KR101100441B1 - 레이저 초기 결정화 장치 - Google Patents

레이저 초기 결정화 장치 Download PDF

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Publication number
KR101100441B1
KR101100441B1 KR1020050010324A KR20050010324A KR101100441B1 KR 101100441 B1 KR101100441 B1 KR 101100441B1 KR 1020050010324 A KR1020050010324 A KR 1020050010324A KR 20050010324 A KR20050010324 A KR 20050010324A KR 101100441 B1 KR101100441 B1 KR 101100441B1
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KR
South Korea
Prior art keywords
laser
silicon wafer
wafer
phase change
substrate
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Expired - Fee Related
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KR1020050010324A
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English (en)
Korean (ko)
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KR20060041687A (ko
Inventor
모또야스 데라오
요시아끼 오기노
야스미 호리구찌
고오따로오 후지요시
Original Assignee
히다찌 컴퓨터 기끼 가부시끼가이샤
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Publication of KR20060041687A publication Critical patent/KR20060041687A/ko
Application granted granted Critical
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60G—VEHICLE SUSPENSION ARRANGEMENTS
    • B60G11/00—Resilient suspensions characterised by arrangement, location or kind of springs
    • B60G11/26—Resilient suspensions characterised by arrangement, location or kind of springs having fluid springs only, e.g. hydropneumatic springs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60G—VEHICLE SUSPENSION ARRANGEMENTS
    • B60G2202/00—Indexing codes relating to the type of spring, damper or actuator
    • B60G2202/10—Type of spring
    • B60G2202/15—Fluid spring
    • B60G2202/152—Pneumatic spring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60G—VEHICLE SUSPENSION ARRANGEMENTS
    • B60G2204/00—Indexing codes related to suspensions per se or to auxiliary parts
    • B60G2204/40—Auxiliary suspension parts; Adjustment of suspensions
    • B60G2204/43—Fittings, brackets or knuckles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60G—VEHICLE SUSPENSION ARRANGEMENTS
    • B60G2206/00—Indexing codes related to the manufacturing of suspensions: constructional features, the materials used, procedures or tools
    • B60G2206/01—Constructional features of suspension elements, e.g. arms, dampers, springs
    • B60G2206/012—Hollow or tubular elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60G—VEHICLE SUSPENSION ARRANGEMENTS
    • B60G2300/00—Indexing codes relating to the type of vehicle
    • B60G2300/02—Trucks; Load vehicles
    • B60G2300/024—Light trucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60G—VEHICLE SUSPENSION ARRANGEMENTS
    • B60G2600/00—Indexing codes relating to particular elements, systems or processes used on suspension systems or suspension control systems
    • B60G2600/22—Magnetic elements
    • B60G2600/26—Electromagnets; Solenoids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Y—INDEXING SCHEME RELATING TO ASPECTS CROSS-CUTTING VEHICLE TECHNOLOGY
    • B60Y2200/00—Type of vehicle
    • B60Y2200/10—Road Vehicles
    • B60Y2200/11—Passenger cars; Automobiles
    • B60Y2200/116—Ambulances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Y—INDEXING SCHEME RELATING TO ASPECTS CROSS-CUTTING VEHICLE TECHNOLOGY
    • B60Y2200/00—Type of vehicle
    • B60Y2200/10—Road Vehicles
    • B60Y2200/14—Trucks; Load vehicles, Busses
    • B60Y2200/141—Light trucks

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Recrystallisation Techniques (AREA)
  • Semiconductor Memories (AREA)
KR1020050010324A 2004-11-09 2005-02-04 레이저 초기 결정화 장치 Expired - Fee Related KR101100441B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00325308 2004-11-09
JP2004325308A JP2006135251A (ja) 2004-11-09 2004-11-09 レーザ結晶化装置

Publications (2)

Publication Number Publication Date
KR20060041687A KR20060041687A (ko) 2006-05-12
KR101100441B1 true KR101100441B1 (ko) 2011-12-29

Family

ID=36728495

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050010324A Expired - Fee Related KR101100441B1 (ko) 2004-11-09 2005-02-04 레이저 초기 결정화 장치

Country Status (2)

Country Link
JP (1) JP2006135251A (enExample)
KR (1) KR101100441B1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106945190A (zh) * 2016-01-07 2017-07-14 株式会社迪思科 SiC晶片的生成方法
KR20180127150A (ko) * 2017-05-18 2018-11-28 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
KR20200036145A (ko) * 2018-09-27 2020-04-07 세메스 주식회사 기판 처리 장치

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100810633B1 (ko) * 2006-05-17 2008-03-06 삼성에스디아이 주식회사 레이저 조사장치, 레이저 결정화 장치 및 그를 이용한결정화 방법
JP2008093682A (ja) * 2006-10-10 2008-04-24 Tokyo Electron Ltd レーザ発光装置の位置調整方法
JP4971060B2 (ja) * 2007-07-10 2012-07-11 日立コンピュータ機器株式会社 相変化方法及び相変化装置
KR100939679B1 (ko) * 2007-12-11 2010-02-03 (주)가하 자동 초점 조절 장치 및 그 방법
KR101001551B1 (ko) * 2008-06-18 2010-12-17 삼성모바일디스플레이주식회사 레이저 어닐링 장치
CN103578943B (zh) 2012-07-25 2017-05-31 上海微电子装备有限公司 一种激光退火装置及激光退火方法
DE102016116241A1 (de) * 2016-08-31 2018-03-01 Infineon Technologies Ag Verfahren zum bearbeiten eines wafers und verfahren zum bearbeiten eines trägers
JP6887234B2 (ja) * 2016-09-21 2021-06-16 株式会社日本製鋼所 レーザ照射装置、レーザ照射方法、及び半導体装置の製造方法
CN120637206A (zh) * 2019-12-26 2025-09-12 东京毅力科创株式会社 基板处理方法、基板处理装置以及基板处理系统
JP7159363B2 (ja) * 2021-01-21 2022-10-24 Ｊｓｗアクティナシステム株式会社 レーザ照射装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003089184A1 (en) 2002-04-18 2003-10-30 Applied Materials, Inc. Thermal flux processing by scanning electromagnetic radiation
JP2003332257A (ja) 2002-05-17 2003-11-21 Fujitsu Ltd 半導体結晶化方法及び装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55150238A (en) * 1979-05-10 1980-11-22 Matsushita Electric Ind Co Ltd Method of irradiating laser beam
JPS58197816A (ja) * 1982-05-14 1983-11-17 Nippon Telegr & Teleph Corp <Ntt> 薄膜結晶の製造方法
JPS61179524A (ja) * 1985-02-04 1986-08-12 Toshiba Corp 多結晶シリコン膜の単結晶方法
JPS62222442A (ja) * 1986-03-22 1987-09-30 Nippon Telegr & Teleph Corp <Ntt> 書換型光記録媒体
JPH0227731A (ja) * 1988-07-15 1990-01-30 Seiko Epson Corp 半導体装置
JPH06232271A (ja) * 1993-01-29 1994-08-19 Nippon Telegr & Teleph Corp <Ntt> 結線材料及び入出力制御方法
JPH0724587A (ja) * 1993-07-13 1995-01-27 Matsushita Electric Ind Co Ltd レーザ照射装置
JPH1126393A (ja) * 1997-07-09 1999-01-29 Sanyo Electric Co Ltd レーザーアニール装置
JP3481215B2 (ja) * 2001-03-30 2003-12-22 岩手県 レーザー加熱装置及びレーザー加熱方法
JP2003234288A (ja) * 2002-02-07 2003-08-22 Sony Corp 多結晶半導体膜と半導体素子の製造方法及び製造装置
JP2004103628A (ja) * 2002-09-05 2004-04-02 Hitachi Ltd レーザアニール装置及びｔｆｔ基板のレーザアニール方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003089184A1 (en) 2002-04-18 2003-10-30 Applied Materials, Inc. Thermal flux processing by scanning electromagnetic radiation
JP2003332257A (ja) 2002-05-17 2003-11-21 Fujitsu Ltd 半導体結晶化方法及び装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106945190A (zh) * 2016-01-07 2017-07-14 株式会社迪思科 SiC晶片的生成方法
CN106945190B (zh) * 2016-01-07 2020-06-30 株式会社迪思科 SiC晶片的生成方法
KR20180127150A (ko) * 2017-05-18 2018-11-28 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
KR102000015B1 (ko) * 2017-05-18 2019-07-17 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
KR20200036145A (ko) * 2018-09-27 2020-04-07 세메스 주식회사 기판 처리 장치
KR102117355B1 (ko) * 2018-09-27 2020-06-02 세메스 주식회사 기판 처리 장치

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Publication number Publication date
JP2006135251A (ja) 2006-05-25
KR20060041687A (ko) 2006-05-12

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