KR101022854B1 - 도핑된 고유전 측벽 스페이서들을 구비한 전계 효과트랜지스터의 드레인/소스 확장 구조 - Google Patents

도핑된 고유전 측벽 스페이서들을 구비한 전계 효과트랜지스터의 드레인/소스 확장 구조 Download PDF

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KR101022854B1
KR101022854B1 KR1020057009685A KR20057009685A KR101022854B1 KR 101022854 B1 KR101022854 B1 KR 101022854B1 KR 1020057009685 A KR1020057009685 A KR 1020057009685A KR 20057009685 A KR20057009685 A KR 20057009685A KR 101022854 B1 KR101022854 B1 KR 101022854B1
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dielectric layer
high dielectric
substrate
forming
active region
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English (en)
Korean (ko)
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KR20050084030A (ko
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토마스 퓨델
만프레드 홀스트만
카르스텐 위엑조렉
스테판 크루에겔
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글로벌파운드리즈 인크.
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/0223—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate
    • H10D30/0227—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate having both lightly-doped source and drain extensions and source and drain regions self-aligned to the sides of the gate, e.g. lightly-doped drain [LDD] MOSFET or double-diffused drain [DDD] MOSFET
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
    • H01L21/2251—Diffusion into or out of group IV semiconductors
    • H01L21/2252—Diffusion into or out of group IV semiconductors using predeposition of impurities into the semiconductor surface, e.g. from a gaseous phase
    • H01L21/2253—Diffusion into or out of group IV semiconductors using predeposition of impurities into the semiconductor surface, e.g. from a gaseous phase by ion implantation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/601—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/0212—Manufacture or treatment of FETs having insulated gates [IGFET] using self-aligned silicidation

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Thin Film Transistor (AREA)
KR1020057009685A 2002-11-29 2003-11-06 도핑된 고유전 측벽 스페이서들을 구비한 전계 효과트랜지스터의 드레인/소스 확장 구조 Expired - Fee Related KR101022854B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE10255849A DE10255849B4 (de) 2002-11-29 2002-11-29 Verbesserte Drain/Source-Erweiterungsstruktur eines Feldeffekttransistors mit dotierten Seitenwandabstandselementen mit hoher Permittivität und Verfahren zu deren Herstellung
DE10255849.3 2002-11-29
US10/442,745 2003-05-21
US10/442,745 US6849516B2 (en) 2002-11-29 2003-05-21 Methods of forming drain/source extension structures of a field effect transistor using a doped high-k dielectric layer

Publications (2)

Publication Number Publication Date
KR20050084030A KR20050084030A (ko) 2005-08-26
KR101022854B1 true KR101022854B1 (ko) 2011-03-17

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KR1020057009685A Expired - Fee Related KR101022854B1 (ko) 2002-11-29 2003-11-06 도핑된 고유전 측벽 스페이서들을 구비한 전계 효과트랜지스터의 드레인/소스 확장 구조

Country Status (6)

Country Link
US (1) US20050098818A1 (enExample)
EP (1) EP1565934A1 (enExample)
JP (1) JP2006508548A (enExample)
KR (1) KR101022854B1 (enExample)
AU (1) AU2003295406A1 (enExample)
WO (1) WO2004051728A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10324657B4 (de) * 2003-05-30 2009-01-22 Advanced Micro Devices, Inc. (n.d.Ges.d. Staates Delaware), Sunnyvale Verfahren zur Herstellung eines Metallsilizids
US8022465B2 (en) * 2005-11-15 2011-09-20 Macronrix International Co., Ltd. Low hydrogen concentration charge-trapping layer structures for non-volatile memory
EP1890322A3 (en) * 2006-08-15 2012-02-15 Kovio, Inc. Printed dopant layers
US8106455B2 (en) * 2009-04-30 2012-01-31 International Business Machines Corporation Threshold voltage adjustment through gate dielectric stack modification
KR101205037B1 (ko) 2011-02-28 2012-11-26 에스케이하이닉스 주식회사 반도체 소자 및 그 형성방법
JP6005401B2 (ja) 2011-06-10 2016-10-12 株式会社半導体エネルギー研究所 半導体装置の作製方法
US8673731B2 (en) * 2012-08-20 2014-03-18 International Business Machines Corporation Techniques for gate workfunction engineering to reduce short channel effects in planar CMOS devices
GB2521457A (en) * 2013-12-20 2015-06-24 Isis Innovation Charge stabilized dielectric film for electronic devices
JP2017216258A (ja) * 2014-10-16 2017-12-07 国立研究開発法人科学技術振興機構 電界効果トランジスタ
KR102300071B1 (ko) * 2020-02-12 2021-09-07 포항공과대학교 산학협력단 고 유전율 필드 플레이트를 구비한 드레인 확장형 핀펫 및 이의 제조방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR930018751A (ko) * 1992-02-21 1993-09-22 김광호 Ldd형 mos 트랜지스터 제조방법
KR100439345B1 (ko) * 2000-10-31 2004-07-07 피티플러스(주) 폴리실리콘 활성층을 포함하는 박막트랜지스터 및 제조 방법

