TWI410169B - 具有發光單元陣列的發光元件 - Google Patents

具有發光單元陣列的發光元件 Download PDF

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Publication number
TWI410169B
TWI410169B TW95146586A TW95146586A TWI410169B TW I410169 B TWI410169 B TW I410169B TW 95146586 A TW95146586 A TW 95146586A TW 95146586 A TW95146586 A TW 95146586A TW I410169 B TWI410169 B TW I410169B
Authority
TW
Taiwan
Prior art keywords
light
emitting
diodes
emitting element
diode
Prior art date
Application number
TW95146586A
Other languages
English (en)
Chinese (zh)
Other versions
TW200731863A (en
Inventor
李在皓
尹麗鎮
黃義鎮
拉克魯瓦 伊夫
Original Assignee
首爾Ｏｐｔｏ儀器股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 首爾Ｏｐｔｏ儀器股份有限公司 filed Critical 首爾Ｏｐｔｏ儀器股份有限公司
Publication of TW200731863A publication Critical patent/TW200731863A/zh
Application granted granted Critical
Publication of TWI410169B publication Critical patent/TWI410169B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • H05B45/37—Converter circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/652—Materials of strap connectors comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Landscapes

  • Led Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
TW95146586A 2005-12-16 2006-12-13 具有發光單元陣列的發光元件 TWI410169B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20050124882A KR100968843B1 (ko) 2005-12-16 2005-12-16 다수의 발광셀이 어레이된 발광소자

Publications (2)

Publication Number Publication Date
TW200731863A TW200731863A (en) 2007-08-16
TWI410169B true TWI410169B (zh) 2013-09-21

Family

ID=38287805

Family Applications (2)

Application Number Title Priority Date Filing Date
TW95146586A TWI410169B (zh) 2005-12-16 2006-12-13 具有發光單元陣列的發光元件
TW99133759A TWI430698B (zh) 2005-12-16 2006-12-13 具有發光單元的發光元件

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW99133759A TWI430698B (zh) 2005-12-16 2006-12-13 具有發光單元的發光元件

Country Status (7)

Country Link
US (2) US8054002B2 (enExample)
JP (3) JP4694631B2 (enExample)
KR (1) KR100968843B1 (enExample)
CN (2) CN101305476B (enExample)
DE (2) DE112006002702B4 (enExample)
TW (2) TWI410169B (enExample)
WO (1) WO2007083885A1 (enExample)

