CN113555326A - 可润湿侧面的封装结构与其制作方法及垂直封装模块 - Google Patents
可润湿侧面的封装结构与其制作方法及垂直封装模块 Download PDFInfo
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- CN113555326A CN113555326A CN202110618463.4A CN202110618463A CN113555326A CN 113555326 A CN113555326 A CN 113555326A CN 202110618463 A CN202110618463 A CN 202110618463A CN 113555326 A CN113555326 A CN 113555326A
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Abstract
本发明公开了一种可润湿侧面的封装结构与其制作方法及垂直封装模块,封装结构包括第一介质层、芯片和线路层,第一介质层设置有封装腔,第一介质层的侧壁且位于封装腔的外侧设置有侧壁焊盘,芯片封装于封装腔内,且芯片的引脚朝向第一介质层的第一面,线路层设置在第一介质层的第一面,线路层直接或间接连接于侧壁焊盘和芯片的引脚。与现有的封装结构相比,本发明实施例通过芯片引脚引出线路层,取消键合引线或金属凸点,缩小封装体积和缩短电信号的传导距离,有利于实现封装结构的小型化,以及优化电信号传导的损耗和延时,且可以通过侧边自动光学检测焊锡性能,提高产品的可靠性。
Description
技术领域
本发明涉及半导体封装技术领域,特别涉及一种可润湿侧面的封装结构与其制作方法及垂直封装模块。
背景技术
在半导体封装技术中,无论是基于金属凸块(Bump,又称为凸点)的凸点倒装封装技术,还是基于引脚的贴装和插装、引线键合等封装技术,都需要通过在芯片上布置金属凸点或引线来作为与引线框架或IC基板相连的电性连接点。电信号在传导过程中会因为传输距离加长、引线间存在寄生电感而导致出现高损耗和高延迟,而且会使封装尺寸无法小型化。
BGA或者LGA封装技术是半导体封装技术中常见的封装技术,该技术主要在于它用金属触点式封装取代了以往的针状插脚,然而,一般很难从产品外观来直接判断其焊锡点,尤其是底部的焊锡点的性能是否良好,进而影响封装产品在应用时的可靠性和稳定性。
随着I/O数目的增加,引线键合的封装方式已无法满足封装需求,面积一定的封装结构同样限制了基板上锡球的数目的增加,目前解决这种问题是通过在芯片上布置再分布线路层,用以增大间距来制造新的电接触件,进而形成BGA或LGA的封装体,但是这样会导致产品良率的降低以及封装成本的增加。而且,由于封装体的焊盘位于封装体的底部,器件只能通过表面贴装的方式安装在印刷垂直封装模块上,器件散热需要通过电路向下传导或从器件背面主动散热,无法应用于侧面垂直装配的场景而不能满足特定半导体特殊器件的多方向的收发功能需求。
发明内容
本发明旨在至少解决现有技术中存在的技术问题之一。为此,本发明提出一种可润湿侧面的封装结构与其制作方法及垂直封装模块,具有可焊锡浸润的侧壁焊盘,能够通过芯片引脚引出线路层,取消键合引线或金属凸点,缩小封装体积和缩短电信号的传导距离。
第一方面,根据本发明实施例的可润湿侧面的封装结构,包括第一介质层,设置有封装腔,所述第一介质层的侧壁且位于所述封装腔的外侧设置有第一侧壁焊盘;芯片,封装于所述封装腔内,且所述芯片的有源面的引脚朝向所述第一介质层的第一面;线路层,设置在所述第一介质层的第一面,所述线路层直接或间接连接于所述第一侧壁焊盘和所述芯片的有源面上的引脚。
根据本发明实施例的封装结构,至少具有如下有益效果:
与现有的封装结构相比,本发明实施例设置有可润湿焊锡的第一侧壁焊盘,并通过芯片引脚引出线路层,取消键合引线或金属凸点,缩小封装体积和缩短电信号的传导距离,有利于实现封装结构的小型化,以及优化电信号传导的损耗和延时。当第一侧壁焊盘进行焊锡浸润时,可以通过自动光学检测设备检查第一侧壁焊盘的焊锡浸润情况,从而判断焊锡的品质状况,进而得出芯片焊锡性能的有效性判断,有利于提高相关电子产品装配后的可靠性,可以满足车规级的要求。
根据本发明的一些实施例,所述线路层直接与所述第一侧壁焊盘连接或者通过第二导电通孔柱与所述第一侧壁焊盘连接,所述线路层还直接与所述芯片的有源面上的引脚连接或者通过第一导电通孔柱与所述芯片的有源面上的引脚连接。
根据本发明的一些实施例,所述线路层的数量为多层,相邻两层所述线路层之间通过第三导电通孔柱连接。
根据本发明的一些实施例,所述第一介质层的第二面设置有散热层,所述散热层与所述芯片的散热面直接连接或通过第一导热通孔柱与所述芯片的散热面连接。
根据本发明的一些实施例,所述线路层设置有底部焊盘,所述第一侧壁焊盘和所述底部焊盘中的至少之一植有锡球。
根据本发明的一些实施例,所述芯片的有源面上设置有功能区,所述功能区露出所述第一介质层。
根据本发明的一些实施例,所述芯片的有源面上设置有透明色的第二表面保护层。
根据本发明的一些实施例,所述芯片的有源面上设置有非透明色的第二表面保护层,所述第二表面保护层上设置有与所述功能区对应的开窗位。
第二方面,根据本发明实施例的封装结构的制作方法,包括:
提供一介质框架,所述介质框架上设置有至少一个封装腔,所述介质框架上且位于所述封装腔的外侧设置有第一金属柱,所述第一金属柱的两个端面分别暴露于所述介质框架的相对两面;
将待封装的芯片封装在所述封装腔内,以获得第一半成品,其中,所述芯片的有源面上的引脚朝向所述第一半成品的第一面;
在所述第一半成品的第一面制作线路层,以获得第二半成品,其中,所述线路层直接或间接连接于所述第一金属柱和所述芯片的有源面上的引脚;
