TWI559462B - Ceramic package - Google Patents

Ceramic package Download PDF

Info

Publication number
TWI559462B
TWI559462B TW104105221A TW104105221A TWI559462B TW I559462 B TWI559462 B TW I559462B TW 104105221 A TW104105221 A TW 104105221A TW 104105221 A TW104105221 A TW 104105221A TW I559462 B TWI559462 B TW I559462B
Authority
TW
Taiwan
Prior art keywords
package
view
ceramic
package body
plan
Prior art date
Application number
TW104105221A
Other languages
English (en)
Chinese (zh)
Other versions
TW201537695A (zh
Inventor
Masami Hasegawa
Masato Kondo
Takashi Kurauchi
Original Assignee
Ngk Spark Plug Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ngk Spark Plug Co filed Critical Ngk Spark Plug Co
Publication of TW201537695A publication Critical patent/TW201537695A/zh
Application granted granted Critical
Publication of TWI559462B publication Critical patent/TWI559462B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H01L2924/16315—Shape

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
TW104105221A 2014-02-25 2015-02-16 Ceramic package TWI559462B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014033570A JP2015159204A (ja) 2014-02-25 2014-02-25 セラミックパッケージ

Publications (2)

Publication Number Publication Date
TW201537695A TW201537695A (zh) 2015-10-01
TWI559462B true TWI559462B (zh) 2016-11-21

Family

ID=53913623

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104105221A TWI559462B (zh) 2014-02-25 2015-02-16 Ceramic package

Country Status (3)

Country Link
JP (1) JP2015159204A (enExample)
CN (1) CN104867879A (enExample)
TW (1) TWI559462B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10396002B2 (en) 2015-03-24 2019-08-27 Kyocera Corporation Electronic component storage substrate and housing package
FR3048305A1 (fr) * 2016-02-26 2017-09-01 Stmicroelectronics (Grenoble 2) Sas Dispositif electronique a bloc d'encapsulation localement d'epaisseur reduite
US11152911B2 (en) * 2016-09-16 2021-10-19 Daishinku Corporation Piezoelectric resonator device
JP6892250B2 (ja) * 2016-11-24 2021-06-23 日本電波工業株式会社 圧電デバイス及びベース
CN107285274B (zh) * 2017-05-10 2019-03-01 中国航空工业集团公司西安飞行自动控制研究所 一种微机械惯性传感器的三维封装方法
CN111010102B (zh) * 2019-03-18 2023-12-15 天津大学 考虑形状的薄膜封装的mems器件组件及电子设备
JP7650780B2 (ja) 2020-12-25 2025-03-25 Ｎｇｋエレクトロデバイス株式会社 パッケージおよびその製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW310467B (en) * 1996-02-01 1997-07-11 Ibm Electronic package with strain relief means and method of making
TW200503220A (en) * 2003-07-15 2005-01-16 Advanced Semiconductor Eng Chip structure
TW201251540A (en) * 2011-04-25 2012-12-16 Ngk Spark Plug Co Wiring substrate, multi-piece wiring substrate and method for manufacturing the same
TW201251537A (en) * 2011-04-19 2012-12-16 Ngk Spark Plug Co Ceramic wiring substrate, multi-piece ceramic wiring substrate and method for manufacturing the same
TW201301584A (zh) * 2011-05-16 2013-01-01 日亞化學工業股份有限公司 發光裝置及其製造方法
TW201340430A (zh) * 2011-12-28 2013-10-01 日本特殊陶業股份有限公司 陶瓷封裝

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201113937Y (zh) * 2007-08-16 2008-09-10 台晶(宁波)电子有限公司 石英晶体震荡器陶瓷封装结构

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW310467B (en) * 1996-02-01 1997-07-11 Ibm Electronic package with strain relief means and method of making
TW200503220A (en) * 2003-07-15 2005-01-16 Advanced Semiconductor Eng Chip structure
TW201251537A (en) * 2011-04-19 2012-12-16 Ngk Spark Plug Co Ceramic wiring substrate, multi-piece ceramic wiring substrate and method for manufacturing the same
TW201251540A (en) * 2011-04-25 2012-12-16 Ngk Spark Plug Co Wiring substrate, multi-piece wiring substrate and method for manufacturing the same
TW201301584A (zh) * 2011-05-16 2013-01-01 日亞化學工業股份有限公司 發光裝置及其製造方法
TW201340430A (zh) * 2011-12-28 2013-10-01 日本特殊陶業股份有限公司 陶瓷封裝

Also Published As

Publication number Publication date
JP2015159204A (ja) 2015-09-03
TW201537695A (zh) 2015-10-01
CN104867879A (zh) 2015-08-26

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees