KR101009327B1 - 반도체 공정 환경에서 사용되는 접합 구조체 - Google Patents

반도체 공정 환경에서 사용되는 접합 구조체 Download PDF

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Publication number
KR101009327B1
KR101009327B1 KR1020057002722A KR20057002722A KR101009327B1 KR 101009327 B1 KR101009327 B1 KR 101009327B1 KR 1020057002722 A KR1020057002722 A KR 1020057002722A KR 20057002722 A KR20057002722 A KR 20057002722A KR 101009327 B1 KR101009327 B1 KR 101009327B1
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South Korea
Prior art keywords
plate
outer end
head portion
inner edge
arm portion
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Expired - Lifetime
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KR1020057002722A
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English (en)
Korean (ko)
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KR20050058341A (ko
Inventor
마이클 더블유. 할핀
Original Assignee
에이에스엠 아메리카, 인코포레이티드
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Publication of KR20050058341A publication Critical patent/KR20050058341A/ko
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Publication of KR101009327B1 publication Critical patent/KR101009327B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020057002722A 2002-08-20 2003-07-24 반도체 공정 환경에서 사용되는 접합 구조체 Expired - Lifetime KR101009327B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/225,545 US6929299B2 (en) 2002-08-20 2002-08-20 Bonded structures for use in semiconductor processing environments
US10/225,545 2002-08-20

Publications (2)

Publication Number Publication Date
KR20050058341A KR20050058341A (ko) 2005-06-16
KR101009327B1 true KR101009327B1 (ko) 2011-01-18

Family

ID=31946304

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057002722A Expired - Lifetime KR101009327B1 (ko) 2002-08-20 2003-07-24 반도체 공정 환경에서 사용되는 접합 구조체

Country Status (4)

Country Link
US (1) US6929299B2 (enExample)
JP (1) JP4575773B2 (enExample)
KR (1) KR101009327B1 (enExample)
WO (1) WO2004019375A2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4302557B2 (ja) * 2004-03-15 2009-07-29 大日本スクリーン製造株式会社 熱処理装置および基板処理装置
US20080129064A1 (en) * 2006-12-01 2008-06-05 Asm America, Inc. Bernoulli wand
JP2010278408A (ja) * 2009-04-30 2010-12-09 Fluoro Mechanic Kk ベルヌーイチャック
US20110148128A1 (en) * 2009-12-23 2011-06-23 Memc Electronic Materials, Inc. Semiconductor Wafer Transport System
JP6496919B2 (ja) * 2013-02-05 2019-04-10 サムコ株式会社 ベルヌーイハンド及び半導体製造装置
US20150290815A1 (en) * 2014-04-11 2015-10-15 Varian Semiconductor Equipment Associates, Inc. Planar end effector and method of making a planar end effector
JP6128050B2 (ja) * 2014-04-25 2017-05-17 トヨタ自動車株式会社 非接触型搬送ハンド
US10515834B2 (en) * 2015-10-12 2019-12-24 Lam Research Corporation Multi-station tool with wafer transfer microclimate systems
US10566230B2 (en) * 2016-04-01 2020-02-18 Sunpower Corporation Gripper for semiconductor devices
CN108346607B (zh) * 2017-01-25 2020-11-03 上海新昇半导体科技有限公司 竖直插入式阻挡脚及伯努利吸盘

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6183183B1 (en) * 1997-01-16 2001-02-06 Asm America, Inc. Dual arm linear hand-off wafer transfer assembly
US6499777B1 (en) * 1999-05-11 2002-12-31 Matrix Integrated Systems, Inc. End-effector with integrated cooling mechanism

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US821847A (en) * 1905-12-27 1906-05-29 Luis Arnavat Shovel.
US1211655A (en) * 1916-05-23 1917-01-09 Joseph W Adams Root-cutter.
US4911743A (en) 1986-05-29 1990-03-27 Hughes Aircraft Company Glass structure strengthening by etching
US5080549A (en) * 1987-05-11 1992-01-14 Epsilon Technology, Inc. Wafer handling system with Bernoulli pick-up
US5746460A (en) 1995-12-08 1998-05-05 Applied Materials, Inc. End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector
US6116848A (en) 1997-11-26 2000-09-12 Brooks Automation, Inc. Apparatus and method for high-speed transfer and centering of wafer substrates
JPH11180554A (ja) * 1997-12-22 1999-07-06 Canon Inc 基板搬送用ハンド及び基板搬送装置
JP3807074B2 (ja) * 1998-01-27 2006-08-09 石川島播磨重工業株式会社 Ｃｆｒｐ補強長尺構造物
US6260894B1 (en) * 1999-05-28 2001-07-17 Applied Materials, Inc. Assembly for wafer handling system
JP4189093B2 (ja) * 1999-08-31 2008-12-03 京セラ株式会社 セラミック製搬送アーム及びその製造方法
US6244641B1 (en) * 1999-12-02 2001-06-12 M.E.C. Technology, Inc. Wafer transfer arm
CA2493963C (en) * 2002-07-29 2011-07-05 E.I. Du Pont De Nemours And Company Carbon fiber composite transfer member with reflective surfaces

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6183183B1 (en) * 1997-01-16 2001-02-06 Asm America, Inc. Dual arm linear hand-off wafer transfer assembly
US6499777B1 (en) * 1999-05-11 2002-12-31 Matrix Integrated Systems, Inc. End-effector with integrated cooling mechanism

Also Published As

Publication number Publication date
KR20050058341A (ko) 2005-06-16
WO2004019375A2 (en) 2004-03-04
JP2005536889A (ja) 2005-12-02
JP4575773B2 (ja) 2010-11-04
US20050088003A1 (en) 2005-04-28
US6929299B2 (en) 2005-08-16
WO2004019375A3 (en) 2004-04-22

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