对所述第二半成品进行切割,以获得具有第一侧壁焊盘的封装单元,其中,至少一条切割路径经过所述第一金属柱。
根据本发明实施例的封装结构的制作方法,至少具有如下有益效果:
通过本发明实施例的封装结构的制作方法,可以获得一种封装结构,与现有的封装结构相比,本发明实施例制作出可润湿焊锡的第一侧壁焊盘,并通过芯片引脚引出线路层,取消键合引线或金属凸点,缩小封装体积和缩短电信号的传导距离,有利于实现封装结构的小型化,以及优化电信号传导的损耗和延时。当第一侧壁焊盘进行焊锡浸润时,可以通过自动光学检测设备检查第一侧壁焊盘的焊锡浸润情况,从而判断焊锡的品质状况,进而得出芯片焊锡性能的有效性判断,有利于提高相关电子产品装配后的可靠性,可以满足车规级的要求。
根据本发明的一些实施例,在所述第一半成品的第一面制作线路层,包括步骤:
当所述芯片的有源面上的引脚朝向且暴露于所述第一半成品的第一面时,在所述第一半成品的第一面制作所述线路层,以获得所述第二半成品,其中,所述线路层与所述芯片的有源面上的引脚直接连接。
根据本发明的一些实施例,在所述第一半成品的第一面制作线路层,包括步骤:
当所述芯片的有源面上的引脚朝向所述第一半成品的第一面且埋藏于所述第一半成品内时,在所述第一半成品的第一面开设第一导通孔,所述第一导通孔连通于所述芯片的有源面上的引脚;
通过电镀的方式在所述第一导通孔内加工出第一导电通孔柱,其中,所述第一导电通孔柱的第一端与所述芯片的有源面上的引脚连接,所述第一导电通孔柱的第二端暴露于所述第一半成品的第一面;
在所述第一半成品的第一面制作所述线路层,以获得所述第二半成品,其中,所述线路层与所述第一导电通孔柱连接,并通过所述第一导电通孔柱与所述芯片的有源面上的引脚连接。
根据本发明的一些实施例,所述线路层的数量为多层,相邻两层所述线路层之间通过第三导电通孔柱连接,最外层的所述线路层通过第四导电通孔柱与所述第一金属柱连接。
根据本发明的一些实施例,在所述第一半成品的第一面制作线路层,包括步骤:
当所述芯片的有源面上的引脚朝向所述第一半成品的第一面且所述芯片的散热面埋藏于所述第一半成品内时,在所述第一半成品的第二面开设第二导通孔,所述第二导通孔连通于所述芯片的散热面;
通过电镀的方式在所述第二导通孔内加工出第一导热通孔柱,其中,所述第一导热通孔柱的第一端与所述芯片的散热面连接,所述第一导热通孔柱的第二端暴露于所述第一半成品的第二面;
在所述第一半成品的第一面制作所述线路层,在所述第一半成品的第二面制作散热层,以获得所述第二半成品,其中,所述散热层与所述第一导热通孔柱连接。
根据本发明的一些实施例,在所述第一半成品的第一面制作线路层,包括步骤:
当所述芯片的有源面上的引脚朝向所述第一半成品的第一面且所述芯片的散热面暴露于所述第一半成品的第二面时,在所述第一半成品的第一面制作所述线路层,在所述第一半成品的第二面制作散热层,以获得所述第二半成品,其中,所述散热层与所述芯片的散热面直接连接。
根据本发明的一些实施例,所述芯片的有源面设置有功能区,将待封装的芯片封装在所述封装腔内,包括步骤:
在所述封装腔的底部提供一临时承载面;
将所述芯片贴装在所述封装腔内,且所述芯片的有源面贴装在所述临时承载面上;
采用封装材料对所述芯片进行封装;
去除所述临时承载面,以露出所述芯片的有源面上的功能区。
根据本发明的一些实施例,对所述第二半成品进行切割,之后还包括步骤:
在所述芯片的有源面上加工透明色的第二表面保护层。
根据本发明的一些实施例,对所述第二半成品进行切割,之后还包括步骤:
在所述芯片的有源面上加工非透明色的第二表面保护层;
在所述第二表面保护层上且对应于所述功能区的位置开窗。
第三方面,根据本发明实施例的封装结构,通过第二方面所述的封装结构的制作方法获得。
第四方面,根据本发明实施例的垂直封装模块,包括第一方面所述的封装结构,或者,包括第三方面所述的封装结构。
第五方面,根据本发明实施例的垂直封装模块,包括:印刷线路板;封装单元,设置有第二侧壁焊盘,并通过所述第二侧壁焊盘焊接在所述印刷线路板上,所述封装单元的第一面垂直于所述印刷线路板;具有功能区域的封装器件,封装在所述封装单元内且与所述第二侧壁焊盘电性连接,所述封装器件的功能区域朝向所述封装单元的第一面。
根据本发明实施例的垂直封装模块,至少具有如下有益效果:
本发明通过在封装单元上设置第二侧壁焊盘,将平面的表面贴装方式改为垂直贴装方式,缩小贴装面积,有利于垂直封装模块的小型化和高密度化,而且垂直贴装的方式,可以使封装器件对光、电磁波、红外线等信号的发射、传导、接收或探测方向从单一方向变成多个可选方向,有利于实现信号收发等相关功能,还有利于降低垂直封装模块的设计难度,以及降低垂直装配的工艺难度,并提高板级装配的可靠性。
根据本发明的一些实施例,所述印刷线路板的表面或侧边设置有凹位,所述凹位内设置有第一焊盘,所述第二侧壁焊盘与所述第一焊盘焊接连接。
根据本发明的一些实施例,所述印刷线路板的上表面或下表面设置有凸起部。
根据本发明的一些实施例,所述凸起部上设置有第二焊盘,所述封装单元还设置有底部焊盘,所述底部焊盘与所述第二焊盘焊接连接。
本发明的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本发明的实践了解到。
附图说明
本发明的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解,其中:
图1为本发明实施例的封装结构的结构示意图之一;
图2为图1示出的封装结构的仰视示意图;
图3为本发明实施例的封装结构的结构示意图之二;
图4为本发明实施例的封装结构的结构示意图之三;
图5为本发明实施例的封装结构的结构示意图之四;
图6为本发明实施例的封装结构的结构示意图之五;