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61191025A (ja) * 1985-02-20 1986-08-25 Fujitsu Ltd 半導体装置の製造方法
US4994869A (en) * 1989-06-30 1991-02-19 Texas Instruments Incorporated NMOS transistor having inversion layer source/drain contacts
JPH04320036A (ja) * 1991-04-18 1992-11-10 Hitachi Ltd 半導体装置およびその製造方法
EP0550255B1 (en) * 1991-12-31 1998-03-11 STMicroelectronics, Inc. Transistor spacer structure
US5814869A (en) * 1992-01-28 1998-09-29 Thunderbird Technologies, Inc. Short channel fermi-threshold field effect transistors
JPH05343418A (ja) * 1992-06-09 1993-12-24 Oki Electric Ind Co Ltd 半導体装置の製造方法
JP2515951B2 (ja) * 1992-07-23 1996-07-10 株式会社日立製作所 Ｍｉｓ型電界効果トランジスタ
JPH07130998A (ja) * 1993-11-01 1995-05-19 Nec Corp 半導体装置の製造方法
KR970006262B1 (ko) * 1994-02-04 1997-04-25 금성일렉트론 주식회사 도우핑된 디스포저블층(disposable layer)을 이용한 모스트랜지스터의 제조방법
US5518945A (en) * 1995-05-05 1996-05-21 International Business Machines Corporation Method of making a diffused lightly doped drain device with built in etch stop
US5770490A (en) * 1996-08-29 1998-06-23 International Business Machines Corporation Method for producing dual work function CMOS device
US5926715A (en) * 1997-06-04 1999-07-20 Mosel Vitelic Inc. Method of forming lightly-doped drain by automatic PSG doping
US6333556B1 (en) * 1997-10-09 2001-12-25 Micron Technology, Inc. Insulating materials
US6271563B1 (en) * 1998-07-27 2001-08-07 Advanced Micro Devices, Inc. MOS transistor with high-K spacer designed for ultra-large-scale integration
US6200869B1 (en) * 1998-11-06 2001-03-13 Advanced Micro Devices, Inc. Method of fabricating an integrated circuit with ultra-shallow source/drain extensions
US6630712B2 (en) * 1999-08-11 2003-10-07 Advanced Micro Devices, Inc. Transistor with dynamic source/drain extensions
US6093590A (en) * 1999-09-14 2000-07-25 Worldwide Semiconductor Manufacturing Corp. Method of fabricating transistor having a metal gate and a gate dielectric layer with a high dielectric constant
US6255152B1 (en) * 1999-10-01 2001-07-03 United Microelectronics Corp. Method of fabricating CMOS using Si-B layer to form source/drain extension junction
US6417046B1 (en) * 2000-05-05 2002-07-09 Taiwan Semiconductor Manufacturing Company Modified nitride spacer for solving charge retention issue in floating gate memory cell
KR100397370B1 (ko) * 2001-10-29 2003-09-13 한국전자통신연구원 얕은 접합을 갖는 집적회로의 제조 방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR930018751A (ko) * 1992-02-21 1993-09-22 김광호 Ldd형 mos 트랜지스터 제조방법
KR100439345B1 (ko) * 2000-10-31 2004-07-07 피티플러스(주) 폴리실리콘 활성층을 포함하는 박막트랜지스터 및 제조 방법

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JP2006508548A (ja) 2006-03-09
EP1565934A1 (en) 2005-08-24
US20050098818A1 (en) 2005-05-12
AU2003295406A1 (en) 2004-06-23
WO2004051728A1 (en) 2004-06-17
KR20050084030A (ko) 2005-08-26

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