KR101054356B1 - 접합 기판의 스크라이브 방법 - Google Patents
접합 기판의 스크라이브 방법 Download PDFInfo
- Publication number
- KR101054356B1 KR101054356B1 KR1020090081125A KR20090081125A KR101054356B1 KR 101054356 B1 KR101054356 B1 KR 101054356B1 KR 1020090081125 A KR1020090081125 A KR 1020090081125A KR 20090081125 A KR20090081125 A KR 20090081125A KR 101054356 B1 KR101054356 B1 KR 101054356B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- board
- scribe line
- product
- scribe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mining & Mineral Resources (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008264523A JP5192977B2 (ja) | 2008-10-10 | 2008-10-10 | 貼り合せ基板のスクライブ方法 |
| JPJP-P-2008-264523 | 2008-10-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20100040662A KR20100040662A (ko) | 2010-04-20 |
| KR101054356B1 true KR101054356B1 (ko) | 2011-08-04 |
Family
ID=41491691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020090081125A Expired - Fee Related KR101054356B1 (ko) | 2008-10-10 | 2009-08-31 | 접합 기판의 스크라이브 방법 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP2174762B1 (https=) |
| JP (1) | JP5192977B2 (https=) |
| KR (1) | KR101054356B1 (https=) |
| CN (1) | CN101722581B (https=) |
| TW (1) | TW201032974A (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5156080B2 (ja) * | 2010-11-05 | 2013-03-06 | 三星ダイヤモンド工業株式会社 | 貼り合せ基板のスクライブ方法 |
| TWI462885B (zh) * | 2010-12-13 | 2014-12-01 | Mitsuboshi Diamond Ind Co Ltd | Method of breaking the substrate |
| JP5133436B2 (ja) * | 2011-03-08 | 2013-01-30 | シャープ株式会社 | 液晶パネルの製造方法 |
| JP2015034112A (ja) * | 2013-08-09 | 2015-02-19 | 三星ダイヤモンド工業株式会社 | 積層セラミックス基板の分断方法 |
| JP6243699B2 (ja) * | 2013-10-25 | 2017-12-06 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の分断装置 |
| JP6432245B2 (ja) * | 2014-09-26 | 2018-12-05 | 三星ダイヤモンド工業株式会社 | 基板分断方法 |
| CN104280922B (zh) * | 2014-10-27 | 2017-05-03 | 京东方科技集团股份有限公司 | 一种液晶屏玻璃切割方法和装置 |
| CN109079909A (zh) * | 2017-06-14 | 2018-12-25 | 张家港康得新光电材料有限公司 | 利用保护膜的产品加工方法 |
| CN117283622B (zh) * | 2023-09-28 | 2025-11-14 | 广州弘亚数控机械集团股份有限公司 | 一种释放板材应力的板材切割方法、装置及存储介质 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030076719A (ko) * | 2001-03-16 | 2003-09-26 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 스크라이브 방법, 커터 휠 및 그 커터 휠을이용하는 스크라이브 장치, 그 커터 휠을 제조하는커터 휠 제조장치 |
| JP2006273711A (ja) * | 2001-04-02 | 2006-10-12 | Mitsuboshi Diamond Industrial Co Ltd | 貼り合わせ基板の分断方法 |
| KR20080028766A (ko) * | 2006-09-27 | 2008-04-01 | 니시야마 스테인레스 케미컬 가부시키가이샤 | 접합 유리판의 절단 분리 방법 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3042192B2 (ja) * | 1992-07-29 | 2000-05-15 | 三星ダイヤモンド工業株式会社 | 貼り合せガラス基板の裁断方法及びその装置 |
| JPH11305181A (ja) * | 1998-04-17 | 1999-11-05 | Mitsubishi Electric Corp | 液晶表示パネルの切断条件設定方法 |
| JP3965902B2 (ja) * | 2000-05-23 | 2007-08-29 | 株式会社日立製作所 | 液晶表示装置の製造方法 |
| TW528736B (en) * | 2001-04-02 | 2003-04-21 | Mitsuboshi Diamond Ind Co Ltd | Cutter wheel, device and method using the cutter wheel, method of dividing laminated substrate, and method and device for manufacturing cutter wheel |
| TWI226877B (en) * | 2001-07-12 | 2005-01-21 | Mitsuboshi Diamond Ind Co Ltd | Method of manufacturing adhered brittle material substrates and method of separating adhered brittle material substrates |
| US20040123717A1 (en) * | 2002-04-02 | 2004-07-01 | Kazuya Maekawa | Cutter wheel, device and method using the cutter wheel, method of dividing laminated substrate, and method and device for manufacturing cutter wheel |
