KR100968843B1 - 다수의 발광셀이 어레이된 발광소자 - Google Patents

다수의 발광셀이 어레이된 발광소자 Download PDF

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Publication number
KR100968843B1
KR100968843B1 KR20050124882A KR20050124882A KR100968843B1 KR 100968843 B1 KR100968843 B1 KR 100968843B1 KR 20050124882 A KR20050124882 A KR 20050124882A KR 20050124882 A KR20050124882 A KR 20050124882A KR 100968843 B1 KR100968843 B1 KR 100968843B1
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KR
South Korea
Prior art keywords
light emitting
diode
electrode
emitting device
cell block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR20050124882A
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English (en)
Korean (ko)
Other versions
KR20070064208A (ko
Inventor
이재호
라크로익 야베스
윤여진
황의진
Original Assignee
서울옵토디바이스주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to KR20050124882A priority Critical patent/KR100968843B1/ko
Application filed by 서울옵토디바이스주식회사 filed Critical 서울옵토디바이스주식회사
Priority to PCT/KR2006/005186 priority patent/WO2007083885A1/en
Priority to DE200611002702 priority patent/DE112006002702B4/de
Priority to CN2006800416805A priority patent/CN101305476B/zh
Priority to JP2008545479A priority patent/JP4694631B2/ja
Priority to US12/088,906 priority patent/US8054002B2/en
Priority to DE112006004221.1T priority patent/DE112006004221B4/de
Priority to CN2010102321761A priority patent/CN101924117A/zh
Priority to TW95146586A priority patent/TWI410169B/zh
Priority to TW99133759A priority patent/TWI430698B/zh
Publication of KR20070064208A publication Critical patent/KR20070064208A/ko
Priority to JP2009275101A priority patent/JP4690482B2/ja
Application granted granted Critical
Publication of KR100968843B1 publication Critical patent/KR100968843B1/ko
Priority to JP2010260444A priority patent/JP5193271B2/ja
Priority to US13/243,802 priority patent/US8294386B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • H05B45/37—Converter circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001—Core members of the connector
    • H01L2224/37099—Material
    • H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/40137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
KR20050124882A 2005-12-16 2005-12-16 다수의 발광셀이 어레이된 발광소자 Expired - Fee Related KR100968843B1 (ko)

Priority Applications (13)

Application Number Priority Date Filing Date Title
KR20050124882A KR100968843B1 (ko) 2005-12-16 2005-12-16 다수의 발광셀이 어레이된 발광소자
CN2010102321761A CN101924117A (zh) 2005-12-16 2006-12-05 具有排列的发光单元的发光装置
CN2006800416805A CN101305476B (zh) 2005-12-16 2006-12-05 具有排列的发光单元的发光装置
JP2008545479A JP4694631B2 (ja) 2005-12-16 2006-12-05 複数の発光セルが配列された発光素子
US12/088,906 US8054002B2 (en) 2005-12-16 2006-12-05 Light emitting device with light emitting cells arrayed
DE112006004221.1T DE112006004221B4 (de) 2005-12-16 2006-12-05 Lichtemittierende Anordnung mit gruppierten lichtemittierenden Zellen
PCT/KR2006/005186 WO2007083885A1 (en) 2005-12-16 2006-12-05 Light emitting device with light emitting cells arrayed
DE200611002702 DE112006002702B4 (de) 2005-12-16 2006-12-05 Lichtemittierende Anordnung für Wechselstrom mit darin gebildeter Brückengleichrichschaltung und gruppierten lichtemittierenden Zellen
TW99133759A TWI430698B (zh) 2005-12-16 2006-12-13 具有發光單元的發光元件
TW95146586A TWI410169B (zh) 2005-12-16 2006-12-13 具有發光單元陣列的發光元件
JP2009275101A JP4690482B2 (ja) 2005-12-16 2009-12-03 複数の発光セルが配列された発光素子
JP2010260444A JP5193271B2 (ja) 2005-12-16 2010-11-22 複数の発光セルが配列された発光素子
US13/243,802 US8294386B2 (en) 2005-12-16 2011-09-23 Light emitting device with light emitting cells arrayed

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20050124882A KR100968843B1 (ko) 2005-12-16 2005-12-16 다수의 발광셀이 어레이된 발광소자

