CN101211052B - 玻璃支撑销 - Google Patents

玻璃支撑销 Download PDF

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CN101211052B
CN101211052B CN2007103021565A CN200710302156A CN101211052B CN 101211052 B CN101211052 B CN 101211052B CN 2007103021565 A CN2007103021565 A CN 2007103021565A CN 200710302156 A CN200710302156 A CN 200710302156A CN 101211052 B CN101211052 B CN 101211052B
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pin
glass support
support pin
glass
backing
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权五晙
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SNU Precision Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
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    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
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    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04Arrangements of vacuum systems or suction cups
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
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    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133302Rigid substrates, e.g. inorganic substrates
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract

本发明提供了一种用于支撑液晶显示器件使用的玻璃基板的玻璃支撑销。在一个实施方式中,玻璃支撑销包括多个分支销,以及一个或多个弹性部件。多个分支销被构造为具有顶端。分支销的顶端沿径向方向向外展开。一个或多个弹性部件连接到分支销。通过根据玻璃支撑销的纵向移动向外地拉出分支销的顶端来打开玻璃支撑销。所述分支销的顶端包括具有预定形状的支撑顶部,所述支撑顶部当玻璃支撑销打开时接触并支撑玻璃基板。

Description

玻璃支撑销
本申请要求享有2006年12月29日在韩国递交的申请号为10-2006-0138950的申请的权益,在此引用其全部内容作为参考。
技术领域
本发明涉及一种用于制造平板显示器件的装置,特别是涉及一种在制造液晶显示(LCD)器件时使用的玻璃支撑销(glass support pin)。
背景技术
LCD器件的制造涉及在工厂设备的许多单元工艺。各单元工艺进行制造LCD器件所需的不同操作。LCD制造工艺包括传送安装有LCD器件的玻璃基板。许多单元工艺都是自动化的并且依靠机器人进行。具体地,传送机器人将玻璃基板从一个单元工艺设备传送到不同的单元工艺设备。
对准单元(aligning unit)在LCD玻璃基板在存储在盒子中时或者在LCD玻璃基板装载到不同设备之前进行LCD玻璃基板的对准工艺。对准单元包括支撑LCD玻璃基板的玻璃支撑销和对准LCD玻璃基板的对准部件。在对准工艺期间,对准部件通过使用玻璃支撑销将LCD玻璃基板移动到对准位置。在LCD玻璃基板和玻璃支撑销之间产生摩擦接触。摩擦接触导致LCD玻璃基板的表面上刮擦和破裂。
LCD玻璃基板典型地具有约0.7mm至2.2mm的厚度,该厚度远远小于其长度和宽度。因为LCD玻璃基板如此薄和大,不能高度抵抗外部冲击和下垂现象。由于LCD玻璃基板的自身重量导致严重弯曲而发生下垂现象。另外,随着LCD面板尺寸变大,当用玻璃支撑销抬起玻璃基板时破裂发生率会增高。另外,例如光刻胶膜的湿液体涂敷膜向下流动以产生污点。涂敷膜可能形成为不均匀厚度。
