JP2005536889A5 - - Google Patents

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Publication number
JP2005536889A5
JP2005536889A5 JP2004530845A JP2004530845A JP2005536889A5 JP 2005536889 A5 JP2005536889 A5 JP 2005536889A5 JP 2004530845 A JP2004530845 A JP 2004530845A JP 2004530845 A JP2004530845 A JP 2004530845A JP 2005536889 A5 JP2005536889 A5 JP 2005536889A5
Authority
JP
Japan
Prior art keywords
plate
distal end
proximal edge
lower plate
head portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004530845A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005536889A (ja
JP4575773B2 (ja
Filing date
Publication date
Priority claimed from US10/225,545 external-priority patent/US6929299B2/en
Application filed filed Critical
Publication of JP2005536889A publication Critical patent/JP2005536889A/ja
Publication of JP2005536889A5 publication Critical patent/JP2005536889A5/ja
Application granted granted Critical
Publication of JP4575773B2 publication Critical patent/JP4575773B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2004530845A 2002-08-20 2003-07-24 半導体素子の製造環境下で用いられる接合された構造体 Expired - Lifetime JP4575773B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/225,545 US6929299B2 (en) 2002-08-20 2002-08-20 Bonded structures for use in semiconductor processing environments
PCT/US2003/023186 WO2004019375A2 (en) 2002-08-20 2003-07-24 Bonded structures for use in semiconductor processing environments

Publications (3)

Publication Number Publication Date
JP2005536889A JP2005536889A (ja) 2005-12-02
JP2005536889A5 true JP2005536889A5 (enExample) 2006-09-14
JP4575773B2 JP4575773B2 (ja) 2010-11-04

Family

ID=31946304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004530845A Expired - Lifetime JP4575773B2 (ja) 2002-08-20 2003-07-24 半導体素子の製造環境下で用いられる接合された構造体

Country Status (4)

Country Link
US (1) US6929299B2 (enExample)
JP (1) JP4575773B2 (enExample)
KR (1) KR101009327B1 (enExample)
WO (1) WO2004019375A2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4302557B2 (ja) * 2004-03-15 2009-07-29 大日本スクリーン製造株式会社 熱処理装置および基板処理装置
US20080129064A1 (en) * 2006-12-01 2008-06-05 Asm America, Inc. Bernoulli wand
JP2010278408A (ja) * 2009-04-30 2010-12-09 Fluoro Mechanic Kk ベルヌーイチャック
US20110148128A1 (en) * 2009-12-23 2011-06-23 Memc Electronic Materials, Inc. Semiconductor Wafer Transport System
JP6496919B2 (ja) * 2013-02-05 2019-04-10 サムコ株式会社 ベルヌーイハンド及び半導体製造装置
US20150290815A1 (en) * 2014-04-11 2015-10-15 Varian Semiconductor Equipment Associates, Inc. Planar end effector and method of making a planar end effector
JP6128050B2 (ja) * 2014-04-25 2017-05-17 トヨタ自動車株式会社 非接触型搬送ハンド
US10515834B2 (en) * 2015-10-12 2019-12-24 Lam Research Corporation Multi-station tool with wafer transfer microclimate systems
US10566230B2 (en) * 2016-04-01 2020-02-18 Sunpower Corporation Gripper for semiconductor devices
CN108346607B (zh) * 2017-01-25 2020-11-03 上海新昇半导体科技有限公司 竖直插入式阻挡脚及伯努利吸盘

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US821847A (en) * 1905-12-27 1906-05-29 Luis Arnavat Shovel.
US1211655A (en) * 1916-05-23 1917-01-09 Joseph W Adams Root-cutter.
US4911743A (en) 1986-05-29 1990-03-27 Hughes Aircraft Company Glass structure strengthening by etching
US5080549A (en) * 1987-05-11 1992-01-14 Epsilon Technology, Inc. Wafer handling system with Bernoulli pick-up
US5746460A (en) 1995-12-08 1998-05-05 Applied Materials, Inc. End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector
US6183183B1 (en) 1997-01-16 2001-02-06 Asm America, Inc. Dual arm linear hand-off wafer transfer assembly
US6116848A (en) 1997-11-26 2000-09-12 Brooks Automation, Inc. Apparatus and method for high-speed transfer and centering of wafer substrates
JPH11180554A (ja) * 1997-12-22 1999-07-06 Canon Inc 基板搬送用ハンド及び基板搬送装置
JP3807074B2 (ja) * 1998-01-27 2006-08-09 石川島播磨重工業株式会社 Ｃｆｒｐ補強長尺構造物
US6499777B1 (en) * 1999-05-11 2002-12-31 Matrix Integrated Systems, Inc. End-effector with integrated cooling mechanism
US6260894B1 (en) * 1999-05-28 2001-07-17 Applied Materials, Inc. Assembly for wafer handling system
JP4189093B2 (ja) * 1999-08-31 2008-12-03 京セラ株式会社 セラミック製搬送アーム及びその製造方法
US6244641B1 (en) * 1999-12-02 2001-06-12 M.E.C. Technology, Inc. Wafer transfer arm
CA2493963C (en) * 2002-07-29 2011-07-05 E.I. Du Pont De Nemours And Company Carbon fiber composite transfer member with reflective surfaces

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