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020100032436A Division KR101055782B1 (ko) 2010-04-08 2010-04-08 다수의 발광셀이 어레이된 발광소자

Publications (2)

Publication Number Publication Date
KR20070064208A KR20070064208A (ko) 2007-06-20
KR100968843B1 true KR100968843B1 (ko) 2010-07-09

Family

ID=38287805

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20050124882A Expired - Fee Related KR100968843B1 (ko) 2005-12-16 2005-12-16 다수의 발광셀이 어레이된 발광소자

Country Status (7)

Country Link
US (2) US8054002B2 (enExample)
JP (3) JP4694631B2 (enExample)
KR (1) KR100968843B1 (enExample)
CN (2) CN101305476B (enExample)
DE (2) DE112006002702B4 (enExample)
TW (2) TWI410169B (enExample)
WO (1) WO2007083885A1 (enExample)

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US10154551B2 (en) 2004-02-25 2018-12-11 Lynk Labs, Inc. AC light emitting diode and AC LED drive methods and apparatus
US10506674B2 (en) 2004-02-25 2019-12-10 Lynk Labs, Inc. AC light emitting diode and AC LED drive methods and apparatus
US10575376B2 (en) 2004-02-25 2020-02-25 Lynk Labs, Inc. AC light emitting diode and AC LED drive methods and apparatus
US10499465B2 (en) 2004-02-25 2019-12-03 Lynk Labs, Inc. High frequency multi-voltage and multi-brightness LED lighting devices and systems and methods of using same
CN1943276B (zh) 2004-02-25 2012-05-23 迈克尔·米斯金 Ac发光二极管以及ac led驱动方法和装置
US10091842B2 (en) 2004-02-25 2018-10-02 Lynk Labs, Inc. AC light emitting diode and AC LED drive methods and apparatus
TW200723559A (en) * 2005-12-13 2007-06-16 Ind Tech Res Inst Alternating current (AC) light emitting assembly and AC light emitting device
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TWI371870B (en) * 2006-11-08 2012-09-01 Epistar Corp Alternate current light-emitting device and fabrication method thereof
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US11297705B2 (en) 2007-10-06 2022-04-05 Lynk Labs, Inc. Multi-voltage and multi-brightness LED lighting devices and methods of using same
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WO2010050694A2 (ko) * 2008-10-29 2010-05-06 서울옵토디바이스주식회사 발광 다이오드
KR101523002B1 (ko) * 2009-01-13 2015-05-26 서울반도체 주식회사 발광 장치
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TWI398966B (zh) * 2009-06-08 2013-06-11 晶元光電股份有限公司 發光元件及其製造方法
TWI495084B (zh) * 2009-07-07 2015-08-01 晶元光電股份有限公司 發光元件
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KR101158080B1 (ko) * 2010-07-22 2012-06-22 서울옵토디바이스주식회사 발광다이오드
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CN102479796A (zh) * 2010-11-22 2012-05-30 晶元光电股份有限公司 整流单元、发光二极管元件及其组合
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JPH05198843A (ja) * 1992-01-23 1993-08-06 Toshiba Lighting & Technol Corp 発光ダイオードランプおよび発光ダイオード表示装置
DE10103422A1 (de) 2001-01-26 2002-08-01 Erich Kaifler Lichtquellen auf Halbleiterbasis für höhere Spannungen und höhere Leistungen, für Gleichstrom und für Wechselstrom

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Publication number Publication date
DE112006002702T5 (de) 2008-07-24
WO2007083885A1 (en) 2007-07-26
JP4690482B2 (ja) 2011-06-01
JP2009519605A (ja) 2009-05-14
KR20070064208A (ko) 2007-06-20
US20080218098A1 (en) 2008-09-11
CN101305476B (zh) 2011-08-24
JP4694631B2 (ja) 2011-06-08
TWI430698B (zh) 2014-03-11
JP2011040791A (ja) 2011-02-24
DE112006002702B4 (de) 2012-11-29
US8054002B2 (en) 2011-11-08
US20120013260A1 (en) 2012-01-19
US8294386B2 (en) 2012-10-23
CN101924117A (zh) 2010-12-22
TW200731863A (en) 2007-08-16
DE112006004221B4 (de) 2015-08-20
CN101305476A (zh) 2008-11-12
TW201117645A (en) 2011-05-16
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JP2010093279A (ja) 2010-04-22

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