CN111766418B - Mems探针卡 - Google Patents
Mems探针卡 Download PDFInfo
- Publication number
- CN111766418B CN111766418B CN202010816387.3A CN202010816387A CN111766418B CN 111766418 B CN111766418 B CN 111766418B CN 202010816387 A CN202010816387 A CN 202010816387A CN 111766418 B CN111766418 B CN 111766418B
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- China
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- guide plate
- mems probe
- mems
- probe card
- probe structure
- Prior art date
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- 239000000523 sample Substances 0.000 title claims abstract description 240
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- 238000012360 testing method Methods 0.000 claims abstract description 14
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 60
- 238000000034 method Methods 0.000 abstract description 42
- 238000005516 engineering process Methods 0.000 abstract description 6
- 239000004065 semiconductor Substances 0.000 abstract description 5
- 238000013519 translation Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 8
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 8
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- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 description 2
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 description 2
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
Claims (1)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010816387.3A CN111766418B (zh) | 2020-08-14 | 2020-08-14 | Mems探针卡 |
PCT/CN2021/108720 WO2022033300A1 (zh) | 2020-08-14 | 2021-07-27 | Mems探针卡 |
US18/021,244 US20230324437A1 (en) | 2020-08-14 | 2021-07-27 | Mems probe card |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010816387.3A CN111766418B (zh) | 2020-08-14 | 2020-08-14 | Mems探针卡 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111766418A CN111766418A (zh) | 2020-10-13 |
CN111766418B true CN111766418B (zh) | 2021-01-19 |
Family
ID=72728840
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010816387.3A Active CN111766418B (zh) | 2020-08-14 | 2020-08-14 | Mems探针卡 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20230324437A1 (zh) |
CN (1) | CN111766418B (zh) |
WO (1) | WO2022033300A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111766418B (zh) * | 2020-08-14 | 2021-01-19 | 强一半导体(苏州)有限公司 | Mems探针卡 |
CN117054951B (zh) * | 2023-10-13 | 2024-03-29 | 深圳市道格特科技有限公司 | 一种探针性能测试系统及其测试方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101214916A (zh) * | 2007-12-28 | 2008-07-09 | 中国科学院上海微系统与信息技术研究所 | 基于电镀工艺的微机械测试探卡及制作方法 |
CN101750525A (zh) * | 2008-12-22 | 2010-06-23 | 京元电子股份有限公司 | 测试插座的制作方法及其所使用的弹性测试探针 |
CN102121944A (zh) * | 2010-01-08 | 2011-07-13 | 技鼎股份有限公司 | 一种微探针结构及其制造方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6880245B2 (en) * | 1996-03-12 | 2005-04-19 | International Business Machines Corporation | Method for fabricating a structure for making contact with an IC device |
TWI313753B (en) * | 2006-09-11 | 2009-08-21 | Jung Tang Huang | Vertical probe card |
US8441272B2 (en) * | 2008-12-30 | 2013-05-14 | Stmicroelectronics S.R.L. | MEMS probe for probe cards for integrated circuits |
KR20190021101A (ko) * | 2017-08-22 | 2019-03-05 | 삼성전자주식회사 | 프로브 카드, 프로브 카드를 포함한 테스트 장치, 그 프로브 카드를 이용한 테스트 방법 및 반도체 소자 제조방법 |
CN111012311A (zh) * | 2019-12-13 | 2020-04-17 | 上海应用技术大学 | 一种手持式mems光学扫描成像装置 |
CN111766416B (zh) * | 2020-08-14 | 2020-12-08 | 强一半导体(苏州)有限公司 | 一种导引板mems探针结构与转接层的对接方法 |
CN111983272B (zh) * | 2020-08-14 | 2021-02-12 | 强一半导体(苏州)有限公司 | 一种导引板mems探针结构制作方法 |
CN111766415B (zh) * | 2020-08-14 | 2020-12-25 | 强一半导体(苏州)有限公司 | 一种导引板mems探针结构模板烧刻方法 |
CN111766414B (zh) * | 2020-08-14 | 2020-12-25 | 强一半导体(苏州)有限公司 | 面向导引板mems探针结构模板烧刻的探针定位方法 |
CN111766413B (zh) * | 2020-08-14 | 2020-12-25 | 强一半导体(苏州)有限公司 | 一种导引板mems探针结构与转接层的对接装置 |
CN111766418B (zh) * | 2020-08-14 | 2021-01-19 | 强一半导体(苏州)有限公司 | Mems探针卡 |
CN111766417B (zh) * | 2020-08-14 | 2020-12-08 | 强一半导体(苏州)有限公司 | 一种导引板mems探针结构模板烧刻设备 |
-
2020
- 2020-08-14 CN CN202010816387.3A patent/CN111766418B/zh active Active
-
2021
- 2021-07-27 WO PCT/CN2021/108720 patent/WO2022033300A1/zh active Application Filing
- 2021-07-27 US US18/021,244 patent/US20230324437A1/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101214916A (zh) * | 2007-12-28 | 2008-07-09 | 中国科学院上海微系统与信息技术研究所 | 基于电镀工艺的微机械测试探卡及制作方法 |
CN101750525A (zh) * | 2008-12-22 | 2010-06-23 | 京元电子股份有限公司 | 测试插座的制作方法及其所使用的弹性测试探针 |
CN102121944A (zh) * | 2010-01-08 | 2011-07-13 | 技鼎股份有限公司 | 一种微探针结构及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20230324437A1 (en) | 2023-10-12 |
CN111766418A (zh) | 2020-10-13 |
WO2022033300A1 (zh) | 2022-02-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20201013 Assignee: Strong half conductor (Shanghai) Co.,Ltd. Assignor: MAXONE SEMICONDUCTOR (SUZHOU) Co.,Ltd. Contract record no.: X2021320010005 Denomination of invention: MEMS probe card Granted publication date: 20210119 License type: Common License Record date: 20210207 |
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EE01 | Entry into force of recordation of patent licensing contract | ||
CP01 | Change in the name or title of a patent holder |
Address after: 2 / F, building 39, 18 Dongchang Road, Suzhou Industrial Park, 215000 Patentee after: Strong Half Conductor (Suzhou) Co.,Ltd. Address before: 2 / F, building 39, 18 Dongchang Road, Suzhou Industrial Park, 215000 Patentee before: MAXONE SEMICONDUCTOR (SUZHOU) Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder |