KR100967086B1 - 솔더 레지스트, 그 드라이 필름, 경화물 및 인쇄 배선판 - Google Patents
솔더 레지스트, 그 드라이 필름, 경화물 및 인쇄 배선판 Download PDFInfo
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- KR100967086B1 KR100967086B1 KR1020097020402A KR20097020402A KR100967086B1 KR 100967086 B1 KR100967086 B1 KR 100967086B1 KR 1020097020402 A KR1020097020402 A KR 1020097020402A KR 20097020402 A KR20097020402 A KR 20097020402A KR 100967086 B1 KR100967086 B1 KR 100967086B1
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- soldering resist
- epoxy
- acid
- compound
- vinyl ester
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
- C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
- C08G59/1461—Unsaturated monoacids
- C08G59/1466—Acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/302—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Emergency Medicine (AREA)
- General Chemical & Material Sciences (AREA)
- Materials For Photolithography (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Epoxy Resins (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
Claims (11)
- 에폭시 화합물, 페놀 화합물, 불포화 1염기산, 다염기산 무수물로 합성되고, 에폭시 화합물의 적어도 일부로서 융점 90 ℃ 이상의 결정성 에폭시 수지를 사용하고, 페놀 화합물의 적어도 일부로서 비스페놀 S 골격을 가지는 것을 사용하여 수득된 산 변성 비닐에스테르를 함유하는 것을 특징으로 하는 솔더 레지스트.
- 제 1 항에 있어서, 결정성 에폭시 수지가 비페닐 구조를 가지는 것인 솔더 레지스트.
- 제 1 항에 있어서, 에폭시 화합물 1몰에 대한 페놀 화합물의 사용량이 0.3몰 이상 0.8몰 이하인 솔더 레지스트.
- 제 1 항에 있어서, 에폭시아크릴레이트가 추가로 함유되어 있는 솔더 레지스트.
- 제 4 항에 있어서, 에폭시아크릴레이트가 카르복실기를 가지는 에폭시아크릴레이트를 함유하는 솔더 레지스트.
- 제 1 항에 있어서, 1분자 중에 2개 이상의 카르복실기와 반응할 수 있는 작용기를 가지는 화합물이 추가로 함유되어 있는 솔더 레지스트.
- 제 6 항에 있어서, 1분자 중에 2개 이상의 카르복실기와 반응할 수 있는 작용기를 가지는 화합물이 비페닐 구조를 가지는 것인 솔더 레지스트.
- 제 1 항에 기재된 솔더 레지스트용 산 변성 비닐에스테르로서, 에폭시 화합물, 페놀 화합물, 불포화 1염기산, 다염기산 무수물로 합성되고, 에폭시 화합물의 적어도 일부로서 융점 90 ℃ 이상의 결정성 에폭시 수지를 사용하고, 페놀 화합물의 적어도 일부로서 비스페놀 S 골격을 가지는 것을 사용하여 수득된 것을 특징으로 하는 산 변성 비닐에스테르.
- 제 1 항 내지 제 7 항 중 어느 한 항에 기재된 솔더 레지스트를 캐리어 필름에 도포ㆍ건조해서 수득되는 솔더 레지스트층을 가지는 것을 특징으로 하는 드라이 필름.
- 제 1 항 내지 제 7 항 중 어느 한 항에 기재된 솔더 레지스트, 또는상기 솔더 레지스트를 캐리어 필름에 도포ㆍ건조해서 수득되는 솔더 레지스트층을 가지는 드라이 필름의 솔더 레지스트층을,활성 에너지선 조사에 의해 경화시키거나, 혹은 가열에 의해 경화시키거나, 또는 활성 에너지선 조사 및 가열에 의해 경화시켜 수득된 것을 특징으로 하는 경화물.
- 소정 회로 패턴의 도체층을 가지는 회로기판 상에,제 1 항 내지 제 7 항 중 어느 한 항에 기재된 솔더 레지스트, 또는상기 솔더 레지스트를 캐리어 필름에 도포ㆍ건조해서 수득되는 솔더 레지스트층을 가지는 드라이 필름의 솔더 레지스트층을,경화시킨 보호막을 구비한 것을 특징으로 하는 인쇄 배선판.