图1A和1B示出了根据现有技术的玻璃支撑销22和承板(carrier plate)的排列的平面图和截面图。参照图1A和1B,承板5包括卡盘21和玻璃支撑销22。玻璃支撑销22支撑玻璃基板10。机械手运输玻璃基板10并将其放置在卡盘21上。玻璃基板10随后被真空吸附到卡盘21的表面上。随后,通过使用例如光刻胶涂敷机的设备在玻璃基板10的表面涂敷光刻胶膜。
玻璃支撑销22从卡盘21提升以支撑玻璃基板10直到传送机器人从卡盘21取走玻璃基板10。玻璃支撑销22典型地以宽度为340mm和长度为365mm的间隔设置,并且总共36个玻璃支撑销22支撑图1A中的玻璃基板10的重量。施加到各支撑销的负荷是相当大的(substantial)。传送机器人将玻璃基板10传送到下一工艺的设备。机械手向玻璃支撑销22和卡盘21之间的玻璃基板10的底面移动,如图1B所示。
图2进一步详细示出了根据现有技术的玻璃支撑销22。附图标记“L”表示大玻璃基板10的长度,“d”表示玻璃支撑销22之间的距离。各玻璃支撑销包括主体22a和形成在主体22a的顶部的顶部22b。参照图2,在部分P1和部分P2之间存在高度差。部分P1没有通过卡盘21上的玻璃支撑销22来支撑,而部分P2通过卡盘21上的玻璃支撑销来支撑。这种差别是由于大玻璃基板10的重量所导致的。部分P1可能在玻璃基板10中弯曲,这样会导致玻璃基板10的背面上的破裂。因此,需要能够克服现有技术缺点的玻璃支撑销和承板。
发明内容
作为例子,在一个实施方式中,提供了一种用于支撑液晶显示器件使用的玻璃基板的玻璃支撑销。玻璃支撑销包括多个分支销以及一个或多个弹性部件。多个分支销被构造为具有顶端。分支销的顶端沿径向方向向外展开。一个或多个弹性部件连接到分支销。通过根据玻璃支撑销的纵向移动向外拉出分支销的顶端来打开玻璃支撑销。所述分支销的顶端包括具有预定形状的支撑顶部,所述支撑顶部当玻璃支撑销打开时接触并支撑玻璃基板。
在其他实施方式中,提供一种承板,用来传送液晶显示器件使用的玻璃基板。承板包括多个玻璃支撑销以及卡盘。玻璃支撑销被构造为支撑玻璃基板并且包括多个分支销。玻璃支撑销根据其垂直移动被打开以分离分支销,并且被关闭以使分支销贴近。卡盘包括容纳多个分支销的多个开口。随着玻璃支撑销从卡盘提升,其被打开,并且随着玻璃支撑销插入到卡盘的开口中,玻璃支撑销被关闭,所述分支销的顶端包括具有预定形状的支撑顶部,所述支撑顶部当玻璃支撑销打开时接触并支撑玻璃基板。
在另一实施方式中,一种设计为由要形成在玻璃基板上的液晶显示器件使用的传送系统包括卡盘和多个玻璃支撑销。卡盘被构造为支撑玻璃基板。玻璃基板被真空吸附到卡盘的表面上。玻璃支撑销包括多个分支销,随着玻璃支撑销从卡盘提升,所述分支销向外展开。随着玻璃支撑销向卡盘移动,玻璃支撑销被关闭。所述分支销的顶端包括具有预定形状的支撑顶部,所述支撑顶部当玻璃支撑销打开时接触并支撑玻璃基板,进而实现玻璃支撑销被构造为基本上同时地在多个位置接触和支撑玻璃基板。
附图说明
参照下面的附图将详细描述本文件的实现,在附图中相同的附图标记表示相同的部件。
图1A和1B示出了根据现有技术的玻璃支撑销的排列的平面图和截面图。
图2进一步示出了根据现有技术的玻璃支撑销和承板。
图3示出了具有提升状态的玻璃支撑销的第一实施方式。
图4示出了具有关闭状态的图3的玻璃支撑销。
图5A和5B示出了图3的玻璃支撑销的平面图和截面图。
图6A和6B示出了分别具有在提升状态和关闭状态的玻璃支撑销的承板。
图7示出了在提升状态的玻璃支撑销的第二实施方式。以及
图8示出了在关闭状态的图7的玻璃支撑销。
具体实施方式
以下,参照附图将详细描述根据实施方式的玻璃支撑销和承板。
图3和4示出了根据第一实施方式的玻璃支撑销。玻璃支撑销220可以按于227和229所表示的垂直移动。具体地,玻璃支撑销220从卡盘(见图5A和5B的210)提升,或者沿玻璃基板(见图5A和5B)的背面的方向朝卡盘下降。具体地,图3示出了玻璃支撑销220的提升状态,而图4示出了玻璃支撑销220的关闭状态。玻璃支撑销220包括基销221、多个分支销222、以及弹性部件224。
各分支销222从基销221分叉。各分支销222的下端部固定在基销221,并且其上端部从基销221分叉以当玻璃支撑销220被提升时支撑玻璃基板。各分支销222包括形成在其顶部的顶部223。顶部223充分接触玻璃基板的背面且支撑玻璃基板的背面。
多个分支销222从基销221径向地向外展开。作为例子,多个分支销222以相对于基销221在约30°到约60°的角度范围向外展开。分支销222优选地以约30°或更多的角度向外拉出以支撑玻璃基板。可选地,或附加地,分支销222的拉出角度小于约60°以避免妨碍机械手。
多个分支销222可以由聚醚酮醚(PEEK)或具有良好抗热性和良好化学稳当性的不锈钢材料制成。具体地,与玻璃基板接触的分支销的各顶部由PEEK制成,并且分支销的各支撑部分由SUS[MS1]制成。用于液晶显示器(LCD)的玻璃支撑销具有5Φ的直径和约100mm至约200mm的长度,并且其由包括SUS和PEEK的材料制成。与玻璃基板接触的玻璃支撑销220的顶部223为半球状或圆柱状。也可以使用各种其他的材料和形状。
弹性部件224被插入并设置在基销221和多个分支销222之间。弹性部件22传递张力(tensile force),从而使分支销222从基销221上分离,如图3所示。在该实施方式中,弹性部件224由弹簧或板簧支撑,但是可以使用各种其他的材料。
参照图4,多个分支销222处于关闭状态。分支销222回到其原始位置并关闭,从而使其接触基销211。此时,玻璃支撑销220向卡盘(如箭头229所示)下降。
图5A和5B示出了玻璃支撑销220的排列的平面图和截面图。参照图5A,例如,基销221和分支销222的总数可以超过一百个销。例如,总数可以在108和252的范围之间。图5A示出了三十六(36)个基销221和一百四十四(144)个分支销222,因为各玻璃支撑销220分叉为一个基销221和四个分支销222。
图5B示出了玻璃支撑销220从卡盘210提升以支撑玻璃基板110。在图5B中,玻璃基板100被真空吸附到卡盘210的表面上。使用例如光刻胶涂敷机的设备在玻璃基板100的表面涂敷光刻胶膜。此时,玻璃支撑销220从卡盘210提升以支撑玻璃基板100直到传送机器人取走玻璃基板100。当完成特定单元工艺时,传送机器人将玻璃基板100传送到下一工艺。
在该情况下,可以显著减少施加到各玻璃支撑销200的支撑负荷。因此,可以降低对于玻璃基板100的破裂发生率。所以,可以显著改善生产率。另外,可以用增加数量的销(例如,100个以上或更多的销)支撑更大的玻璃表面。在玻璃基板100的传送过程中可以保持均匀的涂敷膜。
图6A和6B示出了分别具有在提升状态和下降状态的玻璃支撑销220的承板。装载在普通盒上的玻璃基板100通过机械手移动到承板200上。卡盘210真空吸附玻璃基板100并具有放置玻璃支撑销220和驱动轴225的孔。驱动轴225用于将玻璃支撑销220从卡盘210提升或者将玻璃支撑销220降低到卡盘210。驱动轴225连接到子马达。
玻璃支撑销220包括基销221,其沿玻璃基板100的背面的方向被提升(如箭头227所示)或降低(如箭头229所示)。分支销222从基销221分叉并支撑玻璃基板100的背面。在该实施方式中,约两个至六个分支销222连接到弹簧224等(见图3),并且由于弹簧224,它们活动地设置在玻璃支撑销220的基销221上。
分支销222相对于基销221两侧对称地展开。分支销222在多个位置分布对玻璃基板的支撑。如上所述,设定分支销222的最大展开范围以避免妨碍传送机器人和机械手。
图6B示出了玻璃支撑销220插入到卡盘210中并且分支销222关闭。参照图4和6B,当多个分支销222移动下降到卡盘210中时,它们朝向基销221关闭。此时玻璃支撑销220插入到形成在卡盘210上的孔,也称为开口,通过孔的内壁关闭分支销222。
图7示出了玻璃支撑销320的第二实施方式。在图7中,玻璃支撑销320处于打开状态。图8示出了在关闭状态的玻璃支撑销320。参照图7,玻璃支撑销320包括基座部件321、多个分支销222、以及多个弹性部件324。基座部分321沿玻璃基板的背面的方向从卡盘210提升和向卡盘210降低。各分支销包括主体322和顶部323,其支撑玻璃基板的背面。
分支销的各下端部用基座部件321固定,并且各上端部分离(如箭头325所示)并支撑玻璃基板100的背面。顶部323连接在主体322的顶部,并且接触玻璃基板100的背面以用于支撑。多个分支销222组合成为圆柱状,并且在打开时对称地分割。弹性部件324设置在分支销222之间,并且提供使上端部彼此分离的张力。图8示出了当分支销被插入到卡盘(如箭头327所示)中时被关闭时的分支销。
如上所述,根据实施方式的玻璃支撑销根据垂直移动被打开和关闭(展开或收拢)。玻璃支撑销被构造为提供大量的支撑销以支撑较大玻璃,例如,1950mm×2250mm。此外,可以改善玻璃支撑表面的均匀性。此外,可以减少施加到各玻璃支撑销的负荷,因为负荷被较多数量的分支销分担。可以降低玻璃基板的破裂发生率。可以提高玻璃基板的生产率。
很明显,本领域技术人员可在不背离本发明精神或范围的基础上对本发明做出修改和变化。因此,本发明意欲覆盖落入本发明权利要求及其等效范围内的各种修改和变化。

Claims (19)

1.一种用于支撑液晶显示器件使用的玻璃基板的玻璃支撑销,包括:
具有顶端的多个分支销,所述分支销的顶端用于沿径向方向向外展开;以及
连接到分支销的一个或多个弹性部件;
其中通过根据玻璃支撑销的纵向移动向外移动分支销的顶端来打开玻璃支撑销,
所述分支销的顶端包括具有预定形状的支撑顶部,
其中卡盘包括容纳多个玻璃支撑销的多个开口,随着玻璃支撑销从所述卡盘提升,玻璃支撑销被打开,并且随着玻璃支撑销插入到所述卡盘的开口中,玻璃支撑销被关闭,
当玻璃支撑销打开时,所述多个分支销在玻璃基板的背面的一侧且所述支撑顶部接触并在玻璃支撑销从卡盘提升的方向上支撑玻璃基板。
2.根据权利要求1所述的玻璃支撑销,其特征在于,通过根据玻璃支撑销的纵向移动向内地推动分支销的顶端来关闭玻璃支撑销。
3.根据权利要求1所述的玻璃支撑销,其特征在于,纵向移动包括将玻璃支撑销从卡盘提升。
4.根据权利要求2所述的玻璃支撑销,其特征在于,纵向移动包括将玻璃支撑销插入到形成在卡盘中的开口中。
5.根据权利要求1所述的玻璃支撑销,其特征在于,还包括接触并支撑玻璃基板的基销,分支销通过一个或多个弹性部件连接到基销。
6.根据权利要求5所述的玻璃支撑销,其特征在于,分支销和基销的顶端基本上同时地在多个位置接触并支撑玻璃基板。
7.根据权利要求5所述的玻璃支撑销,其特征在于,弹性部件包括弹簧并且分支销展开到弹性部件的张力所允许的程度。
8.根据权利要求7所述的玻璃支撑销,其特征在于,分支销在30°和60°之间展开。
9.根据权利要求1所述的玻璃支撑销,其特征在于,当玻璃支撑销打开时,玻璃支撑销分离为分支销。
10.根据权利要求9所述的玻璃支撑销,其特征在于,通过根据玻璃支撑销的纵向移动向内地推动分支销的顶端来关闭玻璃支撑销,并且分离的分支销联合起来以形成玻璃支撑销。
11.根据权利要求9所述的玻璃支撑销,其特征在于,各弹性部件连接两个分支销。
12.根据权利要求9所述的玻璃支撑销,其特征在于,还包括用于固定分支销的另一端的基座支撑结构。
13.一种用于传送液晶显示器件使用的玻璃基板的承板,包括:
多个玻璃支撑销,玻璃支撑销用于支撑玻璃基板并且包括多个分支销,其中玻璃支撑销根据其垂直移动被打开以分离分支销,并且被关闭以使分支销贴近;以及
卡盘,包括容纳多个玻璃支撑销的多个开口;
其中,随着玻璃支撑销从卡盘提升,玻璃支撑销被打开,并且随着玻璃支撑销插入到卡盘的开口中,玻璃支撑销被关闭,
所述分支销的顶端包括具有预定形状的支撑顶部,当玻璃支撑销打开时,所述多个分支销在玻璃基板的背面的一侧且所述支撑顶部接触并在玻璃支撑销从卡盘提升的方向上支撑玻璃基板。
14.根据权利要求13所述的承板,其特征在于,单个玻璃支撑销在多个位置接触玻璃基板。
15.根据权利要求13所述的承板,其特征在于,卡盘的开口包括内壁,并且当玻璃支撑销插入到卡盘的开口中时,通过内壁向内地推动分支销。
16.根据权利要求13所述的承板,其特征在于,玻璃支撑销包括活动地紧固分支销的多个弹性部件。
17.根据权利要求15所述的承板,其特征在于,当玻璃支撑销从卡盘的开口提升出来时,分支销向外展开。
18.根据权利要求13所述的承板,其特征在于,卡盘的开口包括内壁,并且当玻璃支撑销插入到卡盘的开口中时,分支销摩擦地接触内壁。
19.一种用于传送液晶显示器件使用的玻璃基板的传送系统,包括:
卡盘,用于支撑玻璃基板并包括容纳多个玻璃支撑销的多个开口,其中玻璃基板被真空吸附到卡盘的表面上;以及
多个玻璃支撑销,每个玻璃支撑销包括多个分支销,其中随着玻璃支撑销从卡盘提升,所述分支销向外展开,随着玻璃支撑销插入到卡盘的开口中,分支销被关闭,其中所述分支销的顶端包括具有预定形状的支撑顶部,当玻璃支撑销打开时,所述多个分支销在玻璃基板的背面的一侧且所述支撑顶部接触并在玻璃支撑销从卡盘提升的方向上支撑玻璃基板,进而实现玻璃支撑销被构造为基本上同时地在多个位置接触和支撑玻璃基板。
CN2007103021565A 2006-12-29 2007-12-17 玻璃支撑销 Expired - Fee Related CN101211052B (zh)

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