KR101135557B1 - 기판 반송 장치 및 기판 반송 방법 - Google Patents

기판 반송 장치 및 기판 반송 방법 Download PDF

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Publication number
KR101135557B1
KR101135557B1 KR1020090113881A KR20090113881A KR101135557B1 KR 101135557 B1 KR101135557 B1 KR 101135557B1 KR 1020090113881 A KR1020090113881 A KR 1020090113881A KR 20090113881 A KR20090113881 A KR 20090113881A KR 101135557 B1 KR101135557 B1 KR 101135557B1
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KR
South Korea
Prior art keywords
wafer
substrate
arm
board
mounting surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020090113881A
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English (en)
Korean (ko)
Other versions
KR20100062924A (ko
Inventor
히로야스 헤비이시
Original Assignee
올림푸스 가부시키가이샤
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Filing date
Publication date
Application filed by 올림푸스 가부시키가이샤 filed Critical 올림푸스 가부시키가이샤
Publication of KR20100062924A publication Critical patent/KR20100062924A/ko
Application granted granted Critical
Publication of KR101135557B1 publication Critical patent/KR101135557B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/518—Carriage stop mechanism

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020090113881A 2008-12-02 2009-11-24 기판 반송 장치 및 기판 반송 방법 Expired - Fee Related KR101135557B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-307375 2008-12-02
JP2008307375A JP4660586B2 (ja) 2008-12-02 2008-12-02 基板搬送装置、及び、基板搬送方法

Publications (2)

Publication Number Publication Date
KR20100062924A KR20100062924A (ko) 2010-06-10
KR101135557B1 true KR101135557B1 (ko) 2012-04-17

Family

ID=42222950

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090113881A Expired - Fee Related KR101135557B1 (ko) 2008-12-02 2009-11-24 기판 반송 장치 및 기판 반송 방법

Country Status (5)

Country Link
US (1) US8172291B2 (enExample)
JP (1) JP4660586B2 (enExample)
KR (1) KR101135557B1 (enExample)
CN (1) CN101752283B (enExample)
TW (1) TWI419252B (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM394568U (en) * 2010-07-23 2010-12-11 Chen Long Technology Corp Ltd Multiplexing wafer baking processing system
TWI478793B (zh) * 2010-08-04 2015-04-01 Hon Hai Prec Ind Co Ltd 夾持裝置
JP5182339B2 (ja) * 2010-08-31 2013-04-17 三星ダイヤモンド工業株式会社 基板ブレーク装置
JP2014130899A (ja) * 2012-12-28 2014-07-10 Olympus Corp 基板搬送装置、基板検査装置及び基板搬送方法
JP6059565B2 (ja) * 2013-03-13 2017-01-11 三星ダイヤモンド工業株式会社 吸着反転装置
JP2017098275A (ja) * 2014-03-28 2017-06-01 パナソニックＩｐマネジメント株式会社 半導体ウエハ搬送装置およびそれを利用した太陽電池の製造方法
JP6589419B2 (ja) * 2015-07-09 2019-10-16 株式会社デンソー 基板加工装置および基板加工方法
CN107973122B (zh) * 2016-10-21 2020-04-28 南京瀚宇彩欣科技有限责任公司 活动式支撑机构
JP7088641B2 (ja) * 2017-08-09 2022-06-21 株式会社Ｓｃｒｅｅｎ Ｓｐｅ テック 基板搬送装置
JP7079861B2 (ja) * 2019-01-16 2022-06-02 川崎重工業株式会社 ロボットハンド及びそれを備えるロボット
WO2021163553A1 (en) * 2020-02-12 2021-08-19 Jabil Inc. Apparatus, system and method for providing a flipper for in-process substrates
JP7466360B2 (ja) * 2020-04-10 2024-04-12 ニデックインスツルメンツ株式会社 産業用ロボットのハンドおよび産業用ロボット
TWI796709B (zh) * 2021-06-16 2023-03-21 盛詮科技股份有限公司 晶圓懸浮手臂

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1022364A (ja) * 1996-07-05 1998-01-23 Metsukusu:Kk 搬送装置における吸着ハンド
JP2003051525A (ja) * 2001-08-03 2003-02-21 Fujitsu Display Technologies Corp 基板搬送装置及び基板搬送方法
JP2005093893A (ja) * 2003-09-19 2005-04-07 Nec Yamagata Ltd ウェハ搬送装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10146784A (ja) * 1996-11-19 1998-06-02 Dainippon Printing Co Ltd 基板搬送用ロボットハンド
JPH11268829A (ja) * 1998-03-20 1999-10-05 Olympus Optical Co Ltd ローダ・アンローダ
JP2001277169A (ja) * 2000-04-03 2001-10-09 Matsushita Electric Ind Co Ltd ロボットハンド
JP4016622B2 (ja) * 2001-08-28 2007-12-05 セイコーエプソン株式会社 吸着保持器、搬送装置、基板の搬送方法、及び、電気光学装置の製造方法
JP4524132B2 (ja) 2004-03-30 2010-08-11 東京エレクトロン株式会社 真空処理装置
JP2006310709A (ja) * 2005-05-02 2006-11-09 Hitachi Plant Technologies Ltd 半導体ウェハ保持装置及び方法
JP2009154213A (ja) * 2006-04-11 2009-07-16 Nikon Corp 搬送装置、搬送方法、およびデバイス製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1022364A (ja) * 1996-07-05 1998-01-23 Metsukusu:Kk 搬送装置における吸着ハンド
JP2003051525A (ja) * 2001-08-03 2003-02-21 Fujitsu Display Technologies Corp 基板搬送装置及び基板搬送方法
JP2005093893A (ja) * 2003-09-19 2005-04-07 Nec Yamagata Ltd ウェハ搬送装置

Also Published As

Publication number Publication date
US20100135761A1 (en) 2010-06-03
KR20100062924A (ko) 2010-06-10
JP4660586B2 (ja) 2011-03-30
JP2010135381A (ja) 2010-06-17
US8172291B2 (en) 2012-05-08
TW201029097A (en) 2010-08-01
TWI419252B (zh) 2013-12-11
CN101752283A (zh) 2010-06-23
CN101752283B (zh) 2012-06-13

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