KR101107043B1 - 연마 패드 - Google Patents

연마 패드 Download PDF

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Publication number
KR101107043B1
KR101107043B1 KR1020097002004A KR20097002004A KR101107043B1 KR 101107043 B1 KR101107043 B1 KR 101107043B1 KR 1020097002004 A KR1020097002004 A KR 1020097002004A KR 20097002004 A KR20097002004 A KR 20097002004A KR 101107043 B1 KR101107043 B1 KR 101107043B1
Authority
KR
South Korea
Prior art keywords
isocyanate
molecular weight
polyurethane foam
polishing
polishing pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020097002004A
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English (en)
Korean (ko)
Other versions
KR20090025375A (ko
Inventor
요시유키 나카이
쓰요시 기무라
아쓰시 가즈노
가즈유키 오가와
데쓰오 시모무라
Original Assignee
도요 고무 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007184658A external-priority patent/JP4128607B2/ja
Priority claimed from JP2007184644A external-priority patent/JP4128606B2/ja
Application filed by 도요 고무 고교 가부시키가이샤 filed Critical 도요 고무 고교 가부시키가이샤
Publication of KR20090025375A publication Critical patent/KR20090025375A/ko
Application granted granted Critical
Publication of KR101107043B1 publication Critical patent/KR101107043B1/ko
Assigned to 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 reassignment 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 권리의 전부이전등록 Assignors: 도요 고무 고교 가부시키가이샤
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/22—Rubbers synthetic or natural
    • B24D3/26—Rubbers synthetic or natural for porous or cellular structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C08G18/6666—Compounds of group C08G18/48 or C08G18/52
    • C08G18/667—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38
    • C08G18/6674—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/3203
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/721—Two or more polyisocyanates not provided for in one single group C08G18/73 - C08G18/80
    • C08G18/724—Combination of aromatic polyisocyanates with (cyclo)aliphatic polyisocyanates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/14—Manufacture of cellular products

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polyurethanes Or Polyureas (AREA)
KR1020097002004A 2006-08-28 2007-08-16 연마 패드 Expired - Fee Related KR101107043B1 (ko)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2006230805 2006-08-28
JPJP-P-2006-230805 2006-08-28
JP2006234060 2006-08-30
JPJP-P-2006-234060 2006-08-30
JP2007184658A JP4128607B2 (ja) 2006-08-28 2007-07-13 研磨パッド
JPJP-P-2007-184644 2007-07-13
JPJP-P-2007-184658 2007-07-13
JP2007184644A JP4128606B2 (ja) 2006-08-30 2007-07-13 研磨パッド
PCT/JP2007/065934 WO2008026451A1 (fr) 2006-08-28 2007-08-16 Tampon de polissage

Publications (2)

Publication Number Publication Date
KR20090025375A KR20090025375A (ko) 2009-03-10
KR101107043B1 true KR101107043B1 (ko) 2012-01-25

Family

ID=39135734

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097002004A Expired - Fee Related KR101107043B1 (ko) 2006-08-28 2007-08-16 연마 패드

Country Status (5)

Country Link
US (2) US8993648B2 (https=)
KR (1) KR101107043B1 (https=)
CN (2) CN102152233B (https=)
TW (1) TW200819472A (https=)
WO (1) WO2008026451A1 (https=)

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WO2006123559A1 (ja) * 2005-05-17 2006-11-23 Toyo Tire & Rubber Co., Ltd. 研磨パッド
US7927452B2 (en) 2005-07-15 2011-04-19 Toyo Tire & Rubber Co., Ltd. Layered sheets and processes for producing the same
JP4884725B2 (ja) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 研磨パッド
JP4884726B2 (ja) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 積層研磨パッドの製造方法
JP5008927B2 (ja) 2006-08-31 2012-08-22 東洋ゴム工業株式会社 研磨パッド
US20100009611A1 (en) * 2006-09-08 2010-01-14 Toyo Tire & Rubber Co., Ltd. Method for manufacturing a polishing pad
KR101181885B1 (ko) 2006-09-08 2012-09-11 도요 고무 고교 가부시키가이샤 연마 패드
WO2008087797A1 (ja) 2007-01-15 2008-07-24 Toyo Tire & Rubber Co., Ltd. 研磨パッド及びその製造方法
JP5078000B2 (ja) 2007-03-28 2012-11-21 東洋ゴム工業株式会社 研磨パッド
JP4593643B2 (ja) * 2008-03-12 2010-12-08 東洋ゴム工業株式会社 研磨パッド
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JP5087439B2 (ja) * 2008-03-18 2012-12-05 東洋ゴム工業株式会社 研磨パッド、研磨パッドの製造方法、及び半導体デバイスの製造方法
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TWI461451B (zh) * 2008-09-30 2014-11-21 Dainippon Ink & Chemicals 研磨墊用胺基甲酸酯樹脂組成物、聚胺基甲酸酯研磨墊及聚胺基甲酸酯研磨墊之製法
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JP5858576B2 (ja) * 2011-04-21 2016-02-10 東洋ゴム工業株式会社 積層研磨パッド用ホットメルト接着剤シート、及び積層研磨パッド用接着剤層付き支持層
WO2013089240A1 (ja) * 2011-12-16 2013-06-20 東洋ゴム工業株式会社 研磨パッド
JP5453507B1 (ja) * 2012-10-31 2014-03-26 東洋ゴム工業株式会社 研磨パッド及びその製造方法
JP5629749B2 (ja) * 2012-12-28 2014-11-26 東洋ゴム工業株式会社 研磨パッドの製造方法
CN103333313B (zh) * 2013-06-09 2015-11-18 合肥宏光研磨科技有限公司 一种聚氨酯抛光材料的制造方法
CN106041719B (zh) * 2016-06-03 2018-10-23 湖北鼎龙控股股份有限公司 一种抛光层及其制备方法以及化学机械抛光垫
US20180281149A1 (en) 2017-03-31 2018-10-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US20180345449A1 (en) * 2017-06-06 2018-12-06 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pads for improved removal rate and planarization
CN107457716B (zh) * 2017-08-29 2019-11-22 湖北鼎龙控股股份有限公司 化学机械抛光垫的抛光层
CN109824854B (zh) * 2018-12-27 2021-09-28 湖北鼎汇微电子材料有限公司 一种抛光垫
TWI743831B (zh) * 2019-06-17 2021-10-21 南韓商Ｓｋｃ索密思股份有限公司 用於研磨墊之組成物、研磨墊及半導體裝置之製備方法
CN111793186A (zh) * 2020-06-30 2020-10-20 山东一诺威聚氨酯股份有限公司 聚氨酯抛光垫片层的制备方法
CN113084695B (zh) * 2021-03-12 2022-05-13 安徽禾臣新材料有限公司 一种电子显示屏精抛用缓冲抛光垫及其生产方法
CN114515994A (zh) * 2022-03-03 2022-05-20 上海江丰平芯电子科技有限公司 一种提高晶圆边缘区域研磨率的方法

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TW200819472A (en) 2008-05-01
US9358661B2 (en) 2016-06-07
US20150059253A1 (en) 2015-03-05
US8993648B2 (en) 2015-03-31
CN102152233B (zh) 2013-10-30
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US20100003896A1 (en) 2010-01-07
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