JP2013539600A - バッチ式基板処理装置 - Google Patents

バッチ式基板処理装置 Download PDF

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Publication number
JP2013539600A
JP2013539600A JP2013525799A JP2013525799A JP2013539600A JP 2013539600 A JP2013539600 A JP 2013539600A JP 2013525799 A JP2013525799 A JP 2013525799A JP 2013525799 A JP2013525799 A JP 2013525799A JP 2013539600 A JP2013539600 A JP 2013539600A
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JP
Japan
Prior art keywords
substrate
substrate processing
unit
support
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013525799A
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English (en)
Japanese (ja)
Inventor
ソン、ジョンホ
カン、ホヨン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tera Semicon Corp
Original Assignee
Tera Semicon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tera Semicon Corp filed Critical Tera Semicon Corp
Publication of JP2013539600A publication Critical patent/JP2013539600A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2013525799A 2010-08-31 2011-02-25 バッチ式基板処理装置 Pending JP2013539600A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2010-0084918 2010-08-31
KR1020100084918A KR101157192B1 (ko) 2010-08-31 2010-08-31 배치식 기판 처리 장치
PCT/KR2011/001318 WO2012030032A1 (ko) 2010-08-31 2011-02-25 배치식 기판 처리 장치

Publications (1)

Publication Number Publication Date
JP2013539600A true JP2013539600A (ja) 2013-10-24

Family

ID=45773079

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013525799A Pending JP2013539600A (ja) 2010-08-31 2011-02-25 バッチ式基板処理装置

Country Status (4)

Country Link
JP (1) JP2013539600A (zh)
KR (1) KR101157192B1 (zh)
CN (1) CN103155119A (zh)
WO (1) WO2012030032A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101385698B1 (ko) * 2012-08-29 2014-04-18 주식회사 테라세미콘 열처리 장치 및 이를 구비한 열처리 시스템
KR20150018910A (ko) * 2013-04-22 2015-02-25 주식회사 테라세미콘 클러스터형 배치식 기판처리 시스템
KR102149188B1 (ko) * 2013-11-11 2020-08-28 주식회사 제우스 기판의 열처리 장치
KR102170150B1 (ko) * 2014-03-04 2020-10-26 주식회사 제우스 분리형 기판 열처리 장치
KR102615293B1 (ko) * 2018-08-16 2023-12-19 주식회사 원익아이피에스 열처리 시스템 및 열처리 장치
CN115938998A (zh) * 2022-02-28 2023-04-07 长沙瑶华半导体科技有限公司 一种改善基板封装翘曲的方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11288995A (ja) * 1998-04-04 1999-10-19 Tokyo Electron Ltd 搬送システム及び処理装置
JP2002175868A (ja) * 2000-12-06 2002-06-21 Noritake Co Ltd 遠赤外線薄型ヒータおよび基板加熱炉
JP2003007794A (ja) * 1995-08-05 2003-01-10 Hitachi Kokusai Electric Inc 基板搬送機構および基板処理装置
JP2003037147A (ja) * 2001-07-25 2003-02-07 Tokyo Electron Ltd 基板搬送装置及び熱処理方法
JP2005507162A (ja) * 2001-10-17 2005-03-10 アプライド　マテリアルズ　インコーポレイテッド 基板支持体
JP2006046894A (ja) * 2004-06-28 2006-02-16 Espec Corp 熱処理装置
WO2010008211A2 (ko) * 2008-07-16 2010-01-21 주식회사 테라세미콘 배치식 열처리 장치 및 이에 적용되는 히터

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1124252A2 (en) * 2000-02-10 2001-08-16 Applied Materials, Inc. Apparatus and process for processing substrates
JP4071047B2 (ja) * 2002-06-07 2008-04-02 株式会社アルバック 加熱冷却装置、真空処理装置
KR20050120905A (ko) * 2004-06-21 2005-12-26 삼성전자주식회사 반도체 기판 지지용 핀 및 이를 갖는 급속 열처리 장치
TWI279513B (en) * 2004-06-28 2007-04-21 Espec Corp Heat treatment apparatus
US20060127067A1 (en) * 2004-12-13 2006-06-15 General Electric Company Fast heating and cooling wafer handling assembly and method of manufacturing thereof
KR100684566B1 (ko) * 2005-09-07 2007-02-20 주식회사 테라세미콘 평판표시장치 열처리공정의 기판로딩용보트

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003007794A (ja) * 1995-08-05 2003-01-10 Hitachi Kokusai Electric Inc 基板搬送機構および基板処理装置
JPH11288995A (ja) * 1998-04-04 1999-10-19 Tokyo Electron Ltd 搬送システム及び処理装置
JP2002175868A (ja) * 2000-12-06 2002-06-21 Noritake Co Ltd 遠赤外線薄型ヒータおよび基板加熱炉
JP2003037147A (ja) * 2001-07-25 2003-02-07 Tokyo Electron Ltd 基板搬送装置及び熱処理方法
JP2005507162A (ja) * 2001-10-17 2005-03-10 アプライド　マテリアルズ　インコーポレイテッド 基板支持体
JP2006046894A (ja) * 2004-06-28 2006-02-16 Espec Corp 熱処理装置
WO2010008211A2 (ko) * 2008-07-16 2010-01-21 주식회사 테라세미콘 배치식 열처리 장치 및 이에 적용되는 히터

Also Published As

Publication number Publication date
KR101157192B1 (ko) 2012-06-20
WO2012030032A1 (ko) 2012-03-08
CN103155119A (zh) 2013-06-12
KR20120020958A (ko) 2012-03-08

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