图7为本发明实施例的封装结构的结构示意图之六;
图8a为本发明实施例的封装结构的结构示意图之七;
图8b为本发明实施例的封装结构的结构示意图之八;
图8c为本发明实施例的封装结构的结构示意图之九;
图9至图20为本发明实施例的封装结构的制作方法的中间过程示意图;
图21为本发明实施例的垂直封装模块的结构示意图之一;
图22a、图22b、图22c、图22d分别为本发明实施例的不同数量的封装单元在印刷线路板上分布的俯视图;
图23为本发明实施例的垂直封装模块的结构示意图之二;
图24为本发明实施例的垂直封装模块的结构示意图之三。
具体实施方式
下面详细描述本发明的实施例,所述实施例的示例在附图中示出,其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的,仅用于解释本发明,而不能理解为对本发明的限制。
在本发明的描述中,若干的含义是一个或者多个,多个的含义是两个以上,大于、小于、超过等理解为不包括本数,以上、以下、以内等理解为包括本数。如果有描述到第一、第二只是用于区分技术特征为目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量或者隐含指明所指示的技术特征的先后关系。
本发明的描述中,除非另有明确的限定,设置、安装、连接等词语应做广义理解,所属技术领域技术人员可以结合技术方案的具体内容合理确定上述词语在本发明中的具体含义。
实施例1
请参照图1和图2,本实施例公开了一种可润湿侧面的封装结构,包括第一介质层110、芯片200(又称为微电路、微芯片或集成电路)和线路层300,第一介质层110的材料为玻璃纤维布、高分子聚合物或陶瓷材料中的至少一种,第一介质层110设置有封装腔101,具体的,封装腔101位于第一介质层110的中部,第一介质层110的侧壁且位于封装腔101的外侧设置有第一侧壁焊盘120,第一侧壁焊盘120的数量根据芯片200的有源面上的引脚201数量以及实际的布线需求而定,芯片200封装于封装腔101内,且芯片200的有源面上的引脚201朝向第一介质层110的第一面,其中,用于封装芯片200的封装材料103可以是味之素增层材料、具有聚合物基质的材料、感光性绝缘材料、封装模塑料或聚酰亚胺等,封装材料103将芯片200包裹在封装腔101内且芯片200部分露出封装材料103,以便于实现电连接或散热连接。请参照图1、图3和图4,线路层300设置在第一介质层110的第一面,线路层300直接或间接连接于第一侧壁焊盘120和芯片200的有源面上的引脚201,用以实现第一侧壁焊盘120与芯片200的有源面上的引脚201之间的电性连接。值得理解的是,引脚201可以朝向第一介质层110的两个相对表面中的任意一个,为了便于叙述,本发明实施例以引脚201的朝向为基准,确定第一介质层110的第一面,即第一介质层110以引脚201朝向的一面为第一面。
与现有的封装结构相比,本发明实施例通过芯片200引脚引出线路层300,取消键合引线或金属凸点,缩小封装体积和缩短电信号的传导距离,有利于实现封装结构的小型化,以及优化电信号传导的损耗和延时。而且,本实施例通过设置第一侧壁焊盘120,可以在单位面积的封装结构上布置更多的焊盘,从而满足不断增加的I/O数量的需求。第一侧壁焊盘120的设计可以实现封装结构的表面贴装、侧面贴装或垂直贴装,可以满足更多场景的贴装需求,有利于提高封装结构的适用性。在后续的使用中,当第一侧壁焊盘120进行焊锡浸润时,可以通过自动光学检测设备检查第一侧壁焊盘120的焊锡浸润情况,从而判断焊锡的品质状况,进而得出芯片焊锡性能的有效性判断,有利于提高相关电子产品装配后的可靠性,可以满足车规级的要求。
根据不同设计,线路层300与第一侧壁焊盘120和芯片200的有源面上的引脚201之间的连接方式均可以是直接连接或间距连接,其中,请参照图1或图3,图中示出了线路层300分别与第一侧壁焊盘120和芯片200的有源面上的引脚201直接连接;请参照图4,图中示出了线路层300与第一侧壁焊盘120直接连接,以及线路层300通过第一导电通孔柱301与芯片200的有源面上的引脚201连接;请参照图5,图中示出了线路层300通过第二导电通孔柱302与第一侧壁焊盘120连接,以及线路层300通过第一导电通孔柱301与芯片200的有源面上的引脚201连接。因此,本实施例可以实现线路层300直接与第一侧壁焊盘120连接或者通过第二导电通孔柱302与第一侧壁焊盘120连接,线路层300还直接与芯片200的有源面上的引脚201连接或者通过第一导电通孔柱301与芯片200的有源面上的引脚201连接。
请参照图5、图6和图7,线路层300的数量为一层或多层,可以满足更多的布线需求。当线路层300的数量为多层时,相邻两层线路层300之间通过第三导电通孔柱303连接,最外层的线路层300通过第四导电通孔柱304与第一侧壁焊盘120连接。
请参照图5或图7,第一介质层110的第二面设置有散热层400,有利于提高芯片200的散热效率,降低芯片200的工作温度,从而提高芯片200工作的可靠性。其中,散热层400与芯片200的散热面直接连接或通过第一导热通孔柱401与芯片200的散热面连接。具体的,请参照图5,图中示出了散热层400与芯片200的散热面直接连接;请参照图7,图中示出了散热层400通过第一导热通孔柱401与芯片200的散热面连接。
请继续参照图5或图7,在应用时,第一侧壁焊盘120上植有锡球600,或者在电路板上印刷锡膏,以便于与电路板连接。当然,对于部分封装结构,线路层300设置有底部焊盘,根据实际的焊接需求,第一侧壁焊盘120和底部焊盘中的至少之一植有锡球600,以便于实现表面贴装、侧面贴装或垂直贴装。
