CN104867879A - 陶瓷封装 - Google Patents
陶瓷封装 Download PDFInfo
- Publication number
- CN104867879A CN104867879A CN201510085220.3A CN201510085220A CN104867879A CN 104867879 A CN104867879 A CN 104867879A CN 201510085220 A CN201510085220 A CN 201510085220A CN 104867879 A CN104867879 A CN 104867879A
- Authority
- CN
- China
- Prior art keywords
- mentioned
- main body
- sagging
- package main
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 claims abstract description 76
- 239000002184 metal Substances 0.000 claims abstract description 76
- 239000000463 material Substances 0.000 claims abstract description 46
- 238000004806 packaging method and process Methods 0.000 claims abstract description 37
- 238000007665 sagging Methods 0.000 claims description 79
- 238000005219 brazing Methods 0.000 claims description 41
- 238000005476 soldering Methods 0.000 abstract description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 abstract 1
- 230000001815 facial effect Effects 0.000 description 44
- 238000005538 encapsulation Methods 0.000 description 23
- 230000035882 stress Effects 0.000 description 11
- 238000009825 accumulation Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 238000005245 sintering Methods 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 230000009194 climbing Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 230000011218 segmentation Effects 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 230000004907 flux Effects 0.000 description 3
- 235000013372 meat Nutrition 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002241 glass-ceramic Substances 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 229910003271 Ni-Fe Inorganic materials 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 210000001161 mammalian embryo Anatomy 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000013316 zoning Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/163—Connection portion, e.g. seal
- H01L2924/16315—Shape
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-033570 | 2014-02-25 | ||
| JP2014033570A JP2015159204A (ja) | 2014-02-25 | 2014-02-25 | セラミックパッケージ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104867879A true CN104867879A (zh) | 2015-08-26 |
Family
ID=53913623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510085220.3A Pending CN104867879A (zh) | 2014-02-25 | 2015-02-16 | 陶瓷封装 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2015159204A (enExample) |
| CN (1) | CN104867879A (enExample) |
| TW (1) | TWI559462B (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107134436A (zh) * | 2016-02-26 | 2017-09-05 | 意法半导体(格勒诺布尔2)公司 | 包括局部具有较小厚度的包封块的电子器件 |
| CN107285274A (zh) * | 2017-05-10 | 2017-10-24 | 中国航空工业集团公司西安飞行自动控制研究所 | 一种微机械惯性传感器的三维封装方法 |
| CN109075761A (zh) * | 2016-09-16 | 2018-12-21 | 株式会社大真空 | 压电振动器件 |
| CN111010102A (zh) * | 2019-03-18 | 2020-04-14 | 天津大学 | 考虑形状的薄膜封装的mems器件组件及电子设备 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016152733A1 (ja) * | 2015-03-24 | 2016-09-29 | 京セラ株式会社 | 電子部品収納用基板および電子部品実装パッケージ |
| JP6892250B2 (ja) * | 2016-11-24 | 2021-06-23 | 日本電波工業株式会社 | 圧電デバイス及びベース |
| JP7650780B2 (ja) | 2020-12-25 | 2025-03-25 | Ｎｇｋエレクトロデバイス株式会社 | パッケージおよびその製造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201113937Y (zh) * | 2007-08-16 | 2008-09-10 | 台晶(宁波)电子有限公司 | 石英晶体震荡器陶瓷封装结构 |
| WO2012144115A1 (ja) * | 2011-04-19 | 2012-10-26 | 日本特殊陶業株式会社 | セラミック配線基板、多数個取りセラミック配線基板、およびその製造方法 |
| CN103444270A (zh) * | 2011-04-25 | 2013-12-11 | 日本特殊陶业株式会社 | 布线基板、多连片布线基板及其制造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5760465A (en) * | 1996-02-01 | 1998-06-02 | International Business Machines Corporation | Electronic package with strain relief means |
| TWI227556B (en) * | 2003-07-15 | 2005-02-01 | Advanced Semiconductor Eng | Chip structure |
| EP3544067B1 (en) * | 2011-05-16 | 2020-09-09 | Nichia Corporation | Light diode emitting device and method for manufacturing the same |
| JP5836796B2 (ja) * | 2011-12-28 | 2015-12-24 | 日本特殊陶業株式会社 | セラミックパッケージ |
-
2014
- 2014-02-25 JP JP2014033570A patent/JP2015159204A/ja active Pending
-
2015
- 2015-02-16 TW TW104105221A patent/TWI559462B/zh not_active IP Right Cessation
- 2015-02-16 CN CN201510085220.3A patent/CN104867879A/zh active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201113937Y (zh) * | 2007-08-16 | 2008-09-10 | 台晶(宁波)电子有限公司 | 石英晶体震荡器陶瓷封装结构 |
| WO2012144115A1 (ja) * | 2011-04-19 | 2012-10-26 | 日本特殊陶業株式会社 | セラミック配線基板、多数個取りセラミック配線基板、およびその製造方法 |
| CN103444270A (zh) * | 2011-04-25 | 2013-12-11 | 日本特殊陶业株式会社 | 布线基板、多连片布线基板及其制造方法 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107134436A (zh) * | 2016-02-26 | 2017-09-05 | 意法半导体(格勒诺布尔2)公司 | 包括局部具有较小厚度的包封块的电子器件 |
| CN109075761A (zh) * | 2016-09-16 | 2018-12-21 | 株式会社大真空 | 压电振动器件 |
| CN107285274A (zh) * | 2017-05-10 | 2017-10-24 | 中国航空工业集团公司西安飞行自动控制研究所 | 一种微机械惯性传感器的三维封装方法 |
| CN107285274B (zh) * | 2017-05-10 | 2019-03-01 | 中国航空工业集团公司西安飞行自动控制研究所 | 一种微机械惯性传感器的三维封装方法 |
| CN111010102A (zh) * | 2019-03-18 | 2020-04-14 | 天津大学 | 考虑形状的薄膜封装的mems器件组件及电子设备 |
| CN111010102B (zh) * | 2019-03-18 | 2023-12-15 | 天津大学 | 考虑形状的薄膜封装的mems器件组件及电子设备 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI559462B (zh) | 2016-11-21 |
| JP2015159204A (ja) | 2015-09-03 |
| TW201537695A (zh) | 2015-10-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150826 |
|
| WD01 | Invention patent application deemed withdrawn after publication |