KR101152262B1 - 활성 에너지선 경화성 오가노폴리실록산 수지 조성물, 광전송 부재, 및 광 전송 부재의 제조방법 - Google Patents
활성 에너지선 경화성 오가노폴리실록산 수지 조성물, 광전송 부재, 및 광 전송 부재의 제조방법 Download PDFInfo
- Publication number
- KR101152262B1 KR101152262B1 KR1020067013522A KR20067013522A KR101152262B1 KR 101152262 B1 KR101152262 B1 KR 101152262B1 KR 1020067013522 A KR1020067013522 A KR 1020067013522A KR 20067013522 A KR20067013522 A KR 20067013522A KR 101152262 B1 KR101152262 B1 KR 101152262B1
- Authority
- KR
- South Korea
- Prior art keywords
- active energy
- energy ray
- sio
- organopolysiloxane resin
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/28—Non-macromolecular organic substances
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Integrated Circuits (AREA)
- Silicon Polymers (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2003-00412452 | 2003-12-10 | ||
| JP2003412452A JP4651935B2 (ja) | 2003-12-10 | 2003-12-10 | 活性エネルギー線硬化型オルガノポリシロキサン樹脂組成物、光伝送部材および光伝送部材の製造方法 |
| PCT/JP2004/018864 WO2005056640A1 (en) | 2003-12-10 | 2004-12-10 | Active energy ray-curable organopolysiloxane resin composition, light-transmitting component, and method for manufacturing the light-transmitting component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20070004564A KR20070004564A (ko) | 2007-01-09 |
| KR101152262B1 true KR101152262B1 (ko) | 2012-06-08 |
Family
ID=34675030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020067013522A Expired - Lifetime KR101152262B1 (ko) | 2003-12-10 | 2006-07-05 | 활성 에너지선 경화성 오가노폴리실록산 수지 조성물, 광전송 부재, 및 광 전송 부재의 제조방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7771794B2 (https=) |
| EP (1) | EP1692209B1 (https=) |
| JP (1) | JP4651935B2 (https=) |
| KR (1) | KR101152262B1 (https=) |
| CN (1) | CN100465211C (https=) |
| WO (1) | WO2005056640A1 (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200038510A (ko) * | 2017-08-24 | 2020-04-13 | 다우 글로벌 테크놀로지스 엘엘씨 | 광학 도파관 제작 방법 |
| KR20200040809A (ko) * | 2017-08-24 | 2020-04-20 | 다우 글로벌 테크놀로지스 엘엘씨 | 광학 도파관 제작에 대한 방법 |
| KR20200044017A (ko) * | 2017-08-24 | 2020-04-28 | 다우 글로벌 테크놀로지스 엘엘씨 | 광학 도파관 제작에 대한 방법 |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4629367B2 (ja) | 2004-05-31 | 2011-02-09 | 東レ・ダウコーニング株式会社 | 活性エネルギー線硬化型オルガノポリシロキサン樹脂組成物、光伝送部材およびその製造方法 |
| JP5392805B2 (ja) * | 2005-06-28 | 2014-01-22 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン樹脂組成物および光学部材 |
| WO2008027280A2 (en) * | 2006-08-28 | 2008-03-06 | Dow Corning Corporation | Optical devices and silicone compositions and processes fabricating the optical devices |
| KR101576268B1 (ko) | 2007-11-30 | 2015-12-08 | 다우 코닝 코포레이션 | 저손실, 저누화 광신호 라우팅을 위한 집적 플래너 폴리머 도파관 |
| KR20110030014A (ko) * | 2009-09-17 | 2011-03-23 | 주식회사 동진쎄미켐 | 발광다이오드의 밀봉 방법 및 이에 의해 밀봉된 발광다이오드 |
| JP5914351B2 (ja) | 2009-12-21 | 2016-05-11 | ダウ コーニング コーポレーションDow Corning Corporation | アルキル官能性シルセスキオキサン樹脂を使用した柔軟性導波路の製造方法 |
| TWI538959B (zh) * | 2010-03-02 | 2016-06-21 | 日本化藥股份有限公司 | Hardened resin composition and hardened product thereof |
| KR101804344B1 (ko) | 2011-05-25 | 2017-12-04 | 다우 코닝 코포레이션 | 에폭시-작용성 실록산 올리고머를 함유하는 에폭시-작용성 방사선-경화성 조성물 |
| JP2016526069A (ja) * | 2013-05-17 | 2016-09-01 | ダウ コーニング コーポレーションDow Corning Corporation | 硬化性組成物、硬化された物品の調製方法、及び該方法により形成された硬化物品 |