需要说明的是,为了对封装结构进行保护,封装结构上施加有第一表面保护层510,具体的,第一表面保护层510覆盖于线路层300,当设置有散热层400时,第一表面保护层510还覆盖于散热层400。第一表面保护层510可以是阻焊层或塑封层,用以实现机械保护和隔离水汽的功能。
请参照图8a,在实际应用中,根据芯片200的不同选型,芯片200的有源面的朝向有所不同。例如,当芯片200为LED、光接收器件或传感器芯片等组件时,芯片200的有源面上设置有功能区202,功能区202露出第一介质层110,即芯片200的有源面朝向封装腔101的外侧,以便于完成信号发射、信号接收、信号传导或信号探测等功能。
请参照图8b,对于部分类型的芯片,例如具有防水要求的芯片,为了加强对芯片200的保护,芯片200的有源面上设置有透明色的第二表面保护层520。根据第二表面保护层520的材料不同,第二表面保护层520可以起到不同的保护作用,例如起到机械保护和隔离水汽的作用。
当然,请参照图8c,根据第二表面保护层520材料的不同,芯片200的有源面上可以设置非透明色的第二表面保护层520,第二表面保护层520上设置有与功能区202对应的开窗位,用以避让功能区202,从而露出功能区202,以便于完成信号发射、信号接收、信号传导或信号探测等功能。
实施例2
本发明实施例提供一种封装结构的制作方法,包括步骤S100、步骤S200、步骤S300和步骤S400,下面对各个步骤进行详细说明。
S100、请参照图9和图10,提供一介质框架100,介质框架100用于形成封装结构的第一介质层110。介质框架100上设置有至少一个封装腔101,介质框架100上且位于封装腔101的外侧设置有第一金属柱102,第一金属柱102的两个端面分别暴露于介质框架100的相对两面。本实施例中,封装腔101为连通于介质框架100相对两面的空腔,介质框架100的材料为玻璃纤维布、高分子聚合物或陶瓷材料中的至少一种。为了便于叙述,本实施例的介质框架100上阵列设置有4*3=12个封装腔101,在同一行中,介质框架100上且位于相邻的封装腔101之间设置有第一金属柱102,而且介质框架100的两侧壁且位于封装腔101的一侧同样设置有第一金属柱102。
S200、请参照图11,将待封装的芯片200封装在封装腔101内,以获得第一半成品,其中,芯片200的有源面上的引脚201朝向第一半成品的第一面。芯片200的封装方式可以通过层压、注塑成型或压延工艺等方式完成,其中,用于封装芯片200的封装材料103可以是味之素增层材料、具有聚合物基质的材料、感光性绝缘材料、封装模塑料或聚酰亚胺等,封装材料103将芯片200包裹在封装腔101内且芯片200部分露出封装材料103,以便于实现电连接或散热连接。
S300、请参照图12,在第一半成品的第一面制作线路层300,以获得第二半成品,其中,线路层300直接或间接连接于第一金属柱102和芯片200的有源面上的引脚201,从而实现第一金属柱102和芯片200的有源面上的引脚201之间的电性连接。与现有的封装结构相比,本发明实施例通过芯片200引脚引出线路层300,取消键合引线或金属凸点,缩小封装体积和缩短电信号的传导距离,有利于实现封装结构的小型化,以及优化电信号传导的损耗和延时。
S400、请继续参照图12,对第二半成品进行切割,以获得具有第一侧壁焊盘120的封装单元,其中,至少一条切割路径经过第一金属柱102,切割的方式可以是激光切割或机械切割。对于同一行上相邻的两个封装腔101,将位于同一列的第一金属柱102的中心连线(如图中的虚线所示)确定为切割路径,沿着切割路径进行切割,可以使第一金属柱102的剖面暴露于介质框架100的表面,以形成第一侧壁焊盘120,然后对经过一次切割的半成品进行二次等分切割,以获得封装单元。第一侧壁焊盘120的设计使封装结构可以在单位面积上布置更多的焊盘,从而满足不断增加的I/O数量的需求。第一侧壁焊盘120的设计可以实现封装结构的表面贴装、侧面贴装或垂直贴装,可以满足更多场景的贴装需求,有利于提高封装结构的适用性。
对于步骤S300中在第一半成品的第一面制作线路层300的这一步骤,本实施例公开了两种实施方式。其一,在第一半成品的第一面制作线路层300,包括步骤:
S310、请参照图11和图12,当芯片200的有源面上的引脚201朝向且暴露于第一半成品的第一面时,在第一半成品的第一面制作线路层300,以获得第二半成品,其中,线路层300与芯片200的有源面上的引脚201直接连接。值得理解的是,在芯片200的贴装的过程中可以通过在封装腔101的底部提供临时承载面的方式来使芯片200的有源面上的引脚201朝向且暴露于第一半成品的第一面。另外,线路层300的制作方法可以通过图形转移和图形电镀的方式实现,对于本领域技术人员来说是公知的技术,本实施例不再进行累述。
其二,在第一半成品的第一面制作线路层300,包括步骤:
S321、请参照图13和图14,当芯片200的有源面上的引脚201朝向第一半成品的第一面且埋藏于第一半成品内时,在第一半成品的第一面开设第一导通孔104,第一导通孔104连通于芯片200的有源面上的引脚201。在本实施例中,第一导通孔104通过激光钻孔的方式加工得到。
S322、请参照图15,通过电镀的方式在第一导通孔104内加工出第一导电通孔柱301,其中,第一导电通孔柱301的第一端与芯片200的有源面上的引脚201连接,第一导电通孔柱301的第二端暴露于第一半成品的第一面。
S323、请继续参照图15,在第一半成品的第一面制作线路层300,以获得第二半成品,其中,线路层300与第一导电通孔柱301连接,并通过第一导电通孔柱301与芯片200的有源面上的引脚201连接。通过如此设置,可以将芯片200的有源面上的引脚201封装在封装材料103中,还可以实现芯片200与第一金属柱102的电性连接,有利于降低水汽对芯片200的影响,提高芯片200工作的稳定性。
