JP2015159204A5 - - Google Patents

Download PDF

Info

Publication number
JP2015159204A5
JP2015159204A5 JP2014033570A JP2014033570A JP2015159204A5 JP 2015159204 A5 JP2015159204 A5 JP 2015159204A5 JP 2014033570 A JP2014033570 A JP 2014033570A JP 2014033570 A JP2014033570 A JP 2014033570A JP 2015159204 A5 JP2015159204 A5 JP 2015159204A5
Authority
JP
Japan
Prior art keywords
view
plan
package
surface portion
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014033570A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015159204A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2014033570A priority Critical patent/JP2015159204A/ja
Priority claimed from JP2014033570A external-priority patent/JP2015159204A/ja
Priority to TW104105221A priority patent/TWI559462B/zh
Priority to CN201510085220.3A priority patent/CN104867879A/zh
Publication of JP2015159204A publication Critical patent/JP2015159204A/ja
Publication of JP2015159204A5 publication Critical patent/JP2015159204A5/ja
Pending legal-status Critical Current

Links

JP2014033570A 2014-02-25 2014-02-25 セラミックパッケージ Pending JP2015159204A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014033570A JP2015159204A (ja) 2014-02-25 2014-02-25 セラミックパッケージ
TW104105221A TWI559462B (zh) 2014-02-25 2015-02-16 Ceramic package
CN201510085220.3A CN104867879A (zh) 2014-02-25 2015-02-16 陶瓷封装

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014033570A JP2015159204A (ja) 2014-02-25 2014-02-25 セラミックパッケージ

Publications (2)

Publication Number Publication Date
JP2015159204A JP2015159204A (ja) 2015-09-03
JP2015159204A5 true JP2015159204A5 (enExample) 2015-10-15

Family

ID=53913623

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014033570A Pending JP2015159204A (ja) 2014-02-25 2014-02-25 セラミックパッケージ

Country Status (3)

Country Link
JP (1) JP2015159204A (enExample)
CN (1) CN104867879A (enExample)
TW (1) TWI559462B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016152733A1 (ja) * 2015-03-24 2016-09-29 京セラ株式会社 電子部品収納用基板および電子部品実装パッケージ
FR3048305A1 (fr) * 2016-02-26 2017-09-01 Stmicroelectronics (Grenoble 2) Sas Dispositif electronique a bloc d'encapsulation localement d'epaisseur reduite
CN109075761B (zh) * 2016-09-16 2022-06-24 株式会社大真空 压电振动器件
JP6892250B2 (ja) * 2016-11-24 2021-06-23 日本電波工業株式会社 圧電デバイス及びベース
CN107285274B (zh) * 2017-05-10 2019-03-01 中国航空工业集团公司西安飞行自动控制研究所 一种微机械惯性传感器的三维封装方法
CN111010102B (zh) * 2019-03-18 2023-12-15 天津大学 考虑形状的薄膜封装的mems器件组件及电子设备
JP7650780B2 (ja) 2020-12-25 2025-03-25 Ｎｇｋエレクトロデバイス株式会社 パッケージおよびその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5760465A (en) * 1996-02-01 1998-06-02 International Business Machines Corporation Electronic package with strain relief means
TWI227556B (en) * 2003-07-15 2005-02-01 Advanced Semiconductor Eng Chip structure
CN201113937Y (zh) * 2007-08-16 2008-09-10 台晶(宁波)电子有限公司 石英晶体震荡器陶瓷封装结构
JP5763962B2 (ja) * 2011-04-19 2015-08-12 日本特殊陶業株式会社 セラミック配線基板、多数個取りセラミック配線基板、およびその製造方法
JP6006474B2 (ja) * 2011-04-25 2016-10-12 日本特殊陶業株式会社 配線基板、多数個取り配線基板、およびその製造方法
JP5983603B2 (ja) * 2011-05-16 2016-08-31 日亜化学工業株式会社 発光装置及びその製造方法
JP5836796B2 (ja) * 2011-12-28 2015-12-24 日本特殊陶業株式会社 セラミックパッケージ

Similar Documents

Publication Publication Date Title
JP2015159204A5 (enExample)
USD792105S1 (en) Lid with square surface features and bridges
USD862233S1 (en) Jar
USD841643S1 (en) Financial services kiosk
JP2017084523A5 (enExample)
JP2018528622A5 (enExample)
JP2021511990A5 (enExample)
USD848780S1 (en) Egg cooking device
JP2011250225A5 (enExample)
USD957063S1 (en) Glove
USD898090S1 (en) Toothed connection flange for a robot joint
JP2013227014A5 (enExample)
JP2014513757A5 (enExample)
TWI559462B (zh) Ceramic package
TW201531661A (zh) 均溫板封邊結構改良（二）
TWM517910U (zh) 晶片封裝結構
JP2016197026A5 (enExample)
CN104833249A (zh) 均温板封边改良结构
JP2016090221A5 (enExample)
JP2014197575A5 (ja) パッケージ、電子デバイス、電子デバイスの製造方法、電子機器、移動体、及びリッド
USD1060886S1 (en) Therapeutic bonding mitt
USD843176S1 (en) Shot glass
JP2013171907A5 (enExample)
JP2015094614A5 (enExample)
USD930945S1 (en) Manlift side windows