KR101071368B1 - 클리닝장치 및 클리닝방법 - Google Patents

클리닝장치 및 클리닝방법 Download PDF

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Publication number
KR101071368B1
KR101071368B1 KR1020080095364A KR20080095364A KR101071368B1 KR 101071368 B1 KR101071368 B1 KR 101071368B1 KR 1020080095364 A KR1020080095364 A KR 1020080095364A KR 20080095364 A KR20080095364 A KR 20080095364A KR 101071368 B1 KR101071368 B1 KR 101071368B1
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South Korea
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pressure
adhesive sheet
cleaning
sheet
sensitive adhesive
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KR20100024872A (ko
Inventor
가즈유키 이케나가
츠토무 데츠카
무네오 후루세
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가부시키가이샤 히다치 하이테크놀로지즈
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4407—Cleaning of reactor or reactor parts by using wet or mechanical methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cleaning In General (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
KR1020080095364A 2008-08-26 2008-09-29 클리닝장치 및 클리닝방법 Active KR101071368B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-00216343 2008-08-26
JP2008216343A JP5038259B2 (ja) 2008-08-26 2008-08-26 クリーニング装置およびクリーニング方法

Publications (2)

Publication Number Publication Date
KR20100024872A KR20100024872A (ko) 2010-03-08
KR101071368B1 true KR101071368B1 (ko) 2011-10-07

Family

ID=41723171

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KR1020080095364A Active KR101071368B1 (ko) 2008-08-26 2008-09-29 클리닝장치 및 클리닝방법

Country Status (4)

Country Link
US (2) US8006340B2 (enExample)
JP (1) JP5038259B2 (enExample)
KR (1) KR101071368B1 (enExample)
TW (1) TWI409110B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9289520B2 (en) * 2014-02-27 2016-03-22 Kimberly-Clark Worldwide, Inc. Method and system to clean microorganisms without chemicals
DE102014109349A1 (de) * 2014-07-04 2016-01-21 Aixtron Se Vorrichtung zum Reinigen einer Gasaustrittsfläche eines Gaseinlassorgans eines CVD-Reaktors
JP6812264B2 (ja) * 2017-02-16 2021-01-13 東京エレクトロン株式会社 真空処理装置、及びメンテナンス装置
WO2019219163A1 (en) * 2018-05-14 2019-11-21 Applied Materials, Inc. Cleaning device for attracting particles in a substrate processing system, processing system for processing a substrate, and method of operation of a cleaning device
CN111938521B (zh) * 2018-07-25 2021-07-30 南京溧水高新产业股权投资有限公司 一种用于瓷砖地板的贴纸用水清除机构及使用方法
US12080528B2 (en) * 2019-11-01 2024-09-03 Lam Research Corporation Systems and methods for cleaning a showerhead
CN111822420B (zh) * 2020-07-15 2022-06-24 郑州龙华机电工程有限公司 一种基于物联网的电力设备检修系统
CN114308907B (zh) * 2022-02-23 2023-11-28 深圳市震华等离子体智造有限公司 一种用于精密分析仪器的等离子清洗装置
JP1783959S (ja) 2023-11-01 2024-11-07 ウェブ搬送用ガイド部材

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10147037A (ja) 1996-11-15 1998-06-02 Ricoh Co Ltd クリーニングシート
JP2002192084A (ja) 2000-12-27 2002-07-10 Nitto Denko Corp クリーニングシ―ト、及びこれを用いた基板処理装置のクリーニング方法
KR100786437B1 (ko) 2000-06-06 2007-12-17 닛토덴코 가부시키가이샤 클리닝 시트, 이를 사용하는 반송 부재, 및 이들을 사용한 기판 처리 장치의 클리닝 방법

