JP4690482B2 - 複数の発光セルが配列された発光素子 - Google Patents
複数の発光セルが配列された発光素子 Download PDFInfo
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- 239000000758 substrate Substances 0.000 claims description 31
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 12
- 238000005530 etching Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000000151 deposition Methods 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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- H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
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- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
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Description
好ましくは、前記ブリッジ整流回路内の前記第1及び前記2のブロックの他側端部は第3電極に電気的に接続され、前記ブリッジ整流回路内の前記第3及び前記4のブロックの他側端部は第4電極に電気的に接続される。
好ましくは、前記ブリッジ整流回路内の発光セルの数は、前記発光セルブロック内の前記発光セルの100%から200%である。より好ましくは、100〜130%である。
好ましくは、前記ブリッジ整流回路内の少なくとも一つの発光セルの大きさは、前記発光セルブロック内の前記発光セルの80%以下である。
好ましくは、前記ブリッジ整流回路は、前記基板の最外周部に形成される。
しかしながら、本発明は、以下に開示される実施例に限定されるものではなく、互いに異なる様々な形態に具現され、但し、本実施例は、本発明の開示が完全になるようにし、通常の知識を有する者に発明の範疇を完全に知らせるために提供されるものである。図面上の同一の符号は、同一の要素を指す。
本発明による発光素子は、図3に示すように、基板100と、発光セルブロック140と、ブリッジ整流回路120と、配線260とを備える。前記発光セルブロック140は、前記基板100上に設けられたまま、直列で連結された複数個の発光セル141からなる。前記ブリッジ整流回路120は、前記基板100上に設けられたまま、前記発光セルブロック140の周辺部を取り囲む複数個のダイオード121からなる。前記発光セルブロック140とブリッジ整流回路120は、配線260により連結される。この際、前記発光素子は、前記ブリッジ整流回路120に外部電源を印加し、ブリッジ整流回路120により直流に整流された常時印加電流を、発光セルブロック140に印加するための電極160をさらに備えてもよい。
本発明によるブリッジ整流回路120が設けられた発光素子は、4つで構成された電極160のうち第1の電極160aと第3の電極160cに外部の交流電源が印加されると、順方向電圧である場合、第2のダイオードブロック120bと第3のダイオードブロック120cは、オン状態となり、第1のダイオードブロック120aと第4のダイオードブロック120dは、オフ状態となる。したがって、第1のダイオードブロック120aは、第1の電極160aに印加された電流に対して逆バイアスであるので、電流が流れず、電流は、前記第2のダイオードブロック120bに流れるようになる。また、前記第2のダイオードブロック120bに流れた電流は、第4のダイオードブロック120dに対して逆バイアスであるので、発光セルブロック140に流れるようになる。以降、発光セルブロック140に印加された電流は、第3のダイオードブロック120cに出るようになる。
以下、上述した発光素子の製造方法を、図5乃至図7を参照して説明する。先ず、基板100上に、ドープされていない窒化ガリウム(GaN)層(図示せず)をバッファ層として形成する。前記バッファ層上に、N型半導体層200、活性層220、及びP型半導体層240を順次に結晶成長させる(図5)。この際、P型半導体層240上に、透明電極層(図示せず)をさらに形成してもよい。それぞれの層は、上述した物質を蒸着するための様々な蒸着方法により形成させる。
前記工程を行った後、各発光セルのN型半導体層200が露出するように、P型半導体層240及び活性層220をエッチングする。上述のように、単一のマスクを用いてエッチングを行ってもよいが、それぞれ異なるマスクを用いてエッチングを行ってもよい。すなわち、基板100を露出させる第1のマスクを用いた第1のエッチングを行ってから、N型半導体層200を露出させるために、P型半導体層240及び活性層220の所定の領域を露出させる第2のマスクを用いた第2のエッチングを行ってもよい。
以降、前記N型半導体層200上のN−電極と、隣接したP型半導体層240上のP−電極を、所定のブリッジ工程又はステップカバレッジ等を用いて配線260で連結することにより、図3のような発光素子を完成する(図7)。この際、前記P型半導体層240上にP−電極が透明電極として形成される場合、透明電極の一部をフォト工程でエッチングし、P型半導体層240を露出させ、P型ボンディングパッド(図示せず)が形成されてもよい。
120 ブリッジ整流回路
121 ダイオード
140 発光セルブロック
141 発光セル
160 電極
200 N型半導体層
220 活性層
240 P型半導体層
260 配線
Claims (6)
- 基板と、前記基板上に形成された複数の第1の発光セル及び第2の発光セルと、を備える発光素子であって、
それぞれ直列に接続された前記複数の第1の発光セルを有する第1から第4のブロックを有し、前記基板の最外周部に形成されるブリッジ整流回路と、
前記ブリッジ整流回路の内側に形成され、互いに直列に接続された前記複数の第2の発光セルを有する発光セルブロックと、を備え、
前記発光セルブロックの一端部の前記第2の発光セルの第1電極は、前記ブリッジ整流回路内の前記第1及び前記第3ブロックの一側端部の前記第1の発光セルの第2電極に電気的に接続され、前記発光セルブロックの他端部の前記第2の発光セルの第2電極は、前記ブリッジ整流回路内の前記第2及び前記第4ブロックの一側端部の前記第1の発光セルの第1電極に電気的に接続され、
前記基板上に第3電極と第4電極が前記基板の最外周部に形成され、前記ブリッジ整流回路内の前記第1及び前記第2のブロックの他側端部は前記第3電極に電気的に接続され、前記ブリッジ整流回路内の前記第3及び前記第4のブロックの他側端部は前記第4電極に電気的に接続され、
