitsubishi Heavy Ind Ltd SEMICONDUCTOR ELEMENT MODULE AND METHOD FOR THE PRODUCTION THEREOF
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US8535989B2 (en) 2010-04-02 2013-09-17 Intel Corporation Embedded semiconductive chips in reconstituted wafers, and systems containing same
US9570376B2 (en) 2010-06-29 2017-02-14 General Electric Company Electrical interconnect for an integrated circuit package and method of making same
US8653670B2 (en) * 2010-06-29 2014-02-18 General Electric Company Electrical interconnect for an integrated circuit package and method of making same
US8937382B2 (en) 2011-06-27 2015-01-20 Intel Corporation Secondary device integration into coreless microelectronic device packages
US8848380B2 (en) 2011-06-30 2014-09-30 Intel Corporation Bumpless build-up layer package warpage reduction
US9257368B2 (en) 2012-05-14 2016-02-09 Intel Corporation Microelectric package utilizing multiple bumpless build-up structures and through-silicon vias
DE112012006469B4 (de) 2012-06-08 2022-05-05 Intel Corporation Mikroelektronisches Gehäuse mit nicht komplanaren gekapselten mikroelektronischen Bauelementen und einer Aufbauschicht ohne Kontaktierhügel
US8853058B2 (en) * 2012-06-22 2014-10-07 Freescale Semiconductor, Inc. Method of making surface mount stacked semiconductor devices
CN103889168A (zh) * 2012-12-21 2014-06-25 宏启胜精密电子(秦皇岛)有限公司 承载电路板、承载电路板的制作方法及封装结构
US8836094B1 (en) * 2013-03-14 2014-09-16 Taiwan Semiconductor Manufacturing Company, Ltd. Package device including an opening in a flexible substrate and methods of forming the same
JP6695066B2 (ja) * 2014-11-27 2020-05-20 ツーハイ アクセス セミコンダクター カンパニー リミテッド フレームがコンデンサと直列に少なくとも１個のビアを備えるようなチップ用のポリマーフレーム
US10276467B2 (en) 2016-03-25 2019-04-30 Samsung Electro-Mechanics Co., Ltd. Fan-out semiconductor package
US10068855B2 (en) * 2016-09-12 2018-09-04 Samsung Electro-Mechanics Co., Ltd. Semiconductor package, method of manufacturing the same, and electronic device module
WO2018096830A1 (ja) * 2016-11-28 2018-05-31 株式会社村田製作所 電子部品及びその製造方法
CN110050338B (zh) 2016-12-07 2023-02-28 株式会社村田制作所 电子部件及其制造方法
CN110036472A (zh) * 2016-12-08 2019-07-19 日立化成株式会社 半导体装置的制造方法
KR102540829B1 (ko) * 2018-10-05 2023-06-08 삼성전자주식회사 반도체 패키지, 반도체 패키지 제조방법 및 재배선 구조체 제조방법
KR102568705B1 (ko) * 2018-10-05 2023-08-22 삼성전자주식회사 반도체 패키지, 반도체 패키지 제조방법 및 재배선 구조체 제조방법
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Also Published As

Publication number Publication date
US8063490B2 (en) 2011-11-22
CN101785106A (zh) 2010-07-21
US20100193938A1 (en) 2010-08-05
TW200917395A (en) 2009-04-16
TWI378519B (enExample) 2012-12-01
JP4752825B2 (ja) 2011-08-17
WO2009028578A8 (en) 2009-11-26
JP2009054666A (ja) 2009-03-12
US7727862B2 (en) 2010-06-01
WO2009028578A2 (en) 2009-03-05
CN101785106B (zh) 2012-05-30
KR20100038232A (ko) 2010-04-13
US20090051038A1 (en) 2009-02-26
WO2009028578A3 (en) 2009-05-14

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