| KR20160010866A (ko) * | 2013-05-17 | 2016-01-28 | 다우 코닝 코포레이션 | 용품의 제조 방법 및 그에 의해 제조된 용품 |
| CN105814156B (zh) * | 2013-12-23 | 2017-10-31 | 道康宁公司 | Uv可固化有机硅组合物和含有这种组合物的防尘涂层组合物 |
| WO2015126561A1 (en) | 2014-02-21 | 2015-08-27 | Dow Corning Corporation | Method of preparing an optical connector and optical devices comprising the optical connector prepared thereby |
| KR101845081B1 (ko) * | 2014-11-28 | 2018-04-04 | 삼성에스디아이 주식회사 | 윈도우 필름용 조성물, 이로부터 형성된 플렉시블 윈도우 필름 및 이를 포함하는 플렉시블 디스플레이 장치 |
| KR101908163B1 (ko) | 2014-12-03 | 2018-10-16 | 삼성에스디아이 주식회사 | 윈도우 필름용 조성물, 이로부터 형성된 플렉시블 윈도우 필름 및 이를 포함하는 플렉시블 디스플레이 장치 |
| KR101835866B1 (ko) | 2014-12-17 | 2018-03-08 | 삼성에스디아이 주식회사 | 윈도우 필름용 조성물, 이로부터 형성된 플렉시블 윈도우 필름 및 이를 포함하는 플렉시블 디스플레이 장치 |
| KR101835867B1 (ko) | 2014-12-23 | 2018-03-08 | 삼성에스디아이 주식회사 | 윈도우 필름용 조성물, 이로부터 형성된 플렉시블 윈도우 필름 및 이를 포함하는 플렉시블 디스플레이 장치 |
| JP6557521B2 (ja) * | 2015-06-17 | 2019-08-07 | 株式会社ダイセル | ポリオルガノシルセスキオキサン、ハードコートフィルム、接着シート、積層物及び装置 |
| JP6580878B2 (ja) * | 2015-06-17 | 2019-09-25 | 株式会社ダイセル | ポリオルガノシルセスキオキサン、硬化性組成物、ハードコートフィルム、及び硬化物 |
| EP3365391A4 (en) * | 2015-10-19 | 2019-06-12 | Dow Corning Toray Co., Ltd. | MELT SILICONE COMPOSITION CURABLE BY ACTIVE ENERGY RADIATION, CURED PRODUCT THEREOF, AND FILM PRODUCTION PROCESS |
| JP6681317B2 (ja) * | 2016-11-21 | 2020-04-15 | 信越化学工業株式会社 | 紫外線硬化型シリコーン組成物及び硬化皮膜形成方法 |
| JP2020520395A (ja) * | 2017-05-16 | 2020-07-09 | モメンティブ・パフォーマンス・マテリアルズ・コリア・カンパニー・リミテッドMomentive Performance Materials Korea Co.,Ltd | 光学透明レジンおよびこれを用いて形成された電子素子 |
| WO2019022856A1 (en) * | 2017-07-28 | 2019-01-31 | Dow Silicones Corporation | METHOD FOR PREPARING A PLANE SURFACE OPTICAL WAVEGUIDE DEVICE |
| TWI905392B (zh) * | 2021-03-05 | 2025-11-21 | 美商陶氏有機矽公司 | 可固化聚矽氧組成物 |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4279717A (en) | 1979-08-03 | 1981-07-21 | General Electric Company | Ultraviolet curable epoxy silicone coating compositions |
| JPH0774327B2 (ja) * | 1987-02-14 | 1995-08-09 | 日東電工株式会社 | 紫外線硬化型シリコーン系剥離剤 |
| US4952657A (en) * | 1988-07-29 | 1990-08-28 | General Electric Company | Silicone release coating compositions |
| JPH0343423A (ja) | 1989-07-12 | 1991-02-25 | Nippon Telegr & Teleph Corp <Ntt> | ポリシロキサンおよびポリシロキサンからなる光学素子 |
| JPH0769493B2 (ja) * | 1989-08-29 | 1995-07-31 | 信越化学工業株式会社 | 光ファイバのコア用組成物及び光ファイバ |
| JP2712093B2 (ja) * | 1990-06-29 | 1998-02-10 | 東芝シリコーン株式会社 | 紫外線硬化性シリコーン組成物 |
| JP2858924B2 (ja) | 1990-10-22 | 1999-02-17 | 日本電信電話株式会社 | プラスチック光導波路 |
| US5217805A (en) * | 1991-10-15 | 1993-06-08 | Minnesota Mining And Manufacturing Company | Uv-curable silicon release compositions |
| FR2688790B1 (fr) | 1992-03-23 | 1994-05-13 | Rhone Poulenc Chimie | Compositions a base de polyorganosiloxanes a groupements fonctionnels reticulables et leur utilisation pour la realisation de revetements anti-adhesifs. |
| US5369205A (en) * | 1992-07-30 | 1994-11-29 | General Electric Company | UV-curable epoxysilicones bearing pendant silicone resin |
| US5360833A (en) * | 1992-11-25 | 1994-11-01 | General Electric Company | Controlled release compositions for UV curable epoxysilicone release agents |
