CN111766416B - 一种导引板mems探针结构与转接层的对接方法 - Google Patents
一种导引板mems探针结构与转接层的对接方法 Download PDFInfo
- Publication number
- CN111766416B CN111766416B CN202010816201.4A CN202010816201A CN111766416B CN 111766416 B CN111766416 B CN 111766416B CN 202010816201 A CN202010816201 A CN 202010816201A CN 111766416 B CN111766416 B CN 111766416B
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- Prior art keywords
- guide plate
- mems probe
- probe structure
- mems
- switching layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
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Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202010816201.4A CN111766416B (zh) | 2020-08-14 | 2020-08-14 | 一种导引板mems探针结构与转接层的对接方法 |
Applications Claiming Priority (1)
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CN202010816201.4A CN111766416B (zh) | 2020-08-14 | 2020-08-14 | 一种导引板mems探针结构与转接层的对接方法 |
Publications (2)
Publication Number | Publication Date |
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CN111766416A CN111766416A (zh) | 2020-10-13 |
CN111766416B true CN111766416B (zh) | 2020-12-08 |
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CN202010816201.4A Active CN111766416B (zh) | 2020-08-14 | 2020-08-14 | 一种导引板mems探针结构与转接层的对接方法 |
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CN (1) | CN111766416B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111766418B (zh) * | 2020-08-14 | 2021-01-19 | 强一半导体(苏州)有限公司 | Mems探针卡 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1752759A (zh) * | 2004-09-21 | 2006-03-29 | 旺矽科技股份有限公司 | 集成电路测试卡 |
TW201003813A (en) * | 2008-04-02 | 2010-01-16 | Tokyo Electron Ltd | Alignment method, tip position detecting device and probe apparatus |
CN103698561A (zh) * | 2013-11-04 | 2014-04-02 | 威盛电子股份有限公司 | 探针卡 |
CN104181448A (zh) * | 2014-08-13 | 2014-12-03 | 华进半导体封装先导技术研发中心有限公司 | 一种硅通孔转接板晶圆测试系统和硅通孔转接板晶圆测试方法 |
CN107271729A (zh) * | 2017-06-12 | 2017-10-20 | 上海华岭集成电路技术股份有限公司 | 一种测试通用转接接口 |
CN109425813A (zh) * | 2017-08-18 | 2019-03-05 | 中华精测科技股份有限公司 | 检测装置 |
CN109839522A (zh) * | 2017-11-24 | 2019-06-04 | 中华精测科技股份有限公司 | 探针卡装置及其信号转接模块 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5371654A (en) * | 1992-10-19 | 1994-12-06 | International Business Machines Corporation | Three dimensional high performance interconnection package |
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2020
- 2020-08-14 CN CN202010816201.4A patent/CN111766416B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1752759A (zh) * | 2004-09-21 | 2006-03-29 | 旺矽科技股份有限公司 | 集成电路测试卡 |
TW201003813A (en) * | 2008-04-02 | 2010-01-16 | Tokyo Electron Ltd | Alignment method, tip position detecting device and probe apparatus |
CN103698561A (zh) * | 2013-11-04 | 2014-04-02 | 威盛电子股份有限公司 | 探针卡 |
CN104181448A (zh) * | 2014-08-13 | 2014-12-03 | 华进半导体封装先导技术研发中心有限公司 | 一种硅通孔转接板晶圆测试系统和硅通孔转接板晶圆测试方法 |
CN107271729A (zh) * | 2017-06-12 | 2017-10-20 | 上海华岭集成电路技术股份有限公司 | 一种测试通用转接接口 |
CN109425813A (zh) * | 2017-08-18 | 2019-03-05 | 中华精测科技股份有限公司 | 检测装置 |
CN109839522A (zh) * | 2017-11-24 | 2019-06-04 | 中华精测科技股份有限公司 | 探针卡装置及其信号转接模块 |
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CN111766416A (zh) | 2020-10-13 |
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Application publication date: 20201013 Assignee: Strong half conductor (Shanghai) Co.,Ltd. Assignor: MAXONE SEMICONDUCTOR (SUZHOU) Co.,Ltd. Contract record no.: X2021320010005 Denomination of invention: A docking method of MEMS probe structure of guide plate and adapter layer Granted publication date: 20201208 License type: Common License Record date: 20210207 |
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Address after: 2 / F, building 39, 18 Dongchang Road, Suzhou Industrial Park, 215000 Patentee after: Strong Half Conductor (Suzhou) Co.,Ltd. Address before: 2 / F, building 39, 18 Dongchang Road, Suzhou Industrial Park, 215000 Patentee before: MAXONE SEMICONDUCTOR (SUZHOU) Co.,Ltd. |
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