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3201904A (en) * 1961-11-09 1965-08-24 Corning Glass Works Apparatus for finishing glass surfaces
US3654654A (en) * 1969-11-14 1972-04-11 Xerox Corp Cleaning apparatus
US4313284A (en) * 1980-03-27 1982-02-02 Monsanto Company Apparatus for improving flatness of polished wafers
JP3313505B2 (ja) * 1994-04-14 2002-08-12 株式会社日立製作所 研磨加工法
US5671476A (en) * 1995-02-02 1997-09-23 Mita Industrial Co., Ltd. Image forming machine with cleaning drum brush driven by rotating drum
US5908530A (en) * 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
JP3561070B2 (ja) * 1996-02-01 2004-09-02 彰 水野 除塵方法及び除塵シ−ト
JP4427826B2 (ja) * 1997-01-24 2010-03-10 日東電工株式会社 除塵方法
US6769969B1 (en) * 1997-03-06 2004-08-03 Keltech Engineering, Inc. Raised island abrasive, method of use and lapping apparatus
US6149506A (en) * 1998-10-07 2000-11-21 Keltech Engineering Lapping apparatus and method for high speed lapping with a rotatable abrasive platen
JPH10321604A (ja) * 1997-05-22 1998-12-04 Nec Kyushu Ltd プラズマ処理装置
US5931719A (en) * 1997-08-25 1999-08-03 Lsi Logic Corporation Method and apparatus for using pressure differentials through a polishing pad to improve performance in chemical mechanical polishing
JP2000021832A (ja) 1998-07-03 2000-01-21 Asahi Sunac Corp ワーク洗浄方法及び装置
US6439967B2 (en) * 1998-09-01 2002-08-27 Micron Technology, Inc. Microelectronic substrate assembly planarizing machines and methods of mechanical and chemical-mechanical planarization of microelectronic substrate assemblies
US6227955B1 (en) * 1999-04-20 2001-05-08 Micron Technology, Inc. Carrier heads, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
JP4718667B2 (ja) * 1999-11-09 2011-07-06 日東電工株式会社 クリーニングシ―ト
US20040020789A1 (en) * 2000-02-17 2004-02-05 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6848970B2 (en) * 2002-09-16 2005-02-01 Applied Materials, Inc. Process control in electrochemically assisted planarization
US6979248B2 (en) * 2002-05-07 2005-12-27 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6991526B2 (en) * 2002-09-16 2006-01-31 Applied Materials, Inc. Control of removal profile in electrochemically assisted CMP
US6991528B2 (en) * 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6962524B2 (en) * 2000-02-17 2005-11-08 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7066800B2 (en) * 2000-02-17 2006-06-27 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US7141146B2 (en) * 2000-02-23 2006-11-28 Asm Nutool, Inc. Means to improve center to edge uniformity of electrochemical mechanical processing of workpiece surface
US6581276B2 (en) * 2000-04-04 2003-06-24 Amerasia International Technology, Inc. Fine-pitch flexible connector, and method for making same
US7520800B2 (en) * 2003-04-16 2009-04-21 Duescher Wayne O Raised island abrasive, lapping apparatus and method of use
KR20040011433A (ko) * 2000-11-21 2004-02-05 엠이엠씨 일렉트로닉 머티리얼스 쏘시에떼 퍼 아찌오니 반도체 웨이퍼, 연마 장치 및 방법
US20040192172A1 (en) * 2001-06-14 2004-09-30 Dan Towery Oxidizing polishing slurries for low dielectric constant materials
US6776693B2 (en) * 2001-12-19 2004-08-17 Applied Materials Inc. Method and apparatus for face-up substrate polishing
JP2004082038A (ja) 2002-08-28 2004-03-18 Seiko Epson Corp 超音波洗浄方法、超音波洗浄装置および、超音波洗浄ノズルのノズル部の製造方法
US7289759B2 (en) * 2004-08-27 2007-10-30 Canon Kabushiki Kaisha Cleaning apparatus
US7772295B2 (en) * 2005-02-04 2010-08-10 Denki Kagaku Kogyo Kabushiki Kaisha Resin compositions, cured article obtained therefrom, and sheet
JP2007019443A (ja) * 2005-07-06 2007-01-25 Creative Technology:Kk 導電性ウエハ
TWI420579B (zh) * 2005-07-12 2013-12-21 Creative Tech Corp And a foreign matter removing method for a substrate
JP4817293B2 (ja) 2005-10-26 2011-11-16 旭サナック株式会社 ワーク洗浄方法及びワーク洗浄システム
JP2007277631A (ja) * 2006-04-06 2007-10-25 Konica Minolta Holdings Inc ガスバリア性薄膜積層体の製造方法、ガスバリア性薄膜積層体、ガスバリア性樹脂基材及び有機エレクトロルミネッセンスデバイス
US7880371B2 (en) * 2006-11-03 2011-02-01 Danfoss A/S Dielectric composite and a method of manufacturing a dielectric composite
JP2008141049A (ja) 2006-12-04 2008-06-19 Sharp Corp 洗浄装置および洗浄方法
JP2008172038A (ja) * 2007-01-12 2008-07-24 Hitachi High-Technologies Corp プラズマ処理装置およびプラズマ処理方法
US20080176018A1 (en) * 2007-01-20 2008-07-24 Enniss James P Film having an electrically conductive coating

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10147037A (ja) 1996-11-15 1998-06-02 Ricoh Co Ltd クリーニングシート
KR100786437B1 (ko) 2000-06-06 2007-12-17 닛토덴코 가부시키가이샤 클리닝 시트, 이를 사용하는 반송 부재, 및 이들을 사용한 기판 처리 장치의 클리닝 방법
JP2002192084A (ja) 2000-12-27 2002-07-10 Nitto Denko Corp クリーニングシ―ト、及びこれを用いた基板処理装置のクリーニング方法

Also Published As

Publication number Publication date
TWI409110B (zh) 2013-09-21
JP5038259B2 (ja) 2012-10-03
TW201008670A (en) 2010-03-01
US20100294315A1 (en) 2010-11-25
KR20100024872A (ko) 2010-03-08
US8024831B2 (en) 2011-09-27
US20100050349A1 (en) 2010-03-04
US8006340B2 (en) 2011-08-30
JP2010056113A (ja) 2010-03-11

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