前記ブリッジ整流回路内の前記第1の発光セルの大きさは、前記発光セルブロック内の前記第2の発光セルの80%以下であることを特徴とする発光素子。 - 請求項1記載の発光素子において、
前記発光セルブロックの前記一端部の前記第2の発光セルの前記第1電極が、前記ブリッジ整流回路内の前記第1及び前記第3ブロックの前記一側端部の前記第1の発光セルの前記第2電極に電気的に接続された位置と、前記発光セルブロックの前記他端部の前記第2の発光セルの前記第2電極が、前記ブリッジ整流回路内の前記第2及び前記第4ブロックの前記一側端部の前記第1の発光セルの前記第1電極に電気的に接続された位置は、前記基板上において互いに対向していることを特徴とする発光素子。 - 請求項1記載の発光素子において、
前記複数の第1の発光セル及び第2の発光セルに対して外部電源を供給するための電極を更に備え、前記ブリッジ整流回路内の前記第1及び前記第2のブロックの他端部の前記第1の発光セルは、前記外部電源を供給するための前記電極の一つに電気的に接続され、前記ブリッジ整流回路内の前記第3及び前記第4のブロックの他端部の前記第1の発光セルは、前記外部電源を供給するための前記電極の他の一つに電気的に接続されていることを特徴とする発光素子。 - 請求項3記載の発光素子において、
前記外部電源を供給するための前記電極は、前記基板上において互いに対向して配置されていることを特徴とする発光素子。 - 請求項1記載の発光素子において、
前記ブリッジ整流回路内の前記第1の発光セルの数は、前記発光セルブロック内の前記第2の発光セルの100%から200%であることを特徴とする発光素子。 - 請求項1乃至5の何れか一項に記載の発光素子において、
前記基板の全体形状は四角形であることを特徴とする発光素子。
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KR20050124882A KR100968843B1 (ko) | 2005-12-16 | 2005-12-16 | 다수의 발광셀이 어레이된 발광소자 |
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JP2009275101A Expired - Fee Related JP4690482B2 (ja) | 2005-12-16 | 2009-12-03 | 複数の発光セルが配列された発光素子 |
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KR (1) | KR100968843B1 (ja) |
CN (2) | CN101924117A (ja) |
DE (2) | DE112006002702B4 (ja) |
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US10091842B2 (en) | 2004-02-25 | 2018-10-02 | Lynk Labs, Inc. | AC light emitting diode and AC LED drive methods and apparatus |
US10499465B2 (en) | 2004-02-25 | 2019-12-03 | Lynk Labs, Inc. | High frequency multi-voltage and multi-brightness LED lighting devices and systems and methods of using same |
US8704241B2 (en) * | 2005-05-13 | 2014-04-22 | Epistar Corporation | Light-emitting systems |
TW200723559A (en) * | 2005-12-13 | 2007-06-16 | Ind Tech Res Inst | Alternating current (AC) light emitting assembly and AC light emitting device |
KR100968843B1 (ko) * | 2005-12-16 | 2010-07-09 | 서울옵토디바이스주식회사 | 다수의 발광셀이 어레이된 발광소자 |
TWI371870B (en) * | 2006-11-08 | 2012-09-01 | Epistar Corp | Alternate current light-emitting device and fabrication method thereof |
TWM320181U (en) * | 2007-01-11 | 2007-10-01 | Everlight Electronics Co Ltd | Altenating current light emitting diode device |
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JP4694631B2 (ja) | 2011-06-08 |
US20120013260A1 (en) | 2012-01-19 |
JP2011040791A (ja) | 2011-02-24 |
US8294386B2 (en) | 2012-10-23 |
TW201117645A (en) | 2011-05-16 |
JP2010093279A (ja) | 2010-04-22 |
DE112006004221B4 (de) | 2015-08-20 |
CN101305476B (zh) | 2011-08-24 |
JP2009519605A (ja) | 2009-05-14 |
WO2007083885A1 (en) | 2007-07-26 |
US20080218098A1 (en) | 2008-09-11 |
JP5193271B2 (ja) | 2013-05-08 |
DE112006002702T5 (de) | 2008-07-24 |
US8054002B2 (en) | 2011-11-08 |
KR20070064208A (ko) | 2007-06-20 |
CN101924117A (zh) | 2010-12-22 |
TW200731863A (en) | 2007-08-16 |
KR100968843B1 (ko) | 2010-07-09 |
TWI430698B (zh) | 2014-03-11 |
TWI410169B (zh) | 2013-09-21 |
CN101305476A (zh) | 2008-11-12 |
DE112006002702B4 (de) | 2012-11-29 |
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