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US10506674B2 (en) 2004-02-25 2019-12-10 Lynk Labs, Inc. AC light emitting diode and AC LED drive methods and apparatus
EP1731003B1 (en) 2004-02-25 2011-03-30 Michael Miskin Ac light emitting diode and ac led drive methods and apparatus
US10575376B2 (en) 2004-02-25 2020-02-25 Lynk Labs, Inc. AC light emitting diode and AC LED drive methods and apparatus
US9198237B2 (en) 2004-02-25 2015-11-24 Lynk Labs, Inc. LED lighting system
US10499465B2 (en) 2004-02-25 2019-12-03 Lynk Labs, Inc. High frequency multi-voltage and multi-brightness LED lighting devices and systems and methods of using same
US10154551B2 (en) 2004-02-25 2018-12-11 Lynk Labs, Inc. AC light emitting diode and AC LED drive methods and apparatus
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US8704241B2 (en) 2005-05-13 2014-04-22 Epistar Corporation Light-emitting systems
KR100968843B1 (ko) * 2005-12-16 2010-07-09 서울옵토디바이스주식회사 다수의 발광셀이 어레이된 발광소자
TWI371870B (en) * 2006-11-08 2012-09-01 Epistar Corp Alternate current light-emitting device and fabrication method thereof
TWM320181U (en) * 2007-01-11 2007-10-01 Everlight Electronics Co Ltd Altenating current light emitting diode device
US10986714B2 (en) 2007-10-06 2021-04-20 Lynk Labs, Inc. Lighting system having two or more LED packages having a specified separation distance
US11297705B2 (en) 2007-10-06 2022-04-05 Lynk Labs, Inc. Multi-voltage and multi-brightness LED lighting devices and methods of using same
CA2701780C (en) * 2007-10-06 2016-07-26 Lynk Labs, Inc. Led circuits and assemblies
US8648539B2 (en) 2007-10-06 2014-02-11 Lynk Labs, Inc. Multi-voltage and multi-brightness LED lighting devices and methods of using same
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WO2010050694A2 (ko) 2008-10-29 2010-05-06 서울옵토디바이스주식회사 발광 다이오드
KR101523002B1 (ko) * 2009-01-13 2015-05-26 서울반도체 주식회사 발광 장치
TWM374153U (en) * 2009-03-19 2010-02-11 Intematix Technology Ct Corp Light emitting device applied to AC drive
TWI398966B (zh) * 2009-06-08 2013-06-11 晶元光電股份有限公司 發光元件及其製造方法
TWI495084B (zh) * 2009-07-07 2015-08-01 晶元光電股份有限公司 發光元件
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US12279345B2 (en) 2009-12-28 2025-04-15 Lynk Labs, Inc. Light emitting diode and LED drive apparatus
CN102754530A (zh) 2009-12-28 2012-10-24 Lynk实验室公司 高频率多电压和多亮度led照明器件
TWI499347B (zh) * 2009-12-31 2015-09-01 晶元光電股份有限公司 發光元件
TW201129228A (en) * 2010-02-09 2011-08-16 Everlight Electronics Co Ltd Light emitting diode lighting apparatus
JP2012028749A (ja) 2010-07-22 2012-02-09 Seoul Opto Devices Co Ltd 発光ダイオード
KR101158080B1 (ko) * 2010-07-22 2012-06-22 서울옵토디바이스주식회사 발광다이오드
EP2603931B1 (en) * 2010-08-10 2016-03-23 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Silicon photoelectric multiplier with multiple "isochronic" read-out
CN102412358B (zh) * 2010-09-23 2014-04-09 展晶科技(深圳)有限公司 封装基板
CN102479796A (zh) * 2010-11-22 2012-05-30 晶元光电股份有限公司 整流单元、发光二极管元件及其组合
WO2013026053A1 (en) 2011-08-18 2013-02-21 Lynk Labs, Inc. Devices and systems having ac led circuits and methods of driving the same
CN102354481A (zh) * 2011-10-26 2012-02-15 吉林大学 基于单晶片的交流led显示阵列
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WO2013082609A1 (en) 2011-12-02 2013-06-06 Lynk Labs, Inc. Color temperature controlled and low thd led lighting devices and systems and methods of driving the same
JP2013165188A (ja) * 2012-02-10 2013-08-22 Oki Data Corp 半導体発光装置、光源装置、画像形成装置及び画像表示装置
KR102087935B1 (ko) * 2012-12-27 2020-03-11 엘지이노텍 주식회사 발광 소자
TWI597872B (zh) 2013-11-25 2017-09-01 晶元光電股份有限公司 發光二極體元件
CN110176469B (zh) * 2013-11-29 2022-01-04 晶元光电股份有限公司 发光二极管元件
CN103700755A (zh) * 2013-12-26 2014-04-02 四川柏狮光电技术有限公司 一种交流驱动led灯具、引线支架及整体制备方法
KR102550415B1 (ko) 2018-05-09 2023-07-05 삼성전자주식회사 Led 장치 및 이를 이용한 led 램프
JP7014973B2 (ja) * 2019-08-28 2022-02-02 日亜化学工業株式会社 発光装置
TWI705562B (zh) * 2019-12-13 2020-09-21 國立中興大學 大面積被動式微發光二極體陣列顯示器
CN210837718U (zh) * 2020-01-08 2020-06-23 漳州冠誉灯饰有限公司 一种共极整流二极管封装结构
CN115720466A (zh) * 2021-08-24 2023-02-28 三星显示有限公司 显示装置

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DE10103422A1 (de) * 2001-01-26 2002-08-01 Erich Kaifler Lichtquellen auf Halbleiterbasis für höhere Spannungen und höhere Leistungen, für Gleichstrom und für Wechselstrom
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Also Published As

Publication number Publication date
US8054002B2 (en) 2011-11-08
KR100968843B1 (ko) 2010-07-09
US8294386B2 (en) 2012-10-23
TW200731863A (en) 2007-08-16
DE112006002702B4 (de) 2012-11-29
JP4690482B2 (ja) 2011-06-01
US20080218098A1 (en) 2008-09-11
JP2009519605A (ja) 2009-05-14
CN101305476B (zh) 2011-08-24
US20120013260A1 (en) 2012-01-19
KR20070064208A (ko) 2007-06-20
CN101305476A (zh) 2008-11-12
JP2011040791A (ja) 2011-02-24
JP5193271B2 (ja) 2013-05-08
JP2010093279A (ja) 2010-04-22
DE112006002702T5 (de) 2008-07-24
DE112006004221B4 (de) 2015-08-20
WO2007083885A1 (en) 2007-07-26
TW201117645A (en) 2011-05-16
JP4694631B2 (ja) 2011-06-08
CN101924117A (zh) 2010-12-22
TWI430698B (zh) 2014-03-11

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