需要说明的是,当封装材料103的厚度较厚时,请参照图14,在步骤S321中,第一导通孔104的数量为多个,多个第一导通孔104对应连通于第一金属柱102和芯片200的有源面上的引脚201;相应的,请参照图15,在步骤S322中,通过电镀的方式在对应的第一导通孔104内分别加工出第二导电通孔柱302和第一导电通孔柱301,其中,第二导电通孔柱302的第一端与第一金属柱102连接,第一导电通孔柱301的第一端与芯片200的有源面上的引脚201连接,第二导电通孔柱302的第二端和第一导电通孔柱301的第二端均暴露于第一半成品的第一面;在步骤S323中,在第一半成品的第一面制作线路层300后,线路层300分别与第二导电通孔柱302和第一导电通孔柱301连接,从而实现线路层300通过第二导电通孔柱302与第一金属柱102连接,线路层300通过第一导电通孔柱301与芯片200的有源面上的引脚201连接,进而实现线路层300分别与第一金属柱102和芯片200的有源面上的引脚201间接连接。
请参照图16,在本实施例中,线路层300的数量为多层,相邻两层线路层300之间通过第三导电通孔柱303连接,最外层的线路层300通过第四导电通孔柱304与第一金属柱102连接。其中,多层线路层300的加工方法可以通过图形转移、图形电镀、叠层和压合等工序实现,同样的,第三导电通孔柱303和第四导电通孔柱304的加工方法也可以通过图形转移、图形电镀、叠层和压合等工序实现,对于本领域技术人员来说是公知的技术,本实施例不再累述。通过如此设置,本实施例可以制作出具有多层扇出的封装结构,有利于提高布线密度。
为了提高芯片200的散热效率,可以在第一半成品上加工散热层400,其中,散热层400的可以在步骤S300中同步制作,其中,本实施例提供两种实施方式。
其一,在上述步骤S300中,在第一半成品的第一面制作线路层300,包括步骤:
请参照图17,当芯片200的有源面上的引脚201朝向第一半成品的第一面且芯片200的散热面埋藏于第一半成品内时,在第一半成品的第二面开设第二导通孔105,第二导通孔105连通于芯片200的散热面。本实施例中,芯片200的散热面位于芯片200的背面,芯片200的散热面与芯片200的有源面上的引脚201分别位于芯片200的相对两面。
请参照图18,通过电镀的方式在第二导通孔105内加工出第一导热通孔柱401,其中,第一导热通孔柱401的第一端与芯片200的散热面连接,第一导热通孔柱401的第二端暴露于第一半成品的第二面。
请继续参照图18,在第一半成品的第一面制作线路层300,在第一半成品的第二面制作散热层400,以获得第二半成品,其中,散热层400与第一导热通孔柱401连接。散热层400的制作方法可通过图形转移和图像电镀的方式实现,本实施例不在累述。
其二,在上述步骤S300中,在第一半成品的第一面制作线路层300,包括步骤:
请参照图14和图15,当芯片200的有源面上的引脚201朝向第一半成品的第一面且芯片200的散热面暴露于第一半成品的第二面时,在第一半成品的第一面制作线路层300,在第一半成品的第二面制作散热层400,以获得第二半成品,其中,散热层400与芯片200的散热面直接连接。线路层300的制作方法可参照上述的实施方式,不在此累述。
上述步骤S300、在第一半成品的第一面制作线路层300,之后还包括步骤:
请参照图19或图20,在第一半成品上施加第一表面保护层510,以获得第二半成品,第一表面保护层510可以是阻焊层或塑封层,用以实现机械保护和隔离水汽的功能。当加工有散热层400时,通过图形转移工艺、等离子蚀刻或激光工艺对第一表面保护层510进行局部去除,以暴露出对应的散热金属。其中,第一表面保护层510的塑封材料可以为封装材料103。
请继续参照图19或图20,在获得封装单元后,可以对第一侧壁焊盘120进行植球处理,用以在第一侧壁焊盘120加工出连接结构。需要说明的是,对于部分封装结构,线路层300设置有底部焊盘,第一表面保护层510设置有用于露出底部焊盘的开窗位,此时,可以对第一侧壁焊盘120和底部焊盘进行植球处理,用以在第一侧壁焊盘120和底部焊盘上加工出连接结构。
在实际应用中,根据芯片200的不同选型,芯片200的有源面的朝向有所不同。例如,当芯片200为LED、光接收器件或传感器芯片等组件时,芯片200的有源面设置有功能区202。
为了使功能区202露出第一介质层110,在上述步骤S200中,将待封装的芯片200封装在封装腔101内,包括步骤:
S210、在封装腔101的底部提供一临时承载面(未图示),其中,临时承载面可以是设置在介质框架100底部的临时承载板,或者,临时承载面可以是粘贴在介质框架100底部的胶纸或胶带。
S220、将芯片200贴装在封装腔101内,且芯片200的有源面贴装在临时承载面上,可以使芯片200的有源面与介质框架100的底部齐平,即与第一介质层110的表面齐平。
S230、采用封装材料103对芯片200进行封装。由于芯片200的有源面贴装在临时承载面上,在封装时,封装材料103可以对芯片200的有源面进行避让,避免封装材料103对芯片200进行全覆盖。
S240、去除临时承载面,以露出芯片200的有源面上的功能区202。由于芯片200的有源面贴装在临时承载面上,当去除临时承载面后,可以暴露出芯片200的有源面,封装后的结构可参照图8a。当然,当芯片200的有源面上设置有引脚201时,也可以实现引脚201露出第一介质层110。为了对芯片200进行保护,在上述步骤S400中,对第二半成品进行切割,之后还包括步骤:
S520、在芯片200的有源面上加工透明色的第二表面保护层520,其结构可参照图8b。
在上述步骤S400中,根据第二表面保护层520的材料不同,第二表面保护层520的加工方式有所不同。例如,对第二半成品进行切割,之后还包括步骤:
S521、在芯片200的有源面上加工非透明色的第二表面保护层520;
S522、在第二表面保护层520上且对应于功能区202的位置开窗,其结构可参照图8c,可以对功能区202进行避让,从而露出功能区202,以便于完成信号发射、信号接收、信号传导或信号探测等功能。
实施例3
本发明实施例公开一种封装结构,通过实施例2的封装结构的制作方法获得。与现有的封装结构相比,本发明实施例通过芯片200引脚引出线路层300,取消键合引线或金属凸点,缩小封装体积和缩短电信号的传导距离,有利于实现封装结构的小型化,以及优化电信号传导的损耗和延时。而且,本实施例通过设置第一侧壁焊盘120,可以在单位面积的封装结构上布置更多的焊盘,从而满足不断增加的I/O数量的需求。第一侧壁焊盘120的设计可以实现封装结构的表面贴装、侧面贴装或垂直贴装,可以满足更多场景的贴装需求,有利于提高封装结构的适用性。在后续的使用中,当第一侧壁焊盘120进行焊锡浸润时,可以通过自动光学检测设备检查第一侧壁焊盘120的焊锡浸润情况,从而判断焊锡的品质状况,进而得出芯片焊锡性能的有效性判断,有利于提高相关电子产品装配后的可靠性,可以满足车规级的要求。
实施例4
本发明实施例公开一种垂直封装模块,包括实施例1的封装结构,或者,包括实施例3的封装结构。本发明实施例通过芯片200的有源面上的引脚引出线路层300,取消键合引线或金属凸点,缩小封装体积和缩短电信号的传导距离,有利于实现封装结构的小型化,以及优化电信号传导的损耗和延时。而且,本实施例通过设置第一侧壁焊盘120,可以在单位面积的封装结构上布置更多的焊盘,从而满足不断增加的I/O数量的需求。第一侧壁焊盘120的设计可以实现封装结构的表面贴装、侧面贴装或垂直贴装,可以满足更多场景的贴装需求,有利于提高封装结构的适用性。
实施例5
请参照图21,发明实施例公开一种垂直封装模块,包括印刷线路板700、封装单元800和封装器件810,封装单元800设置有第二侧壁焊盘820,并通过第二侧壁焊盘820焊接在印刷线路板700上,封装单元800的第一面垂直于印刷线路板700,封装器件810具有功能区域811,其中,功能区域811对应于实施例1的功能区202,即功能区域811可以是信号发射端、信号接收端、信号传导端或信号探测端,当然,功能区域811还可以是集成了信号发射端和信号接收端的信号收发端。功能区域811暴露在空气中,也可以通过覆盖保护材料进行保护。封装器件810封装在封装单元800内且与第二侧壁焊盘820电性连接,封装器件810的功能区域811朝向封装单元800的第一面,如此可以实现封装器件810的信号传导方向平行或实质平行于印刷线路板700所在的虚拟平面。值得理解的是,功能区域811可以朝向封装单元800的两个相对表面中的任意一个,为了便于叙述,本发明实施例以功能区域811的朝向为基准,确定封装单元800的第一面,即封装单元800以功能区域811朝向的一面为第一面。需要说明的是,本实施例涉及的“信号传导方向”是指封装器件810发出或接收的信号(如光信号)沿某一虚拟的直线路径传导,该直线路径的指向即为信号传导方向。本实施例涉及的“实质平行”是指封装器件810的信号传导方向与印刷线路板700所在的虚拟平面之间的夹角在一定的误差范围内,例如≤3°或≤5°。本实施例的封装单元800垂直装配在印刷线路板700上,可以为封装器件810提供一种正面、背面和侧面同时主动散热的垂直装配结构,有利于提高封装器件810的散热效率。
为了避免重复累述,本实施例的封装单元800的具体结构可参照实施例1,例如,通过封装器件810的引脚引出线路层,取消键合引线或金属凸点,缩小封装体积和缩短电信号的传导距离,有利于实现封装结构的小型化,以及优化电信号传导的损耗和延时;又例如,封装单元800上设置有散热层,散热层与封装器件810直接或间接连接,用以提高封装器件810的散热效率。本实施例的垂直装配结构,可以将设置在封装器件810正面或背面的散热层暴露在空气中,后续可通过风冷或水冷等方式进行主动散热,有利于提高散热效率,其中,在本实施例中,封装器件810可以是LED、光接收器件或传感器芯片等。应当理解的是,印刷线路板700内部或表面设置有走线710和/或焊盘,印刷线路板700上还可以贴装其它元器件,例如,有源器件720(如芯片或开关管等)和无源器件730(如电阻或电容等),元器件之间通过走线710连接。当封装器件810为光收发器件,而有源器件为光收发器件的驱动控制芯片(ASIC)时,可以实现光收发器件及其ASIC的集成。
对于常规的封装有封装器件的封装单元,封装器件的功能区域811一般朝向于封装单元的正面,而封装单元的焊盘一般布置在底部,因此,当封装单元通过表面贴装技术贴装在印刷线路板上后,封装器件的信号传导方向只能垂直于印刷线路板所在的虚构平面,导致封装器件的信号传导方向单一;而且由于结构设计以及生产工艺等原因,封装单元一般为长方体结构,通常面积较大的一面与印刷线路板连接,导致贴装面积大。
本实施例通过在封装单元800上设置第二侧壁焊盘820,将平面的表面贴装方式改为垂直贴装方式,缩小贴装面积,有利于垂直封装模块的小型化和高密度化,而且垂直贴装的方式,可以使封装器件810对光、电磁波、红外线等信号的发射、传导、接收或探测方向从单一方向变成多个可选方向,例如请参照图22a、图22b、图22c和图22d,图中分别示出了6个、4个、3个和2个封装单元800的排列情况,图中虚线表示信号传导方向,信号传导方向与印刷线路板700所在的虚构平面平行,通过调整封装单元800的数量以及贴装的朝向,可以实现多个朝向的贴装阵列(如LED阵列或天线阵列),有利于实现信号收发等相关功能,还有利于降低垂直封装模块的设计难度以及降低垂直装配的工艺难度,并提高板级装配的可靠性。
