KR100959577B1 - 정보 기술 장치용 인클로저 - Google Patents

정보 기술 장치용 인클로저 Download PDF

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Publication number
KR100959577B1
KR100959577B1 KR1020070119635A KR20070119635A KR100959577B1 KR 100959577 B1 KR100959577 B1 KR 100959577B1 KR 1020070119635 A KR1020070119635 A KR 1020070119635A KR 20070119635 A KR20070119635 A KR 20070119635A KR 100959577 B1 KR100959577 B1 KR 100959577B1
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KR
South Korea
Prior art keywords
cover
enclosure
opening
connector
information technology
Prior art date
Application number
KR1020070119635A
Other languages
English (en)
Korean (ko)
Other versions
KR20080068525A (ko
Inventor
요시로 다나카
도시유키 홈마
히데아키 가미카코이
Original Assignee
후지쯔 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지쯔 가부시끼가이샤 filed Critical 후지쯔 가부시끼가이샤
Publication of KR20080068525A publication Critical patent/KR20080068525A/ko
Application granted granted Critical
Publication of KR100959577B1 publication Critical patent/KR100959577B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6598—Shield material
    • H01R13/6599—Dielectric material made conductive, e.g. plastic material coated with metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0018—Casings with provisions to reduce aperture leakages in walls, e.g. terminals, connectors, cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
KR1020070119635A 2007-01-18 2007-11-22 정보 기술 장치용 인클로저 KR100959577B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-00009392 2007-01-18
JP2007009392A JP2008176567A (ja) 2007-01-18 2007-01-18 プリント基板組立体、情報技術装置用筐体及び情報技術装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020100000742A Division KR100990400B1 (ko) 2007-01-18 2010-01-06 프린트 기판 조립체 및 정보 기술 장치

Publications (2)

Publication Number Publication Date
KR20080068525A KR20080068525A (ko) 2008-07-23
KR100959577B1 true KR100959577B1 (ko) 2010-05-27

Family

ID=39564067

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020070119635A KR100959577B1 (ko) 2007-01-18 2007-11-22 정보 기술 장치용 인클로저
KR1020100000742A KR100990400B1 (ko) 2007-01-18 2010-01-06 프린트 기판 조립체 및 정보 기술 장치

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020100000742A KR100990400B1 (ko) 2007-01-18 2010-01-06 프린트 기판 조립체 및 정보 기술 장치

Country Status (6)

Country Link
US (1) US20080174973A1 (de)
JP (1) JP2008176567A (de)
KR (2) KR100959577B1 (de)
CN (2) CN101854774A (de)
DE (1) DE102007055376A1 (de)
TW (1) TW200833236A (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010160575A (ja) * 2009-01-06 2010-07-22 Fujitsu Ltd 電子機器
JP6322951B2 (ja) 2013-10-18 2018-05-16 株式会社デンソー 車両電子装置
GB2533354B (en) * 2014-12-17 2017-09-13 Etl Systems Ltd Connector assembly and related methods and assemblies
JP6134829B1 (ja) * 2016-02-23 2017-05-24 レノボ・シンガポール・プライベート・リミテッド 電子機器
JP6768730B2 (ja) * 2018-03-30 2020-10-14 株式会社東芝 電子機器
CN109688747B (zh) * 2018-12-25 2020-10-16 苏州佳世达光电有限公司 电子装置
US10938161B2 (en) 2019-03-29 2021-03-02 Intel Corporation Snap-on electromagnetic interference (EMI)-shielding without motherboard ground requirement

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000013081A (ja) 1998-06-17 2000-01-14 Kenichi Ito 電子部品
JP2002353639A (ja) 2001-05-29 2002-12-06 Fuji Xerox Co Ltd 画像形成装置
US20060115243A1 (en) * 2002-12-23 2006-06-01 Jae-In Jeong Resistance-heated boat and manufacturing method thereof
US20060157538A1 (en) * 2003-07-24 2006-07-20 Multi Orbital Systems, Gmbh Orbital friction welding method and device for carrying out said method

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5596487A (en) * 1995-07-31 1997-01-21 Motorola, Inc. Apparatus for RF shielding radio circuitry
US6242842B1 (en) * 1996-12-16 2001-06-05 Siemens Matsushita Components Gmbh & Co. Kg Electrical component, in particular saw component operating with surface acoustic waves, and a method for its production
US5724234A (en) * 1996-05-02 1998-03-03 Ericsson Inc. Slotted shield can
JP3725636B2 (ja) * 1996-11-01 2005-12-14 株式会社東芝 携帯形電子機器
EP0910233B1 (de) * 1997-10-13 2002-09-25 Itt Manufacturing Enterprises, Inc. Eine abgeschirmte PC-Karte und deren Herstellungsverfahren
JP2000151132A (ja) 1998-11-13 2000-05-30 Matsushita Electric Ind Co Ltd 携帯端末用樹脂金属一体型筐体
US6157538A (en) * 1998-12-07 2000-12-05 Intel Corporation Heat dissipation apparatus and method
FR2815778B1 (fr) * 2000-10-23 2002-12-06 Alstom Dispositif de protection d'un connecteur electrique pour plaque de circuit imprime contre les perturbations electromagnetiques
CN2509631Y (zh) * 2001-10-29 2002-09-04 仁宝电脑工业股份有限公司 具有防电磁波作用的内存扩充槽盖体的电子装置
US6469912B1 (en) * 2001-11-16 2002-10-22 Compal Electronics, Inc. Electrical apparatus having a cover member adapted to provide electromagnetic interference shielding to an electronic component
TWM261851U (en) * 2004-08-17 2005-04-11 Molex Taiwan Ltd Electrical connector
JP4989098B2 (ja) 2005-06-02 2012-08-01 津田駒工業株式会社 水噴射式織機の緯入れ安定化装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000013081A (ja) 1998-06-17 2000-01-14 Kenichi Ito 電子部品
JP2002353639A (ja) 2001-05-29 2002-12-06 Fuji Xerox Co Ltd 画像形成装置
US20060115243A1 (en) * 2002-12-23 2006-06-01 Jae-In Jeong Resistance-heated boat and manufacturing method thereof
US20060157538A1 (en) * 2003-07-24 2006-07-20 Multi Orbital Systems, Gmbh Orbital friction welding method and device for carrying out said method

Also Published As

Publication number Publication date
KR20080068525A (ko) 2008-07-23
CN101854774A (zh) 2010-10-06
JP2008176567A (ja) 2008-07-31
CN101227804A (zh) 2008-07-23
TW200833236A (en) 2008-08-01
KR20100023012A (ko) 2010-03-03
KR100990400B1 (ko) 2010-10-29
US20080174973A1 (en) 2008-07-24
CN101227804B (zh) 2010-07-14
DE102007055376A1 (de) 2008-07-31

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