| WO2005113212A1 (ja) * | 2004-05-20 | 2005-12-01 | Mitsuboshi Diamond Industrial Co., Ltd. | マザー基板分断方法、マザー基板スクライブ装置、プログラムおよび記録媒体 |
-
2008
- 2008-10-10 JP JP2008264523A patent/JP5192977B2/ja not_active Expired - Fee Related
-
2009
- 2009-08-31 KR KR1020090081125A patent/KR101054356B1/ko not_active Expired - Fee Related
- 2009-09-25 CN CN2009101788069A patent/CN101722581B/zh not_active Expired - Fee Related
- 2009-09-30 EP EP09171792.6A patent/EP2174762B1/en not_active Not-in-force
- 2009-10-06 TW TW098133857A patent/TW201032974A/zh not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030076719A (ko) * | 2001-03-16 | 2003-09-26 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 스크라이브 방법, 커터 휠 및 그 커터 휠을이용하는 스크라이브 장치, 그 커터 휠을 제조하는커터 휠 제조장치 |
| JP2006273711A (ja) * | 2001-04-02 | 2006-10-12 | Mitsuboshi Diamond Industrial Co Ltd | 貼り合わせ基板の分断方法 |
| KR20080028766A (ko) * | 2006-09-27 | 2008-04-01 | 니시야마 스테인레스 케미컬 가부시키가이샤 | 접합 유리판의 절단 분리 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20100040662A (ko) | 2010-04-20 |
| JP5192977B2 (ja) | 2013-05-08 |
| TWI357851B (https=) | 2012-02-11 |
| CN101722581A (zh) | 2010-06-09 |
| JP2010090022A (ja) | 2010-04-22 |
| EP2174762B1 (en) | 2014-08-13 |
| EP2174762A1 (en) | 2010-04-14 |
| CN101722581B (zh) | 2012-10-17 |
| TW201032974A (en) | 2010-09-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101054356B1 (ko) | 접합 기판의 스크라이브 방법 | |
| JP5542976B2 (ja) | 貼り合せ基板スクライブ加工装置 | |
| JP5185379B2 (ja) | マザー基板の基板加工方法 | |
| CN105592994A (zh) | 用于加工具有透明层、玻璃层、玻璃状层、陶瓷层和/或结晶层的板状工件的方法,用于这类工件的分割装置以及由这类工件制成的产品 | |
| TW201502095A (zh) | 貼合基板之分斷裝置 | |
| KR20130110701A (ko) | 표시 장치용 글라스 기판 및 이의 제조 방법 | |
| CN103896481A (zh) | 用于形成触摸面板的强化玻璃基板的制造方法 | |
| JP2008292997A5 (https=) | ||
| WO2015182241A1 (ja) | 脆性基板の分断方法 | |
| CN101251669A (zh) | 液晶面板显示单元的制造方法及其结构 | |
| TW201441168A (zh) | 基板加工系統及基板加工方法 | |
| TWI696228B (zh) | 基板之分斷方法及分斷裝置 | |
| JP5193298B2 (ja) | マザー基板からの単位表示パネルの取り出し方法 | |
| JP2016008152A (ja) | 脆性基板の分断方法および表示パネルの製造方法 | |
| JP5330731B2 (ja) | 貼り合わせガラス基板の加工方法 | |
| JP2014214054A (ja) | 貼り合わせ基板の加工装置 | |
| JP2016074583A (ja) | 接合基板の切断方法 | |
| JP2006259566A (ja) | 表示装置とその製造方法 | |
| JP2015063415A (ja) | ガラスフィルム、及びガラスフィルム積層体、並びにガラスフィルムの切断方法 | |
| JP2014097908A (ja) | 化学強化ガラス、及び化学強化ガラスの割断方法 | |
| KR20030019883A (ko) | 액정표시 패널의 제조방법 | |
| KR100943269B1 (ko) | 조립기판으로부터 액정표시패널을 분리하는 방법 | |
| JP6175156B2 (ja) | 基板の分断装置 | |
| JP2008083356A (ja) | 表示パネルおよび表示パネルの端縁処理方法 | |
| JP2006154254A (ja) | 液晶表示パネルの製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| D13-X000 | Search requested |
St.27 status event code: A-1-2-D10-D13-srh-X000 |
|
| D14-X000 | Search report completed |
St.27 status event code: A-1-2-D10-D14-srh-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| FPAY | Annual fee payment |
Payment date: 20150626 Year of fee payment: 5 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| FPAY | Annual fee payment |
Payment date: 20160630 Year of fee payment: 6 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
| FPAY | Annual fee payment |
Payment date: 20170704 Year of fee payment: 7 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 7 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20180730 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20180730 |