KR101102180B1 - 신규 연성 금속박 적층판 및 그 제조방법 - Google Patents

신규 연성 금속박 적층판 및 그 제조방법 Download PDF

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Publication number
KR101102180B1
KR101102180B1 KR1020090006195A KR20090006195A KR101102180B1 KR 101102180 B1 KR101102180 B1 KR 101102180B1 KR 1020090006195 A KR1020090006195 A KR 1020090006195A KR 20090006195 A KR20090006195 A KR 20090006195A KR 101102180 B1 KR101102180 B1 KR 101102180B1
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KR
South Korea
Prior art keywords
metal foil
polyimide layer
polyimide
copper foil
layer
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Application number
KR1020090006195A
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English (en)
Korean (ko)
Other versions
KR20100086786A (ko
Inventor
박영석
백은송
김양섭
양동보
Original Assignee
주식회사 두산
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Priority to KR1020090006195A priority Critical patent/KR101102180B1/ko
Priority to US13/145,959 priority patent/US20120018197A1/en
Priority to JP2011547782A priority patent/JP5814127B2/ja
Priority to PCT/KR2010/000422 priority patent/WO2010085113A2/ko
Priority to CN2010800128683A priority patent/CN102361753A/zh
Publication of KR20100086786A publication Critical patent/KR20100086786A/ko
Application granted granted Critical
Publication of KR101102180B1 publication Critical patent/KR101102180B1/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/28—Multiple coating on one surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y10T428/24967—Absolute thicknesses specified
    • Y10T428/24975—No layer or component greater than 5 mils thick
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
KR1020090006195A 2009-01-23 2009-01-23 신규 연성 금속박 적층판 및 그 제조방법 Active KR101102180B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020090006195A KR101102180B1 (ko) 2009-01-23 2009-01-23 신규 연성 금속박 적층판 및 그 제조방법
US13/145,959 US20120018197A1 (en) 2009-01-23 2010-01-22 Novel ductile metal foil laminate and method for producing the same
JP2011547782A JP5814127B2 (ja) 2009-01-23 2010-01-22 新規な軟性金属箔積層板およびその製造方法
PCT/KR2010/000422 WO2010085113A2 (ko) 2009-01-23 2010-01-22 신규 연성 금속박 적층판 및 그 제조방법
CN2010800128683A CN102361753A (zh) 2009-01-23 2010-01-22 一种新型挠性金属箔层叠板及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090006195A KR101102180B1 (ko) 2009-01-23 2009-01-23 신규 연성 금속박 적층판 및 그 제조방법

Publications (2)

Publication Number Publication Date
KR20100086786A KR20100086786A (ko) 2010-08-02
KR101102180B1 true KR101102180B1 (ko) 2012-01-02

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090006195A Active KR101102180B1 (ko) 2009-01-23 2009-01-23 신규 연성 금속박 적층판 및 그 제조방법

Country Status (5)

Country Link
US (1) US20120018197A1 (cg-RX-API-DMAC10.html)
JP (1) JP5814127B2 (cg-RX-API-DMAC10.html)
KR (1) KR101102180B1 (cg-RX-API-DMAC10.html)
CN (1) CN102361753A (cg-RX-API-DMAC10.html)
WO (1) WO2010085113A2 (cg-RX-API-DMAC10.html)

Cited By (1)

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KR101237410B1 (ko) 2011-05-24 2013-02-27 송민화 에프씨씨엘 및 이의 제조방법과 상기 에프씨씨엘을 이용한 안테나

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KR101064816B1 (ko) * 2009-04-03 2011-09-14 주식회사 두산 폴리아믹산 용액, 폴리이미드 수지 및 이를 이용한 연성 금속박 적층판
CN102630126B (zh) * 2012-04-01 2014-04-16 松扬电子材料(昆山)有限公司 复合式双面铜箔基板及其制造方法
CN102825861B (zh) * 2012-08-16 2015-07-22 新高电子材料（中山）有限公司 导热双面挠性覆铜板及其制作方法
CN103514988B (zh) * 2012-12-14 2016-01-20 上海空间电源研究所 一种扁平式双层功率信号传输电缆及其形成方法
KR101579645B1 (ko) * 2013-04-10 2015-12-22 코오롱인더스트리 주식회사 폴리이미드 커버기판
US20150122532A1 (en) * 2013-11-04 2015-05-07 Teledyne Technologies Incorporated High temperature multilayer flexible printed wiring board
KR101582398B1 (ko) * 2014-01-06 2016-01-05 주식회사 두산 수지 이중층 부착 동박, 이를 포함하는 다층 인쇄 회로 기판 및 그 제조 방법
CN103963386B (zh) * 2014-03-05 2016-05-11 金安国纪科技股份有限公司 金属基覆铜板及其制备方法
CN103963381B (zh) * 2014-03-05 2016-02-17 金安国纪科技股份有限公司 金属基覆铜板及其制备方法
KR102056500B1 (ko) * 2014-10-24 2019-12-16 주식회사 두산 커버레이용 금속박 적층체 및 커버레이 비포함 다층 연성 인쇄회로기판
KR101705078B1 (ko) 2015-02-09 2017-02-10 도레이첨단소재 주식회사 양면 금속적층 필름의 제조방법 및 그로부터 제조되는 양면 금속적층 필름
TWI585245B (zh) * 2015-04-09 2017-06-01 柏彌蘭金屬化研究股份有限公司 單面薄型金屬基板之製造方法
TWI564145B (zh) 2015-06-17 2017-01-01 長興材料工業股份有限公司 金屬被覆積層板及其製造方法
KR101890036B1 (ko) * 2016-11-21 2018-08-22 에스디플렉스(주) 4층 구조의 연성 동박적층판의 제조 방법
US11021606B2 (en) * 2017-09-13 2021-06-01 E I Du Pont De Nemours And Company Multilayer film for electronic circuitry applications
JP7446741B2 (ja) * 2018-09-28 2024-03-11 日鉄ケミカル＆マテリアル株式会社 金属張積層板及び回路基板
KR102329838B1 (ko) * 2019-04-30 2021-11-22 도레이첨단소재 주식회사 연성 금속박 적층 필름, 이를 포함하는 물품 및 상기 연성 금속박 적층 필름의 제조방법
WO2021040289A1 (ko) * 2019-08-27 2021-03-04 주식회사 두산 연성 금속 적층판, 커버레이 필름, 이를 구비하는 연성 금속복합기판
CN119865974B (zh) * 2025-03-21 2025-07-08 深圳市实锐泰科技有限公司 一种新能源汽车用耐电压柔性电路板的制作方法

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JP2005162878A (ja) * 2003-12-02 2005-06-23 Toyobo Co Ltd ポリイミドフィルム、その製造方法およびそれを用いたベース基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101237410B1 (ko) 2011-05-24 2013-02-27 송민화 에프씨씨엘 및 이의 제조방법과 상기 에프씨씨엘을 이용한 안테나

Also Published As

Publication number Publication date
US20120018197A1 (en) 2012-01-26
WO2010085113A2 (ko) 2010-07-29
CN102361753A (zh) 2012-02-22
WO2010085113A3 (ko) 2010-11-04
KR20100086786A (ko) 2010-08-02
JP5814127B2 (ja) 2015-11-17
JP2012515671A (ja) 2012-07-12

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