KR100945468B1 - 발광장치 및 그 제조방법 - Google Patents

발광장치 및 그 제조방법 Download PDF

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Publication number
KR100945468B1
KR100945468B1 KR1020020084828A KR20020084828A KR100945468B1 KR 100945468 B1 KR100945468 B1 KR 100945468B1 KR 1020020084828 A KR1020020084828 A KR 1020020084828A KR 20020084828 A KR20020084828 A KR 20020084828A KR 100945468 B1 KR100945468 B1 KR 100945468B1
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South Korea
Prior art keywords
insulating film
film
atomic
electrode
light emitting
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Expired - Fee Related
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KR1020020084828A
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Korean (ko)
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KR20030057408A (ko
Inventor
무라카미사토시
타카야마토루
아키모토켄고
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가부시키가이샤 한도오따이 에네루기 켄큐쇼
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Thin Film Transistor (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Formation Of Insulating Films (AREA)
KR1020020084828A 2001-12-27 2002-12-27 발광장치 및 그 제조방법 Expired - Fee Related KR100945468B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2001-00398624 2001-12-27
JP2001398624A JP4101511B2 (ja) 2001-12-27 2001-12-27 発光装置及びその作製方法

Publications (2)

Publication Number Publication Date
KR20030057408A KR20030057408A (ko) 2003-07-04
KR100945468B1 true KR100945468B1 (ko) 2010-03-05

Family

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Family Applications (1)

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KR1020020084828A Expired - Fee Related KR100945468B1 (ko) 2001-12-27 2002-12-27 발광장치 및 그 제조방법

Country Status (3)

Country Link
US (3) US6861710B2 (https=)
JP (1) JP4101511B2 (https=)
KR (1) KR100945468B1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
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KR101339000B1 (ko) * 2011-12-14 2013-12-09 엘지디스플레이 주식회사 유기전계발광 표시소자 및 그 제조방법

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CN105633304B (zh) * 2016-03-23 2018-03-06 深圳市华星光电技术有限公司 Oled基板的封装方法与oled封装结构
KR102343573B1 (ko) * 2017-05-26 2021-12-28 삼성디스플레이 주식회사 플렉서블 디스플레이 장치
JP7206475B2 (ja) 2018-08-31 2023-01-18 日亜化学工業株式会社 レンズ及び発光装置並びにそれらの製造方法
JP6897641B2 (ja) * 2018-08-31 2021-07-07 日亜化学工業株式会社 レンズ及び発光装置並びにそれらの製造方法
KR102733083B1 (ko) 2018-12-31 2024-11-22 엘지디스플레이 주식회사 유기 발광 표시 장치
KR102861771B1 (ko) * 2021-05-25 2025-09-22 삼성디스플레이 주식회사 표시 패널, 및 이를 포함하는 전자 장치

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US7033848B2 (en) 2006-04-25
KR20030057408A (ko) 2003-07-04
US7492012B2 (en) 2009-02-17
US20030127651A1 (en) 2003-07-10
US20050156172A1 (en) 2005-07-21
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