请参照图21或图23,印刷线路板700的表面或侧边设置有凹位701,凹位701内设置有第一焊盘702,第二侧壁焊盘820与第一焊盘702焊接连接。例如,请参照图21,图示的凹位701为凹槽结构,第一焊盘702设置在凹槽内,封装单元800贴装后,通过液体填充剂填埋凹槽内的空隙,并通过热固化或光固化的方式将填充剂固化,用于提高封装单元800贴装的稳固性;又例如,请参照图23,图示的凹位701为设置在印刷线路板700边缘的缺角凹位,第一焊盘702设置在缺角凹位内,其中第一焊盘702为平面焊盘或直角焊盘。当第一焊盘702为直角焊盘时,封装单元800还设置有底部焊盘,封装单元800的第二侧壁焊盘820和底部焊盘分别与直角焊盘焊接连接,用以提高封装单元800的贴装稳固性。
请参照图24,印刷线路板700的表面设置有凸起部703,其中,凸起部703可以是立柱、凸台或竖墙等结构,凸起部703的侧壁设置有第二焊盘704,封装单元800还设置有底部焊盘,底部焊盘与第二焊盘704焊接连接。如此,通过第二侧壁焊盘820与第一焊盘702焊接连接,以及通过底部焊盘与第二焊盘704焊接连接,可以提高封装单元800的贴装稳固性,还可以充分利用立体空间来增大布线面积,有利于增大元器件的集成密度。值得理解的是,凸起部703有多个侧壁,根据设计布局需求,可以在凸起部703的一个或多个侧壁上设置第二焊盘704,用以贴装一个或多个封装单元800。
上面结合附图对本发明实施例作了详细说明,但是本发明不限于上述实施例,在所属技术领域普通技术人员所具备的知识范围内,还可以在不脱离本发明宗旨的前提下作出各种变化。
Claims (23)
1.一种可润湿侧面的封装结构,其特征在于,包括:
第一介质层(110),设置有封装腔(101),所述第一介质层(110)的侧壁且位于所述封装腔(101)的外侧设置有第一侧壁焊盘(120);
芯片(200),封装于所述封装腔(101)内,且所述芯片(200)的有源面的引脚(201)朝向所述第一介质层(110)的第一面;
线路层(300),设置在所述第一介质层(110)的第一面,所述线路层(300)直接或间接连接于所述第一侧壁焊盘(120)和所述芯片(200)的有源面上的引脚(201)。
2.根据权利要求1所述的可润湿侧面的封装结构,其特征在于,所述线路层(300)直接与所述第一侧壁焊盘(120)连接或者通过第二导电通孔柱(302)与所述第一侧壁焊盘(120)连接,所述线路层(300)还直接与所述芯片(200)的有源面上的引脚(201)连接或者通过第一导电通孔柱(301)与所述芯片(200)的有源面上的引脚(201)连接。
3.根据权利要求2所述的可润湿侧面的封装结构,其特征在于,所述线路层(300)的数量为多层,相邻两层所述线路层(300)之间通过第三导电通孔柱(303)连接。
4.根据权利要求1所述的可润湿侧面的封装结构,其特征在于,所述第一介质层(110)的第二面设置有散热层(400),所述散热层(400)与所述芯片(200)的散热面直接连接或通过第一导热通孔柱(401)与所述芯片(200)的散热面连接。
5.根据权利要求1至4任意一项所述的可润湿侧面的封装结构,其特征在于,所述线路层(300)设置有底部焊盘,所述第一侧壁焊盘(120)和所述底部焊盘中的至少之一植有锡球(600)。
6.根据权利要求1所述的可润湿侧面的封装结构,其特征在于,所述芯片(200)的有源面上设置有功能区(202),所述功能区(202)露出所述第一介质层(110)。
7.根据权利要求6所述的可润湿侧面的封装结构,其特征在于,所述芯片(200)的有源面上设置有透明色的第二表面保护层(520)。
8.根据权利要求6所述的可润湿侧面的封装结构,其特征在于,所述芯片(200)的有源面上设置有非透明色的第二表面保护层(520),所述第二表面保护层(520)上设置有与所述功能区(202)对应的开窗位。
9.一种封装结构的制作方法,其特征在于,包括:
提供一介质框架(100),所述介质框架(100)上设置有至少一个封装腔(101),所述介质框架(100)上且位于所述封装腔(101)的外侧设置有第一金属柱(102),所述第一金属柱(102)的两个端面分别暴露于所述介质框架(100)的相对两面;
将待封装的芯片(200)封装在所述封装腔(101)内,以获得第一半成品,其中,所述芯片(200)的有源面上的引脚(201)朝向所述第一半成品的第一面;
在所述第一半成品的第一面制作线路层(300),以获得第二半成品,其中,所述线路层(300)直接或间接连接于所述第一金属柱(102)和所述芯片(200)的有源面上的引脚(201);
对所述第二半成品进行切割,以获得具有第一侧壁焊盘(120)的封装单元,其中,至少一条切割路径经过所述第一金属柱(102)。
10.根据权利要求9所述的封装结构的制作方法,其特征在于,在所述第一半成品的第一面制作线路层(300),包括步骤:
当所述芯片(200)的有源面上的引脚(201)朝向且暴露于所述第一半成品的第一面时,在所述第一半成品的第一面制作所述线路层(300),以获得所述第二半成品,其中,所述线路层(300)与所述芯片(200)的有源面上的引脚(201)直接连接。
11.根据权利要求9所述的封装结构的制作方法,其特征在于,在所述第一半成品的第一面制作线路层(300),包括步骤:
当所述芯片(200)的有源面上的引脚(201)朝向所述第一半成品的第一面且埋藏于所述第一半成品内时,在所述第一半成品的第一面开设第一导通孔(104),所述第一导通孔(104)连通于所述芯片(200)的有源面上的引脚(201);
通过电镀的方式在所述第一导通孔(104)内加工出第一导电通孔柱(301),其中,所述第一导电通孔柱(301)的第一端与所述芯片(200)的有源面上的引脚(201)连接,所述第一导电通孔柱(301)的第二端暴露于所述第一半成品的第一面;
在所述第一半成品的第一面制作所述线路层(300),以获得所述第二半成品,其中,所述线路层(300)与所述第一导电通孔柱(301)连接,并通过所述第一导电通孔柱(301)与所述芯片(200)的有源面上的引脚(201)连接。
12.根据权利要求10或11所述的封装结构的制作方法,其特征在于,所述线路层(300)的数量为多层,相邻两层所述线路层(300)之间通过第三导电通孔柱(303)连接,最外层的所述线路层(300)通过第四导电通孔柱(304)与所述第一金属柱(102)连接。
13.根据权利要求9所述的封装结构的制作方法,其特征在于,在所述第一半成品的第一面制作线路层(300),包括步骤:
当所述芯片(200)的有源面上的引脚(201)朝向所述第一半成品的第一面且所述芯片(200)的散热面埋藏于所述第一半成品内时,在所述第一半成品的第二面开设第二导通孔(105),所述第二导通孔(105)连通于所述芯片(200)的散热面;
通过电镀的方式在所述第二导通孔(105)内加工出第一导热通孔柱(401),其中,所述第一导热通孔柱(401)的第一端与所述芯片(200)的散热面连接,所述第一导热通孔柱(401)的第二端暴露于所述第一半成品的第二面;
在所述第一半成品的第一面制作所述线路层(300),在所述第一半成品的第二面制作散热层(400),以获得所述第二半成品,其中,所述散热层(400)与所述第一导热通孔柱(401)连接。
14.根据权利要求9所述的封装结构的制作方法,其特征在于,在所述第一半成品的第一面制作线路层(300),包括步骤:
当所述芯片(200)的有源面上的引脚(201)朝向所述第一半成品的第一面且所述芯片(200)的散热面暴露于所述第一半成品的第二面时,在所述第一半成品的第一面制作所述线路层(300),在所述第一半成品的第二面制作散热层(400),以获得所述第二半成品,其中,所述散热层(400)与所述芯片(200)的散热面直接连接。
15.根据权利要求9所述的封装结构的制作方法,其特征在于,所述芯片(200)的有源面设置有功能区(202),将待封装的芯片(200)封装在所述封装腔(101)内,包括步骤:
在所述封装腔(101)的底部提供一临时承载面;
将所述芯片(200)贴装在所述封装腔(101)内,且所述芯片(200)的有源面贴装在所述临时承载面上;
采用封装材料(103)对所述芯片(200)进行封装;
去除所述临时承载面,以露出所述芯片(200)的有源面上的功能区(202)。
16.根据权利要求15所述的封装结构的制作方法,其特征在于,对所述第二半成品进行切割,之后还包括步骤:
在所述芯片(200)的有源面上加工透明色的第二表面保护层(520)。
17.根据权利要求15所述的封装结构的制作方法,其特征在于,对所述第二半成品进行切割,之后还包括步骤:
在所述芯片(200)的有源面上加工非透明色的第二表面保护层(520);
在所述第二表面保护层(520)上且对应于所述功能区(202)的位置开窗。
18.一种可润湿侧面的封装结构,其特征在于,通过权利要求9至17任意一项所述的封装结构的制作方法获得。
19.一种垂直封装模块,其特征在于,包括权利要求1至8任意一项所述的可润湿侧面的封装结构,或者,包括权利要求18所述的可润湿侧面的封装结构。
20.一种垂直封装模块,其特征在于,包括:
印刷线路板(700);
封装单元(800),设置有第二侧壁焊盘(820),并通过所述第二侧壁焊盘(820)焊接在所述印刷线路板(700)上,所述封装单元(800)的第一面垂直于所述印刷线路板(700);
具有功能区域(811)的封装器件(810),封装在所述封装单元(800)内且与所述第二侧壁焊盘(820)电性连接,所述封装器件(810)的功能区域(811)朝向所述封装单元(800)的第一面。
21.根据权利要求20所述的垂直封装模块,其特征在于,所述印刷线路板(700)的表面或侧边设置有凹位(701),所述凹位(701)内设置有第一焊盘(702),所述第二侧壁焊盘(820)与所述第一焊盘(702)焊接连接。
22.根据权利要求20或21所述的垂直封装模块,其特征在于,所述印刷线路板(700)的上表面或下表面设置有凸起部(703)。
23.根据权利要求22所述的垂直封装模块,其特征在于,所述凸起部(703)上设置有第二焊盘(704),所述封装单元(800)还设置有底部焊盘,所述底部焊盘与所述第二焊盘(704)焊接连接。
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JP2009302221A (ja) * | 2008-06-12 | 2009-12-24 | Nec Electronics Corp | 電子装置及びその製造方法 |
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JP2022186602A (ja) | 2022-12-15 |
US20220392862A1 (en) | 2022-12-08 |
TW202249188A (zh) | 2022-12-16 |
TWI809797B (zh) | 2023-07-21 |
KR20220164410A (ko) | 2022-12-13 |
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