KR101053014B1 - 얼라인먼트 방법, 침끝위치 검출 장치 및 프로브 장치 - Google Patents

얼라인먼트 방법, 침끝위치 검출 장치 및 프로브 장치 Download PDF

Info

Publication number
KR101053014B1
KR101053014B1 KR1020090028177A KR20090028177A KR101053014B1 KR 101053014 B1 KR101053014 B1 KR 101053014B1 KR 1020090028177 A KR1020090028177 A KR 1020090028177A KR 20090028177 A KR20090028177 A KR 20090028177A KR 101053014 B1 KR101053014 B1 KR 101053014B1
Authority
KR
South Korea
Prior art keywords
probes
needle tip
contact
pressure
sensor unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020090028177A
Other languages
English (en)
Korean (ko)
Other versions
KR20090105854A (ko
Inventor
히로시 야마다
마사루 스즈키
데츠지 와타나베
다케시 가와지
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20090105854A publication Critical patent/KR20090105854A/ko
Application granted granted Critical
Publication of KR101053014B1 publication Critical patent/KR101053014B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1020090028177A 2008-04-02 2009-04-01 얼라인먼트 방법, 침끝위치 검출 장치 및 프로브 장치 Expired - Fee Related KR101053014B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008096646A JP5260119B2 (ja) 2008-04-02 2008-04-02 アライメント方法
JPJP-P-2008-096646 2008-04-02

Publications (2)

Publication Number Publication Date
KR20090105854A KR20090105854A (ko) 2009-10-07
KR101053014B1 true KR101053014B1 (ko) 2011-07-29

Family

ID=41132664

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090028177A Expired - Fee Related KR101053014B1 (ko) 2008-04-02 2009-04-01 얼라인먼트 방법, 침끝위치 검출 장치 및 프로브 장치

Country Status (5)

Country Link
US (1) US7772862B2 (enExample)
JP (1) JP5260119B2 (enExample)
KR (1) KR101053014B1 (enExample)
CN (2) CN101551231B (enExample)
TW (1) TWI464817B (enExample)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7724007B2 (en) * 2007-09-28 2010-05-25 Tokyo Electron Limited Probe apparatus and probing method
JP5088167B2 (ja) * 2008-02-22 2012-12-05 東京エレクトロン株式会社 プローブ装置、プロービング方法及び記憶媒体
JP5250279B2 (ja) * 2008-02-23 2013-07-31 東京エレクトロン株式会社 プローブ装置
JP5295588B2 (ja) * 2008-02-28 2013-09-18 東京エレクトロン株式会社 プローブカードの傾き調整方法、プローブカードの傾き検出方法及びプローブカードの傾き検出方法を記録したプログラム記録媒体
JP2012204695A (ja) * 2011-03-25 2012-10-22 Tokyo Electron Ltd プローブカード検出装置、ウエハの位置合わせ装置及びウエハの位置合わせ方法
JP5260703B2 (ja) * 2011-06-10 2013-08-14 パナソニック株式会社 ３次元測定方法
CN103513069B (zh) * 2012-06-21 2016-05-25 深圳麦逊电子有限公司 测试探针装置
WO2014004873A1 (en) * 2012-06-29 2014-01-03 Rudolph Technologies Inc. Flying sensor head
CN103809100B (zh) * 2014-03-07 2016-03-09 上海华虹宏力半导体制造有限公司 晶圆自动测试系统
US11159784B2 (en) * 2014-10-23 2021-10-26 Cognex Corporation System and method for calibrating a vision system with respect to a touch probe
CN104459230A (zh) * 2014-11-26 2015-03-25 上海华力微电子有限公司 一种探针保护装置
CN104502874A (zh) * 2014-11-26 2015-04-08 上海华力微电子有限公司 一种有效控制探针卡内探针的针径的方法
TWI528041B (zh) * 2015-04-30 2016-04-01 The method of adjusting the displacement distance of the probe according to the horizontal position of the plurality of points to be measured
JP6418118B2 (ja) * 2015-09-24 2018-11-07 三菱電機株式会社 半導体装置の評価装置及び評価方法
JP6478891B2 (ja) * 2015-10-07 2019-03-06 三菱電機株式会社 プローブ位置検査装置
JP6406221B2 (ja) * 2015-11-17 2018-10-17 三菱電機株式会社 半導体装置の評価装置及び評価方法
JP6515819B2 (ja) * 2016-01-08 2019-05-22 三菱電機株式会社 評価装置、プローブ位置の検査方法
CN105632960B (zh) * 2016-01-15 2018-04-17 上海华虹宏力半导体制造有限公司 优化探针台测试针压参数的方法
JP5971638B1 (ja) * 2016-05-12 2016-08-17 株式会社三重木型製作所 接触検出装置
JP6737002B2 (ja) * 2016-06-17 2020-08-05 オムロン株式会社 プローブピン
US10371718B2 (en) 2016-11-14 2019-08-06 International Business Machines Corporation Method for identification of proper probe placement on printed circuit board
US10509071B2 (en) * 2016-11-18 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for aligning probe card in semiconductor device testing
JP6869123B2 (ja) * 2017-06-23 2021-05-12 東京エレクトロン株式会社 プローブ装置及び針跡転写方法
TWI652483B (zh) * 2017-12-12 2019-03-01 穩懋半導體股份有限公司 用於晶圓針測系統之非均質性接收器與非等向性發射器之對位方法
CN110376502B (zh) * 2018-04-13 2022-01-04 致伸科技股份有限公司 电路检测系统及其方法
CN113454467B (zh) * 2019-02-21 2025-03-21 维耶尔公司 用于微装置检验的探针结构
CN109884501B (zh) * 2019-03-06 2022-04-19 惠科股份有限公司 一种检测机台、断线短路检测机及校正方法
CN110927549B (zh) * 2019-11-21 2021-11-16 广西天微电子有限公司 晶圆重定位方法及其系统
CN110986774A (zh) * 2019-12-17 2020-04-10 上海嘉奥信息科技发展有限公司 基于光学定位仪的工具尖端位置的静态标定系统、方法、介质及设备
CN111174729B (zh) * 2020-03-05 2021-09-24 山东省科学院激光研究所 单点渐进成形加工用测量板材路径成形系统
CN111766416B (zh) * 2020-08-14 2020-12-08 强一半导体（苏州）有限公司 一种导引板mems探针结构与转接层的对接方法
CN113917202B (zh) * 2021-09-23 2023-09-12 合肥欣奕华智能机器股份有限公司 探针安装高度校准设备、方法、控制器及计算机存储介质
KR102879841B1 (ko) * 2024-02-16 2025-11-04 엠아이알티앤에스 주식회사 웨이퍼 컨택핀 검사 장치

