DE112006002702B4 - Lichtemittierende Anordnung für Wechselstrom mit darin gebildeter Brückengleichrichschaltung und gruppierten lichtemittierenden Zellen - Google Patents

Lichtemittierende Anordnung für Wechselstrom mit darin gebildeter Brückengleichrichschaltung und gruppierten lichtemittierenden Zellen Download PDF

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Publication number
DE112006002702B4
DE112006002702B4 DE200611002702 DE112006002702T DE112006002702B4 DE 112006002702 B4 DE112006002702 B4 DE 112006002702B4 DE 200611002702 DE200611002702 DE 200611002702 DE 112006002702 T DE112006002702 T DE 112006002702T DE 112006002702 B4 DE112006002702 B4 DE 112006002702B4
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Germany
Prior art keywords
light
emitting
emitting device
diodes
cell block
Prior art date
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Expired - Fee Related
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DE200611002702
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German (de)
English (en)
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DE112006002702T5 (de
Inventor
Jae Ho Lee
Yeo Jin Yoon
Eu Jin Hwang
Yves Lacroix
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seoul Viosys Co Ltd
Original Assignee
Seoul Optodevice Co Ltd
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Publication of DE112006002702T5 publication Critical patent/DE112006002702T5/de
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • H05B45/37—Converter circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001—Core members of the connector
    • H01L2224/37099—Material
    • H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/40137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
DE200611002702 2005-12-16 2006-12-05 Lichtemittierende Anordnung für Wechselstrom mit darin gebildeter Brückengleichrichschaltung und gruppierten lichtemittierenden Zellen Expired - Fee Related DE112006002702B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2005-0124882 2005-12-16
KR20050124882A KR100968843B1 (ko) 2005-12-16 2005-12-16 다수의 발광셀이 어레이된 발광소자
PCT/KR2006/005186 WO2007083885A1 (en) 2005-12-16 2006-12-05 Light emitting device with light emitting cells arrayed

Publications (2)

Publication Number Publication Date
DE112006002702T5 DE112006002702T5 (de) 2008-07-24
DE112006002702B4 true DE112006002702B4 (de) 2012-11-29

Family

ID=38287805

Family Applications (2)

Application Number Title Priority Date Filing Date
DE200611002702 Expired - Fee Related DE112006002702B4 (de) 2005-12-16 2006-12-05 Lichtemittierende Anordnung für Wechselstrom mit darin gebildeter Brückengleichrichschaltung und gruppierten lichtemittierenden Zellen
DE112006004221.1T Expired - Fee Related DE112006004221B4 (de) 2005-12-16 2006-12-05 Lichtemittierende Anordnung mit gruppierten lichtemittierenden Zellen

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE112006004221.1T Expired - Fee Related DE112006004221B4 (de) 2005-12-16 2006-12-05 Lichtemittierende Anordnung mit gruppierten lichtemittierenden Zellen

Country Status (7)

Country Link
US (2) US8054002B2 (enExample)
JP (3) JP4694631B2 (enExample)
KR (1) KR100968843B1 (enExample)
CN (2) CN101305476B (enExample)
DE (2) DE112006002702B4 (enExample)
TW (2) TWI410169B (enExample)
WO (1) WO2007083885A1 (enExample)

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JP2012028749A (ja) * 2010-07-22 2012-02-09 Seoul Opto Devices Co Ltd 発光ダイオード
EP2603931B1 (en) * 2010-08-10 2016-03-23 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Silicon photoelectric multiplier with multiple "isochronic" read-out
CN102412358B (zh) * 2010-09-23 2014-04-09 展晶科技(深圳)有限公司 封装基板
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CN103700755A (zh) * 2013-12-26 2014-04-02 四川柏狮光电技术有限公司 一种交流驱动led灯具、引线支架及整体制备方法
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DE10103422A1 (de) * 2001-01-26 2002-08-01 Erich Kaifler Lichtquellen auf Halbleiterbasis für höhere Spannungen und höhere Leistungen, für Gleichstrom und für Wechselstrom
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Also Published As

Publication number Publication date
DE112006002702T5 (de) 2008-07-24
WO2007083885A1 (en) 2007-07-26
JP4690482B2 (ja) 2011-06-01
JP2009519605A (ja) 2009-05-14
KR20070064208A (ko) 2007-06-20
US20080218098A1 (en) 2008-09-11
CN101305476B (zh) 2011-08-24
JP4694631B2 (ja) 2011-06-08
TWI430698B (zh) 2014-03-11
JP2011040791A (ja) 2011-02-24
US8054002B2 (en) 2011-11-08
US20120013260A1 (en) 2012-01-19
US8294386B2 (en) 2012-10-23
CN101924117A (zh) 2010-12-22
TW200731863A (en) 2007-08-16
DE112006004221B4 (de) 2015-08-20
KR100968843B1 (ko) 2010-07-09
CN101305476A (zh) 2008-11-12
TW201117645A (en) 2011-05-16
JP5193271B2 (ja) 2013-05-08
TWI410169B (zh) 2013-09-21
JP2010093279A (ja) 2010-04-22

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