TWI410169B - 具有發光單元陣列的發光元件 - Google Patents

具有發光單元陣列的發光元件 Download PDF

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Publication number
TWI410169B
TWI410169B TW95146586A TW95146586A TWI410169B TW I410169 B TWI410169 B TW I410169B TW 95146586 A TW95146586 A TW 95146586A TW 95146586 A TW95146586 A TW 95146586A TW I410169 B TWI410169 B TW I410169B
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TW
Taiwan
Prior art keywords
light
emitting
diodes
emitting element
diode
Prior art date
Application number
TW95146586A
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English (en)
Chinese (zh)
Other versions
TW200731863A (en
Inventor
李在皓
尹麗鎮
黃義鎮
拉克魯瓦 伊夫
Original Assignee
首爾Ｏｐｔｏ儀器股份有限公司
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Publication of TW200731863A publication Critical patent/TW200731863A/zh
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Publication of TWI410169B publication Critical patent/TWI410169B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • H05B45/37—Converter circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001—Core members of the connector
    • H01L2224/37099—Material
    • H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/40137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
TW95146586A 2005-12-16 2006-12-13 具有發光單元陣列的發光元件 TWI410169B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20050124882A KR100968843B1 (ko) 2005-12-16 2005-12-16 다수의 발광셀이 어레이된 발광소자

Publications (2)

Publication Number Publication Date
TW200731863A TW200731863A (en) 2007-08-16
TWI410169B true TWI410169B (zh) 2013-09-21

Family

ID=38287805

Family Applications (2)

Application Number Title Priority Date Filing Date
TW95146586A TWI410169B (zh) 2005-12-16 2006-12-13 具有發光單元陣列的發光元件
TW99133759A TWI430698B (zh) 2005-12-16 2006-12-13 具有發光單元的發光元件

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW99133759A TWI430698B (zh) 2005-12-16 2006-12-13 具有發光單元的發光元件

Country Status (7)

Country Link
US (2) US8054002B2 (enExample)
JP (3) JP4694631B2 (enExample)
KR (1) KR100968843B1 (enExample)
CN (2) CN101305476B (enExample)
DE (2) DE112006002702B4 (enExample)
TW (2) TWI410169B (enExample)
WO (1) WO2007083885A1 (enExample)

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US10506674B2 (en) 2004-02-25 2019-12-10 Lynk Labs, Inc. AC light emitting diode and AC LED drive methods and apparatus
US10575376B2 (en) 2004-02-25 2020-02-25 Lynk Labs, Inc. AC light emitting diode and AC LED drive methods and apparatus
US10499465B2 (en) 2004-02-25 2019-12-03 Lynk Labs, Inc. High frequency multi-voltage and multi-brightness LED lighting devices and systems and methods of using same
CN1943276B (zh) 2004-02-25 2012-05-23 迈克尔·米斯金 Ac发光二极管以及ac led驱动方法和装置
US10091842B2 (en) 2004-02-25 2018-10-02 Lynk Labs, Inc. AC light emitting diode and AC LED drive methods and apparatus
TW200723559A (en) * 2005-12-13 2007-06-16 Ind Tech Res Inst Alternating current (AC) light emitting assembly and AC light emitting device
US8704241B2 (en) 2005-05-13 2014-04-22 Epistar Corporation Light-emitting systems
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TWI371870B (en) * 2006-11-08 2012-09-01 Epistar Corp Alternate current light-emitting device and fabrication method thereof
TWM320181U (en) * 2007-01-11 2007-10-01 Everlight Electronics Co Ltd Altenating current light emitting diode device
US10986714B2 (en) 2007-10-06 2021-04-20 Lynk Labs, Inc. Lighting system having two or more LED packages having a specified separation distance
MY153548A (en) * 2007-10-06 2015-02-27 Lynk Labs Inc Led circuits and assemblies
US11297705B2 (en) 2007-10-06 2022-04-05 Lynk Labs, Inc. Multi-voltage and multi-brightness LED lighting devices and methods of using same
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WO2010050694A2 (ko) * 2008-10-29 2010-05-06 서울옵토디바이스주식회사 발광 다이오드
KR101523002B1 (ko) * 2009-01-13 2015-05-26 서울반도체 주식회사 발광 장치
TWM374153U (en) 2009-03-19 2010-02-11 Intematix Technology Ct Corp Light emitting device applied to AC drive
EP3573432A3 (en) 2009-05-28 2020-02-12 Lynk Labs, Inc. Multi-voltage and multi-brigthness led lighting devices and methods of using
TWI398966B (zh) * 2009-06-08 2013-06-11 晶元光電股份有限公司 發光元件及其製造方法
TWI495084B (zh) * 2009-07-07 2015-08-01 晶元光電股份有限公司 發光元件
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CA2785721C (en) 2009-12-28 2020-10-27 Lynk Labs, Inc. High frequency multi-voltage and multi-brightness led lighting devices
TWI499347B (zh) * 2009-12-31 2015-09-01 晶元光電股份有限公司 發光元件
TW201129228A (en) * 2010-02-09 2011-08-16 Everlight Electronics Co Ltd Light emitting diode lighting apparatus
KR101158080B1 (ko) * 2010-07-22 2012-06-22 서울옵토디바이스주식회사 발광다이오드
JP2012028749A (ja) * 2010-07-22 2012-02-09 Seoul Opto Devices Co Ltd 発光ダイオード
EP2603931B1 (en) * 2010-08-10 2016-03-23 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Silicon photoelectric multiplier with multiple "isochronic" read-out
CN102412358B (zh) * 2010-09-23 2014-04-09 展晶科技(深圳)有限公司 封装基板
CN102479796A (zh) * 2010-11-22 2012-05-30 晶元光电股份有限公司 整流单元、发光二极管元件及其组合
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KR102087935B1 (ko) * 2012-12-27 2020-03-11 엘지이노텍 주식회사 발광 소자
TWI597872B (zh) 2013-11-25 2017-09-01 晶元光電股份有限公司 發光二極體元件
CN104681575A (zh) * 2013-11-29 2015-06-03 晶元光电股份有限公司 发光二极管元件
CN103700755A (zh) * 2013-12-26 2014-04-02 四川柏狮光电技术有限公司 一种交流驱动led灯具、引线支架及整体制备方法
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JP7014973B2 (ja) * 2019-08-28 2022-02-02 日亜化学工業株式会社 発光装置
TWI705562B (zh) * 2019-12-13 2020-09-21 國立中興大學 大面積被動式微發光二極體陣列顯示器
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Also Published As

Publication number Publication date
DE112006002702T5 (de) 2008-07-24
WO2007083885A1 (en) 2007-07-26
JP4690482B2 (ja) 2011-06-01
JP2009519605A (ja) 2009-05-14
KR20070064208A (ko) 2007-06-20
US20080218098A1 (en) 2008-09-11
CN101305476B (zh) 2011-08-24
JP4694631B2 (ja) 2011-06-08
TWI430698B (zh) 2014-03-11
JP2011040791A (ja) 2011-02-24
DE112006002702B4 (de) 2012-11-29
US8054002B2 (en) 2011-11-08
US20120013260A1 (en) 2012-01-19
US8294386B2 (en) 2012-10-23
CN101924117A (zh) 2010-12-22
TW200731863A (en) 2007-08-16
DE112006004221B4 (de) 2015-08-20
KR100968843B1 (ko) 2010-07-09
CN101305476A (zh) 2008-11-12
TW201117645A (en) 2011-05-16
JP5193271B2 (ja) 2013-05-08
JP2010093279A (ja) 2010-04-22

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