Applications Claiming Priority (2)
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JPJP-P-2007-053622 | 2007-03-05 | ||
JP2007053622 | 2007-03-05 |
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KR20090130852A KR20090130852A (ko) | 2009-12-24 |
KR100967086B1 true KR100967086B1 (ko) | 2010-07-01 |
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KR1020097020402A KR100967086B1 (ko) | 2007-03-05 | 2008-03-04 | 솔더 레지스트, 그 드라이 필름, 경화물 및 인쇄 배선판 |
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US (1) | US8722816B2 (ko) |
JP (2) | JP4774070B2 (ko) |
KR (1) | KR100967086B1 (ko) |
CN (1) | CN101622578B (ko) |
TW (1) | TWI399393B (ko) |
WO (1) | WO2008108359A1 (ko) |
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JP4774070B2 (ja) * | 2007-03-05 | 2011-09-14 | 株式会社日本触媒 | 画像形成用感光性樹脂組成物及びその製造方法 |
JP5439075B2 (ja) | 2009-07-21 | 2014-03-12 | 太陽ホールディングス株式会社 | 光硬化性樹脂組成物 |
KR101481071B1 (ko) | 2010-03-08 | 2015-01-13 | 주식회사 엘지화학 | 내열성 및 기계적 성질이 우수한 감광성 수지 조성물 및 인쇄회로기판용 보호필름 |
KR101758535B1 (ko) | 2012-07-31 | 2017-07-14 | 아사히 가세이 이-매터리얼즈 가부시키가이샤 | 에폭시 수지 조성물, 에폭시 수지 및 경화물 |
TWI557176B (zh) * | 2014-01-14 | 2016-11-11 | Taiyo Ink Mfg Co Ltd | A thermosetting resin composition, a hardened product thereof, and a printed wiring board using the same |
CN105467753B (zh) * | 2014-07-31 | 2020-01-14 | 太阳油墨(苏州)有限公司 | 光固化性热固化性树脂组合物、干膜、固化物、及印刷电路板 |
JP6557155B2 (ja) * | 2015-02-02 | 2019-08-07 | 株式会社日本触媒 | 硬化性樹脂およびその製造方法 |
WO2016208187A1 (ja) * | 2015-06-24 | 2016-12-29 | 互応化学工業株式会社 | ソルダーレジスト組成物、被膜、被覆プリント配線板、被膜の製造方法、及び被覆プリント配線板の製造方法 |
WO2017057431A1 (ja) * | 2015-09-30 | 2017-04-06 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルムおよびそれを用いたプリント配線板 |
KR102527764B1 (ko) * | 2015-12-17 | 2023-05-02 | 삼성전자주식회사 | 감광성 조성물, 이를 제조하기 위한 방법, 및 이로부터 제조된 양자점-폴리머 복합체 패턴 |
CN110366585B (zh) * | 2017-02-24 | 2022-04-29 | 富士胶片株式会社 | 光固化性油墨组合物及图像形成方法 |
JP2018168329A (ja) * | 2017-03-30 | 2018-11-01 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルム、硬化物、プリント配線板、および、カルボキシル基含有樹脂の製造方法 |
WO2023182273A1 (ja) * | 2022-03-25 | 2023-09-28 | 株式会社日本触媒 | アルカリ可溶性樹脂、アルカリ可溶性樹脂組成物、及びその製造方法 |
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- 2008-03-03 JP JP2008052405A patent/JP4376290B2/ja active Active
- 2008-03-04 WO PCT/JP2008/053831 patent/WO2008108359A1/ja active Application Filing
- 2008-03-04 CN CN200880006862.8A patent/CN101622578B/zh active Active
- 2008-03-04 TW TW097107446A patent/TWI399393B/zh active
- 2008-03-04 KR KR1020097020402A patent/KR100967086B1/ko active IP Right Grant
- 2008-03-04 US US12/449,970 patent/US8722816B2/en active Active
Patent Citations (3)
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JP2000109541A (ja) | 1998-10-06 | 2000-04-18 | Nippon Poritekku Kk | 感光性熱硬化性樹脂組成物 |
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WO2008108359A1 (ja) | 2008-09-12 |
TWI399393B (zh) | 2013-06-21 |
JP4774070B2 (ja) | 2011-09-14 |
JP2008250306A (ja) | 2008-10-16 |
TW200842146A (en) | 2008-11-01 |
US8722816B2 (en) | 2014-05-13 |
JP4376290B2 (ja) | 2009-12-02 |
JP2008250305A (ja) | 2008-10-16 |
CN101622578B (zh) | 2012-12-05 |
KR20090130852A (ko) | 2009-12-24 |
US20100243304A1 (en) | 2010-09-30 |
CN101622578A (zh) | 2010-01-06 |
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