JP4575773B2 - 半導体素子の製造環境下で用いられる接合された構造体 - Google Patents

半導体素子の製造環境下で用いられる接合された構造体 Download PDF

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Publication number
JP4575773B2
JP4575773B2 JP2004530845A JP2004530845A JP4575773B2 JP 4575773 B2 JP4575773 B2 JP 4575773B2 JP 2004530845 A JP2004530845 A JP 2004530845A JP 2004530845 A JP2004530845 A JP 2004530845A JP 4575773 B2 JP4575773 B2 JP 4575773B2
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plate
distal end
upper plate
head portion
width
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JP2004530845A
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Japanese (ja)
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JP2005536889A5 (enExample
JP2005536889A (ja
Inventor
マイケル ダブリュー． ハルピン
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エーエスエム アメリカ インコーポレイテッド
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Publication of JP2005536889A5 publication Critical patent/JP2005536889A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2004530845A 2002-08-20 2003-07-24 半導体素子の製造環境下で用いられる接合された構造体 Expired - Lifetime JP4575773B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/225,545 US6929299B2 (en) 2002-08-20 2002-08-20 Bonded structures for use in semiconductor processing environments
PCT/US2003/023186 WO2004019375A2 (en) 2002-08-20 2003-07-24 Bonded structures for use in semiconductor processing environments

Publications (3)

Publication Number Publication Date
JP2005536889A JP2005536889A (ja) 2005-12-02
JP2005536889A5 JP2005536889A5 (enExample) 2006-09-14
JP4575773B2 true JP4575773B2 (ja) 2010-11-04

Family

ID=31946304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004530845A Expired - Lifetime JP4575773B2 (ja) 2002-08-20 2003-07-24 半導体素子の製造環境下で用いられる接合された構造体

Country Status (4)

Country Link
US (1) US6929299B2 (enExample)
JP (1) JP4575773B2 (enExample)
KR (1) KR101009327B1 (enExample)
WO (1) WO2004019375A2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4302557B2 (ja) * 2004-03-15 2009-07-29 大日本スクリーン製造株式会社 熱処理装置および基板処理装置
US20080129064A1 (en) * 2006-12-01 2008-06-05 Asm America, Inc. Bernoulli wand
JP2010278408A (ja) * 2009-04-30 2010-12-09 Fluoro Mechanic Kk ベルヌーイチャック
US20110148128A1 (en) * 2009-12-23 2011-06-23 Memc Electronic Materials, Inc. Semiconductor Wafer Transport System
JP6496919B2 (ja) * 2013-02-05 2019-04-10 サムコ株式会社 ベルヌーイハンド及び半導体製造装置
US20150290815A1 (en) * 2014-04-11 2015-10-15 Varian Semiconductor Equipment Associates, Inc. Planar end effector and method of making a planar end effector
JP6128050B2 (ja) * 2014-04-25 2017-05-17 トヨタ自動車株式会社 非接触型搬送ハンド
US10515834B2 (en) * 2015-10-12 2019-12-24 Lam Research Corporation Multi-station tool with wafer transfer microclimate systems
US10566230B2 (en) * 2016-04-01 2020-02-18 Sunpower Corporation Gripper for semiconductor devices
CN108346607B (zh) * 2017-01-25 2020-11-03 上海新昇半导体科技有限公司 竖直插入式阻挡脚及伯努利吸盘

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US821847A (en) * 1905-12-27 1906-05-29 Luis Arnavat Shovel.
US1211655A (en) * 1916-05-23 1917-01-09 Joseph W Adams Root-cutter.
US4911743A (en) 1986-05-29 1990-03-27 Hughes Aircraft Company Glass structure strengthening by etching
US5080549A (en) * 1987-05-11 1992-01-14 Epsilon Technology, Inc. Wafer handling system with Bernoulli pick-up
US5746460A (en) 1995-12-08 1998-05-05 Applied Materials, Inc. End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector
US6183183B1 (en) 1997-01-16 2001-02-06 Asm America, Inc. Dual arm linear hand-off wafer transfer assembly
US6116848A (en) 1997-11-26 2000-09-12 Brooks Automation, Inc. Apparatus and method for high-speed transfer and centering of wafer substrates
JPH11180554A (ja) * 1997-12-22 1999-07-06 Canon Inc 基板搬送用ハンド及び基板搬送装置
JP3807074B2 (ja) * 1998-01-27 2006-08-09 石川島播磨重工業株式会社 Ｃｆｒｐ補強長尺構造物
US6499777B1 (en) * 1999-05-11 2002-12-31 Matrix Integrated Systems, Inc. End-effector with integrated cooling mechanism
US6260894B1 (en) * 1999-05-28 2001-07-17 Applied Materials, Inc. Assembly for wafer handling system
JP4189093B2 (ja) * 1999-08-31 2008-12-03 京セラ株式会社 セラミック製搬送アーム及びその製造方法
US6244641B1 (en) * 1999-12-02 2001-06-12 M.E.C. Technology, Inc. Wafer transfer arm
CA2493963C (en) * 2002-07-29 2011-07-05 E.I. Du Pont De Nemours And Company Carbon fiber composite transfer member with reflective surfaces

Also Published As

Publication number Publication date
KR20050058341A (ko) 2005-06-16
WO2004019375A2 (en) 2004-03-04
KR101009327B1 (ko) 2011-01-18
JP2005536889A (ja) 2005-12-02
US20050088003A1 (en) 2005-04-28
US6929299B2 (en) 2005-08-16
WO2004019375A3 (en) 2004-04-22

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