KR101157192B1 - 배치식 기판 처리 장치 - Google Patents

배치식 기판 처리 장치 Download PDF

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Publication number
KR101157192B1
KR101157192B1 KR1020100084918A KR20100084918A KR101157192B1 KR 101157192 B1 KR101157192 B1 KR 101157192B1 KR 1020100084918 A KR1020100084918 A KR 1020100084918A KR 20100084918 A KR20100084918 A KR 20100084918A KR 101157192 B1 KR101157192 B1 KR 101157192B1
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KR
South Korea
Prior art keywords
substrate
substrate processing
unit
holder
processing unit
Prior art date
Application number
KR1020100084918A
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English (en)
Korean (ko)
Other versions
KR20120020958A (ko
Inventor
송종호
강호영
Original Assignee
주식회사 테라세미콘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 테라세미콘 filed Critical 주식회사 테라세미콘
Priority to KR1020100084918A priority Critical patent/KR101157192B1/ko
Priority to CN2011800465075A priority patent/CN103155119A/zh
Priority to JP2013525799A priority patent/JP2013539600A/ja
Priority to PCT/KR2011/001318 priority patent/WO2012030032A1/ko
Publication of KR20120020958A publication Critical patent/KR20120020958A/ko
Application granted granted Critical
Publication of KR101157192B1 publication Critical patent/KR101157192B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020100084918A 2010-08-31 2010-08-31 배치식 기판 처리 장치 KR101157192B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020100084918A KR101157192B1 (ko) 2010-08-31 2010-08-31 배치식 기판 처리 장치
CN2011800465075A CN103155119A (zh) 2010-08-31 2011-02-25 批处理式基板处理装置
JP2013525799A JP2013539600A (ja) 2010-08-31 2011-02-25 バッチ式基板処理装置
PCT/KR2011/001318 WO2012030032A1 (ko) 2010-08-31 2011-02-25 배치식 기판 처리 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100084918A KR101157192B1 (ko) 2010-08-31 2010-08-31 배치식 기판 처리 장치

Publications (2)

Publication Number Publication Date
KR20120020958A KR20120020958A (ko) 2012-03-08
KR101157192B1 true KR101157192B1 (ko) 2012-06-20

Family

ID=45773079

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100084918A KR101157192B1 (ko) 2010-08-31 2010-08-31 배치식 기판 처리 장치

Country Status (4)

Country Link
JP (1) JP2013539600A (zh)
KR (1) KR101157192B1 (zh)
CN (1) CN103155119A (zh)
WO (1) WO2012030032A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101385698B1 (ko) * 2012-08-29 2014-04-18 주식회사 테라세미콘 열처리 장치 및 이를 구비한 열처리 시스템
KR20150018910A (ko) * 2013-04-22 2015-02-25 주식회사 테라세미콘 클러스터형 배치식 기판처리 시스템
KR102149188B1 (ko) * 2013-11-11 2020-08-28 주식회사 제우스 기판의 열처리 장치
KR102170150B1 (ko) * 2014-03-04 2020-10-26 주식회사 제우스 분리형 기판 열처리 장치
KR102615293B1 (ko) * 2018-08-16 2023-12-19 주식회사 원익아이피에스 열처리 시스템 및 열처리 장치
CN115938998A (zh) * 2022-02-28 2023-04-07 长沙瑶华半导体科技有限公司 一种改善基板封装翘曲的方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010082111A (ko) * 2000-02-10 2001-08-29 조셉 제이. 스위니 Ｐｅｃｖｄ 캡핑 모듈을 포함하는, 유전상수가 낮은유전체 증착을 위한 통합형 장비 및 프로세스
KR20060066633A (ko) * 2004-12-13 2006-06-16 제너럴 일렉트릭 캄파니 반도체 처리 챔버용 장치와, 웨이퍼 처리 장치 및 방법
KR100684566B1 (ko) * 2005-09-07 2007-02-20 주식회사 테라세미콘 평판표시장치 열처리공정의 기판로딩용보트

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003007794A (ja) * 1995-08-05 2003-01-10 Hitachi Kokusai Electric Inc 基板搬送機構および基板処理装置
JPH11288995A (ja) * 1998-04-04 1999-10-19 Tokyo Electron Ltd 搬送システム及び処理装置
JP3929239B2 (ja) * 2000-12-06 2007-06-13 株式会社ノリタケカンパニーリミテド 遠赤外線薄型ヒータおよび基板加熱炉
JP2003037147A (ja) * 2001-07-25 2003-02-07 Tokyo Electron Ltd 基板搬送装置及び熱処理方法
US20030072639A1 (en) * 2001-10-17 2003-04-17 Applied Materials, Inc. Substrate support
JP4071047B2 (ja) * 2002-06-07 2008-04-02 株式会社アルバック 加熱冷却装置、真空処理装置
KR20050120905A (ko) * 2004-06-21 2005-12-26 삼성전자주식회사 반도체 기판 지지용 핀 및 이를 갖는 급속 열처리 장치
TWI279513B (en) * 2004-06-28 2007-04-21 Espec Corp Heat treatment apparatus
JP4476180B2 (ja) * 2004-06-28 2010-06-09 エスペック株式会社 熱処理装置
TWI508178B (zh) * 2008-07-16 2015-11-11 Tera Semicon Corp 批量式熱處理裝置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010082111A (ko) * 2000-02-10 2001-08-29 조셉 제이. 스위니 Ｐｅｃｖｄ 캡핑 모듈을 포함하는, 유전상수가 낮은유전체 증착을 위한 통합형 장비 및 프로세스
KR20060066633A (ko) * 2004-12-13 2006-06-16 제너럴 일렉트릭 캄파니 반도체 처리 챔버용 장치와, 웨이퍼 처리 장치 및 방법
KR100684566B1 (ko) * 2005-09-07 2007-02-20 주식회사 테라세미콘 평판표시장치 열처리공정의 기판로딩용보트

Also Published As

Publication number Publication date
JP2013539600A (ja) 2013-10-24
WO2012030032A1 (ko) 2012-03-08
CN103155119A (zh) 2013-06-12
KR20120020958A (ko) 2012-03-08

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