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001189353A (ja) * 2000-01-04 2001-07-10 Toshiba Corp プローブ検査装置及びプローブ検査方法
KR20070115737A (ko) * 2006-05-31 2007-12-06 동경 엘렉트론 주식회사 프로브선단의 검출 방법, 얼라인먼트 방법 및 이들방법들을 기록한 기억 매체, 및 프로브 장치

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02224260A (ja) 1988-11-02 1990-09-06 Tokyo Electron Ltd 位置合わせ方法
JPH0567059A (ja) 1991-09-09 1993-03-19 Toshiba Corp ネツトワーク計算機システム
JPH06163651A (ja) * 1992-11-18 1994-06-10 Hitachi Ltd 半導体ウェハ検査装置
US5657394A (en) * 1993-06-04 1997-08-12 Integrated Technology Corporation Integrated circuit probe card inspection system
US5644245A (en) * 1993-11-24 1997-07-01 Tokyo Electron Limited Probe apparatus for inspecting electrical characteristics of a microelectronic element
US7009415B2 (en) * 1999-10-06 2006-03-07 Tokyo Electron Limited Probing method and probing apparatus
JP2005079253A (ja) * 2003-08-29 2005-03-24 Tokyo Electron Ltd 検査方法及び検査装置
JP4950719B2 (ja) * 2007-03-23 2012-06-13 東京エレクトロン株式会社 プローブの針先位置の検出方法、アライメント方法、針先位置検出装置及びプローブ装置
JP5250279B2 (ja) * 2008-02-23 2013-07-31 東京エレクトロン株式会社 プローブ装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001189353A (ja) * 2000-01-04 2001-07-10 Toshiba Corp プローブ検査装置及びプローブ検査方法
KR20070115737A (ko) * 2006-05-31 2007-12-06 동경 엘렉트론 주식회사 프로브선단의 검출 방법, 얼라인먼트 방법 및 이들방법들을 기록한 기억 매체, 및 프로브 장치

Also Published As

Publication number Publication date
KR20090105854A (ko) 2009-10-07
CN101551231B (zh) 2011-12-21
TW201003813A (en) 2010-01-16
CN102426331A (zh) 2012-04-25
JP2009252853A (ja) 2009-10-29
US7772862B2 (en) 2010-08-10
CN102426331B (zh) 2015-09-23
CN101551231A (zh) 2009-10-07
TWI464817B (zh) 2014-12-11
JP5260119B2 (ja) 2013-08-14
US20090251163A1 (en) 2009-10-08

Similar Documents

Publication Publication Date Title
KR101053014B1 (ko) 얼라인먼트 방법, 침끝위치 검출 장치 및 프로브 장치
KR100945328B1 (ko) 프로브의 침끝위치의 검출 방법, 얼라이먼트 방법,침끝위치 검출 장치 및 프로브 장치
KR101078995B1 (ko) 프로브 카드의 기울기 조정 방법, 프로브 카드의 기울기 검출 방법 및 프로브 카드의 기울기 검출 방법을 기록한 프로그램 기록 매체
US6906546B2 (en) Semiconductor device inspection apparatus and inspection method
US5585738A (en) Probe system having vertical height detection and double focal image pickup coinciding with probe contact in height adjustment
KR100657105B1 (ko) 프로브 방법 및 장치
US7719297B2 (en) Probe apparatus and method for measuring electrical characteristics of chips and storage medium therefor
JP4339631B2 (ja) 検査方法及び検査装置
KR101099990B1 (ko) 프로브 장치, 프로빙 방법, 및 기록 매체
KR20090091268A (ko) 프로브의 침적 전사 부재 및 프로브 장치
JP5571224B2 (ja) 針先位置検出装置及びプローブ装置
TW200814217A (en) Probe end detection method, alignment method, recording medium recorded with method, and probe device
US7034563B1 (en) Apparatus for measuring of thin dielectric layer properties on semiconductor wafers with contact self aligning electrodes
CN118339461A (zh) 检查方法、校正量计算方法和检查装置
CN119738683A (zh) 一种用于封装基板无源测试的方法及装置
JP2023085186A (ja) 検査方法、補正量算出方法および検査装置

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20140716

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20150626

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20160630

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20170704

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20180717

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20230726

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20230726