| JPH07149905A (ja) * | 1993-11-26 | 1995-06-13 | Toray Dow Corning Silicone Co Ltd | オルガノポリシロキサンおよびその製造方法 |
| JPH07179511A (ja) * | 1993-12-22 | 1995-07-18 | Japan Carlit Co Ltd:The | 光重合性樹脂組成物 |
| JPH08193167A (ja) | 1995-01-17 | 1996-07-30 | Oki Electric Ind Co Ltd | 感光性樹脂組成物 |
| DE19503560C2 (de) | 1995-02-03 | 1997-03-27 | Loh Kg Rittal Werk | Stromsammelschiene |
| US5912061A (en) * | 1995-08-03 | 1999-06-15 | Matsushita Electric Industrial Co., Ltd. | UV-ray setting resin and a method for manufacturing a magneto-optical disk by the use of the UV-ray setting resin |
| JPH09124793A (ja) | 1995-11-02 | 1997-05-13 | Nippon Telegr & Teleph Corp <Ntt> | 高分子光学材料及びその製造方法及び高分子光導波路 |
| US6537723B1 (en) * | 1998-10-05 | 2003-03-25 | Nippon Telegraph And Telephone Corporation | Photosensitive composition for manufacturing optical waveguide, production method thereof and polymer optical waveguide pattern formation method using the same |
| JP3133039B2 (ja) | 1998-10-05 | 2001-02-05 | 日本電信電話株式会社 | 光導波路用感光性組成物およびその製造方法および高分子光導波路パターン形成方法 |
| JP2000230052A (ja) | 1999-02-12 | 2000-08-22 | Nippon Telegr & Teleph Corp <Ntt> | 高分子光学材料およびそれを用いた光導波路 |
| JP4132533B2 (ja) * | 2000-01-27 | 2008-08-13 | 住友ベークライト株式会社 | 感光性樹脂組成物 |
| TW594416B (en) * | 2001-05-08 | 2004-06-21 | Shipley Co Llc | Photoimageable composition |
| US6832036B2 (en) | 2002-10-11 | 2004-12-14 | Polyset Company, Inc. | Siloxane optical waveguides |
| JP4157402B2 (ja) | 2003-03-13 | 2008-10-01 | ヤマハモーターパワープロダクツ株式会社 | 除雪機 |
| EP1679328A1 (en) * | 2003-09-18 | 2006-07-12 | Kaneka Corporation | Photocuring resin composition containing organic polymer having epoxy group and/or oxethane group-containing silicon group at end, and method for producing same |
| US20060199081A1 (en) * | 2005-03-04 | 2006-09-07 | General Electric Company | Holographic storage medium, article and method |
| WO2006112943A1 (en) * | 2005-04-12 | 2006-10-26 | Dow Corning Corporation | Epoxy-functional polysiloxanes, silicone composition, and coated optical fiber |
-
2003
- 2003-12-10 JP JP2003412452A patent/JP4651935B2/ja not_active Expired - Lifetime
-
2004
- 2004-12-10 EP EP04807222.7A patent/EP1692209B1/en not_active Expired - Lifetime
- 2004-12-10 US US10/582,154 patent/US7771794B2/en active Active
- 2004-12-10 CN CNB2004800366084A patent/CN100465211C/zh not_active Expired - Lifetime
- 2004-12-10 WO PCT/JP2004/018864 patent/WO2005056640A1/en not_active Ceased
-
2006
- 2006-07-05 KR KR1020067013522A patent/KR101152262B1/ko not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200038510A (ko) * | 2017-08-24 | 2020-04-13 | 다우 글로벌 테크놀로지스 엘엘씨 | 광학 도파관 제작 방법 |
| KR20200040809A (ko) * | 2017-08-24 | 2020-04-20 | 다우 글로벌 테크놀로지스 엘엘씨 | 광학 도파관 제작에 대한 방법 |
| KR20200044017A (ko) * | 2017-08-24 | 2020-04-28 | 다우 글로벌 테크놀로지스 엘엘씨 | 광학 도파관 제작에 대한 방법 |
| KR102620913B1 (ko) | 2017-08-24 | 2024-01-05 | 다우 글로벌 테크놀로지스 엘엘씨 | 광학 도파관 제작 방법 |
| KR102688715B1 (ko) * | 2017-08-24 | 2024-07-29 | 다우 글로벌 테크놀로지스 엘엘씨 | 광학 도파관 제작에 대한 방법 |
| KR102688716B1 (ko) | 2017-08-24 | 2024-07-29 | 다우 글로벌 테크놀로지스 엘엘씨 | 광학 도파관 제작에 대한 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1692209B1 (en) | 2013-10-02 |
| KR20070004564A (ko) | 2007-01-09 |
| CN100465211C (zh) | 2009-03-04 |
