JP2015159204A5 - - Google Patents

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Publication number
JP2015159204A5
JP2015159204A5 JP2014033570A JP2014033570A JP2015159204A5 JP 2015159204 A5 JP2015159204 A5 JP 2015159204A5 JP 2014033570 A JP2014033570 A JP 2014033570A JP 2014033570 A JP2014033570 A JP 2014033570A JP 2015159204 A5 JP2015159204 A5 JP 2015159204A5
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JP
Japan
Prior art keywords
view
plan
package
surface portion
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014033570A
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English (en)
Japanese (ja)
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JP2015159204A (ja
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Publication date
Application filed filed Critical
Priority to JP2014033570A priority Critical patent/JP2015159204A/ja
Priority claimed from JP2014033570A external-priority patent/JP2015159204A/ja
Priority to TW104105221A priority patent/TWI559462B/zh
Priority to CN201510085220.3A priority patent/CN104867879A/zh
Publication of JP2015159204A publication Critical patent/JP2015159204A/ja
Publication of JP2015159204A5 publication Critical patent/JP2015159204A5/ja
Pending legal-status Critical Current

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JP2014033570A 2014-02-25 2014-02-25 セラミックパッケージ Pending JP2015159204A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014033570A JP2015159204A (ja) 2014-02-25 2014-02-25 セラミックパッケージ
TW104105221A TWI559462B (zh) 2014-02-25 2015-02-16 Ceramic package
CN201510085220.3A CN104867879A (zh) 2014-02-25 2015-02-16 陶瓷封装

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014033570A JP2015159204A (ja) 2014-02-25 2014-02-25 セラミックパッケージ

Publications (2)

Publication Number Publication Date
JP2015159204A JP2015159204A (ja) 2015-09-03
JP2015159204A5 true JP2015159204A5 (enExample) 2015-10-15

Family

ID=53913623

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014033570A Pending JP2015159204A (ja) 2014-02-25 2014-02-25 セラミックパッケージ

Country Status (3)

Country Link
JP (1) JP2015159204A (enExample)
CN (1) CN104867879A (enExample)
TW (1) TWI559462B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10396002B2 (en) 2015-03-24 2019-08-27 Kyocera Corporation Electronic component storage substrate and housing package
FR3048305A1 (fr) * 2016-02-26 2017-09-01 Stmicroelectronics (Grenoble 2) Sas Dispositif electronique a bloc d'encapsulation localement d'epaisseur reduite
WO2018051800A1 (ja) * 2016-09-16 2018-03-22 株式会社大真空 圧電振動デバイス
JP6892250B2 (ja) * 2016-11-24 2021-06-23 日本電波工業株式会社 圧電デバイス及びベース
CN107285274B (zh) * 2017-05-10 2019-03-01 中国航空工业集团公司西安飞行自动控制研究所 一种微机械惯性传感器的三维封装方法
CN111010102B (zh) * 2019-03-18 2023-12-15 天津大学 考虑形状的薄膜封装的mems器件组件及电子设备
JP7650780B2 (ja) 2020-12-25 2025-03-25 Ｎｇｋエレクトロデバイス株式会社 パッケージおよびその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5760465A (en) * 1996-02-01 1998-06-02 International Business Machines Corporation Electronic package with strain relief means
TWI227556B (en) * 2003-07-15 2005-02-01 Advanced Semiconductor Eng Chip structure
CN201113937Y (zh) * 2007-08-16 2008-09-10 台晶(宁波)电子有限公司 石英晶体震荡器陶瓷封装结构
JP5763962B2 (ja) * 2011-04-19 2015-08-12 日本特殊陶業株式会社 セラミック配線基板、多数個取りセラミック配線基板、およびその製造方法
JP6006474B2 (ja) * 2011-04-25 2016-10-12 日本特殊陶業株式会社 配線基板、多数個取り配線基板、およびその製造方法
CN103688377B (zh) * 2011-05-16 2018-06-08 日亚化学工业株式会社 发光装置及其制造方法
JP5836796B2 (ja) * 2011-12-28 2015-12-24 日本特殊陶業株式会社 セラミックパッケージ

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