| JP2005171069A (ja) | 2005-06-30 |
| JP4651935B2 (ja) | 2011-03-16 |
| EP1692209A1 (en) | 2006-08-23 |
| US7771794B2 (en) | 2010-08-10 |
| CN1890294A (zh) | 2007-01-03 |
| US20080058441A1 (en) | 2008-03-06 |
| WO2005056640A1 (en) | 2005-06-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101152262B1 (ko) | 활성 에너지선 경화성 오가노폴리실록산 수지 조성물, 광전송 부재, 및 광 전송 부재의 제조방법 | |
| US7844153B2 (en) | Active energy ray-curable organopolysiloxane resin composition, optical transmission component, and manufacturing method thereof | |
| CN103797074B (zh) | 包含环氧官能硅氧烷低聚物的环氧官能可辐射固化组合物 | |
| KR101092249B1 (ko) | 광 도파관용 경화성 오가노폴리실록산 수지 조성물, 광 도파관 및 이들의 제조방법 | |
| TWI518391B (zh) | 使用烷基官能性倍半矽氧烷樹脂製造撓性波導器的方法及由其製得之平面光學波導器總成 | |
| JP2005336421A5 (https=) | ||
| JP3952149B2 (ja) | 光導波路形成用材料及び光導波路の製造方法 | |
| WO2015126561A1 (en) | Method of preparing an optical connector and optical devices comprising the optical connector prepared thereby | |
| JP2005163009A (ja) | (メタ)アクリロキシ基含有オルガノポリシロキサン樹脂、高エネルギー線硬化性オルガノポリシロキサン樹脂組成物、光伝送部材および光伝送部材の製造方法 | |
| WO2019022856A1 (en) | METHOD FOR PREPARING A PLANE SURFACE OPTICAL WAVEGUIDE DEVICE | |
| US7283715B2 (en) | Optical waveguide forming material and method | |
| KR101190530B1 (ko) | 활성 에너지선 경화성 오가노폴리실록산 수지 조성물, 광전송 부재 및 이의 제조방법 | |
| CN1784471A (zh) | 用于透光组件的固化性有机聚硅氧烷树脂组合物,透光组件及其制造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| A201 | Request for examination | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U12-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| FPAY | Annual fee payment |
Payment date: 20150430 Year of fee payment: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| FPAY | Annual fee payment |
Payment date: 20160427 Year of fee payment: 5 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-5-5-R10-R17-oth-X000 |
|
| FPAY | Annual fee payment |
Payment date: 20170504 Year of fee payment: 6 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| FPAY | Annual fee payment |
Payment date: 20180427 Year of fee payment: 7 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 7 |
|
| FPAY | Annual fee payment |
Payment date: 20190429 Year of fee payment: 8 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 8 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R14-asn-PN2301 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| FPAY | Annual fee payment |
Payment date: 20200504 Year of fee payment: 9 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 9 |
|
| FPAY | Annual fee payment |
Payment date: 20210428 Year of fee payment: 10 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 10 |
|
| FPAY | Annual fee payment |
Payment date: 20220415 Year of fee payment: 11 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 11 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 12 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 13 |
|
| PC1801 | Expiration of term |
St.27 status event code: N-4-6-H10-H14-oth-PC1801 Not in force date: 20241211 Ip right cessation event data comment text: Termination Category : EXPIRATION_OF_DURATION |
|
| R18 | Changes to party contact information recorded |
Free format text: ST27 STATUS EVENT CODE: A-5-5-R10-R18-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |