KR100936378B1 - 원료 공급 유닛과 박막 증착 장치 및 박막 증착 방법 - Google Patents

원료 공급 유닛과 박막 증착 장치 및 박막 증착 방법 Download PDF

Info

Publication number
KR100936378B1
KR100936378B1 KR1020090036633A KR20090036633A KR100936378B1 KR 100936378 B1 KR100936378 B1 KR 100936378B1 KR 1020090036633 A KR1020090036633 A KR 1020090036633A KR 20090036633 A KR20090036633 A KR 20090036633A KR 100936378 B1 KR100936378 B1 KR 100936378B1
Authority
KR
South Korea
Prior art keywords
raw material
unit
vaporization
crucible
thin film
Prior art date
Application number
KR1020090036633A
Other languages
English (en)
Korean (ko)
Inventor
강창호
남궁성태
노준서
조황신
윤형석
배경빈
Original Assignee
에스엔유 프리시젼 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에스엔유 프리시젼 주식회사 filed Critical 에스엔유 프리시젼 주식회사
Priority to KR1020090036633A priority Critical patent/KR100936378B1/ko
Application granted granted Critical
Publication of KR100936378B1 publication Critical patent/KR100936378B1/ko
Priority to PCT/KR2010/002543 priority patent/WO2010126254A2/en
Priority to CN201080019359.3A priority patent/CN102414798B/zh
Priority to JP2012508391A priority patent/JP5372243B2/ja
Priority to TW99113051A priority patent/TWI386501B/zh

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C23C14/544—Controlling the film thickness or evaporation rate using measurement in the gas phase
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
KR1020090036633A 2009-04-27 2009-04-27 원료 공급 유닛과 박막 증착 장치 및 박막 증착 방법 KR100936378B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020090036633A KR100936378B1 (ko) 2009-04-27 2009-04-27 원료 공급 유닛과 박막 증착 장치 및 박막 증착 방법
PCT/KR2010/002543 WO2010126254A2 (en) 2009-04-27 2010-04-23 Source supplying unit, thin film depositing apparatus, and method for depositing thin film
CN201080019359.3A CN102414798B (zh) 2009-04-27 2010-04-23 原料供应单元、薄膜沉积装置及沉积薄膜的方法
JP2012508391A JP5372243B2 (ja) 2009-04-27 2010-04-23 原料供給ユニットと、薄膜蒸着装置および薄膜蒸着方法
TW99113051A TWI386501B (zh) 2009-04-27 2010-04-26 原料供應單元、薄膜沉積裝置及沉積薄膜之方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090036633A KR100936378B1 (ko) 2009-04-27 2009-04-27 원료 공급 유닛과 박막 증착 장치 및 박막 증착 방법

Publications (1)

Publication Number Publication Date
KR100936378B1 true KR100936378B1 (ko) 2010-01-13

Family

ID=41809671

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090036633A KR100936378B1 (ko) 2009-04-27 2009-04-27 원료 공급 유닛과 박막 증착 장치 및 박막 증착 방법

Country Status (5)

Country Link
JP (1) JP5372243B2 (zh)
KR (1) KR100936378B1 (zh)
CN (1) CN102414798B (zh)
TW (1) TWI386501B (zh)
WO (1) WO2010126254A2 (zh)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102373422A (zh) * 2010-08-24 2012-03-14 鸿富锦精密工业（深圳）有限公司 真空镀膜系统
KR101252912B1 (ko) * 2010-08-11 2013-04-09 주식회사 야스 히터 내장형 증발원
KR101359636B1 (ko) * 2012-07-04 2014-02-06 주식회사 선익시스템 유기물 피딩 장치 및 방법
KR101456264B1 (ko) * 2012-12-27 2014-11-03 주식회사 선익시스템 박막증착장치
KR101713112B1 (ko) * 2016-07-26 2017-03-08 에스엔유 프리시젼 주식회사 연속 충진이 가능한 증착물질 공급장치
US10202680B2 (en) 2014-08-04 2019-02-12 Samsung Display Co., Ltd. Apparatus for manufacturing display apparatus
KR20190095641A (ko) * 2018-02-06 2019-08-16 삼성디스플레이 주식회사 유기물 증착 장치와, 이를 이용한 유기물의 증착 방법

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101172275B1 (ko) * 2009-12-31 2012-08-08 에스엔유 프리시젼 주식회사 기화 장치 및 이의 제어 방법
JP5837869B2 (ja) * 2012-12-06 2015-12-24 株式会社フジキン 原料気化供給装置
KR101461738B1 (ko) 2012-12-21 2014-11-14 주식회사 포스코 가열장치 및 이를 포함하는 코팅 시스템
KR101499527B1 (ko) * 2013-06-14 2015-03-10 엘아이지에이디피 주식회사 증착장치 및 증착방법
WO2014208789A1 (ko) * 2013-06-25 2014-12-31 에스엔유 프리시젼 주식회사 공급유닛을 구비하는 박막증착장치
CN111036467A (zh) * 2018-10-15 2020-04-21 许铭案 三合一喷涂机

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007098227A (ja) * 2005-09-30 2007-04-19 Keio Gijuku 液体中に気泡または液滴を生成する装置及び液体中に気泡または液滴を生成する方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6233762A (ja) * 1985-08-06 1987-02-13 Hitachi Ltd 真空蒸着装置
JPS63243264A (ja) * 1987-03-31 1988-10-11 Matsushita Electric Ind Co Ltd 薄膜製造装置
JPH11229144A (ja) * 1998-02-12 1999-08-24 Hitachi Tool Eng Ltd 被覆工具
JPH11229149A (ja) * 1998-02-18 1999-08-24 Nissin Electric Co Ltd 液体原料気化成膜装置と液体原料気化成膜方法
US6251233B1 (en) * 1998-08-03 2001-06-26 The Coca-Cola Company Plasma-enhanced vacuum vapor deposition system including systems for evaporation of a solid, producing an electric arc discharge and measuring ionization and evaporation
TW200304955A (en) * 2002-04-05 2003-10-16 Matsushita Electric Ind Co Ltd Method and apparatus for producing resin thin film
JP2003342716A (ja) * 2002-05-27 2003-12-03 Sumitomo Electric Ind Ltd ＧａＮ結晶の成長方法
WO2005116296A1 (ja) * 2004-05-25 2005-12-08 Kurita Water Industries Ltd. 冷却水の処理方法及び処理薬剤
LV13383B (en) * 2004-05-27 2006-02-20 Sidrabe As Method and device for vacuum vaporization metals or alloys
KR100729097B1 (ko) * 2005-12-28 2007-06-14 삼성에스디아이 주식회사 증발원 및 이를 이용한 박막 증착방법
EP2087145B1 (de) * 2006-09-29 2011-09-28 Von Ardenne Anlagentechnik Gmbh Vakuumbeschichtungsverfahren und anordnung zur durchführung des verfahrens

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007098227A (ja) * 2005-09-30 2007-04-19 Keio Gijuku 液体中に気泡または液滴を生成する装置及び液体中に気泡または液滴を生成する方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101252912B1 (ko) * 2010-08-11 2013-04-09 주식회사 야스 히터 내장형 증발원
CN102373422A (zh) * 2010-08-24 2012-03-14 鸿富锦精密工业（深圳）有限公司 真空镀膜系统
KR101359636B1 (ko) * 2012-07-04 2014-02-06 주식회사 선익시스템 유기물 피딩 장치 및 방법
KR101456264B1 (ko) * 2012-12-27 2014-11-03 주식회사 선익시스템 박막증착장치
US10202680B2 (en) 2014-08-04 2019-02-12 Samsung Display Co., Ltd. Apparatus for manufacturing display apparatus
KR101713112B1 (ko) * 2016-07-26 2017-03-08 에스엔유 프리시젼 주식회사 연속 충진이 가능한 증착물질 공급장치
KR20190095641A (ko) * 2018-02-06 2019-08-16 삼성디스플레이 주식회사 유기물 증착 장치와, 이를 이용한 유기물의 증착 방법
KR102493131B1 (ko) 2018-02-06 2023-01-31 삼성디스플레이 주식회사 유기물 증착 장치와, 이를 이용한 유기물의 증착 방법

Also Published As

Publication number Publication date
TWI386501B (zh) 2013-02-21
CN102414798A (zh) 2012-04-11
JP2012525499A (ja) 2012-10-22
JP5372243B2 (ja) 2013-12-18
TW201105810A (en) 2011-02-16
CN102414798B (zh) 2014-05-14
WO2010126254A2 (en) 2010-11-04
WO2010126254A3 (en) 2011-01-20

Similar Documents

Publication Publication Date Title
KR100936378B1 (ko) 원료 공급 유닛과 박막 증착 장치 및 박막 증착 방법
US20110027462A1 (en) Fast deposition system and method for mass production of large-area thin-film cigs solar cells
KR101754356B1 (ko) 증발원, 증착물질 공급장치, 및 이를 포함하는 증착장치
KR20120111987A (ko) 증착 방법 및 증착 장치
KR20110052469A (ko) 진공 증착 장치, 진공 증착 방법 및 유기 ｅｌ 표시 장치의 제조 방법
US8317922B2 (en) Gas injection unit and thin film deposition apparatus having the same
CN105177507A (zh) 蒸镀坩埚及蒸镀设备
KR101983009B1 (ko) 증발원 및 이를 구비한 진공 증착 장치
KR100952313B1 (ko) 원료 공급 유닛과 원료 공급 방법 및 박막 증착 장치
KR101109690B1 (ko) 하향식 선형 증발원 및 이를 이용한 박막 형성 장치
KR20130035863A (ko) 증발원 및 성막 장치
TW202035741A (zh) 用以蒸發一材料之蒸發設備及使用蒸發裝置蒸發材料之方法
KR20120116720A (ko) 원료물질 공급장치
KR20120109022A (ko) 대면적 ｃｉｇｓ 박막제조장비
KR20070054418A (ko) 유기발광소자의 유기물질 증착장치
KR20060084249A (ko) 프로펠러형 분사 방식을 이용한 증착 장치
KR20130067086A (ko) 리니어 분사체 및 이를 포함하는 증착장치
KR20130068926A (ko) 증발원 및 이를 구비한 진공 증착 장치
KR100748451B1 (ko) 유기발광소자의 증착장치
KR100795905B1 (ko) 유기 박막 증착 장치
KR100726136B1 (ko) 증착원 분사장치
KR101328589B1 (ko) 다중 증발원 및 이를 이용한 박막 형성 장치
KR100861089B1 (ko) 박막 증착용 면 증발장치 및 이를 구비하는 박막 증착 장치
KR20070071089A (ko) 수평형 다중 분사 노즐을 이용한 오엘이디 증착 장치
KR101114831B1 (ko) 박막 증착 장치용 원료 공급유닛

Legal Events

Date Code Title Description
A201 Request for examination
A302 Request for accelerated examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20121115

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20140107

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20150106

Year of fee payment: 6

FPAY Annual fee payment

Payment date: 20151229

Year of fee payment: 7

FPAY Annual fee payment

Payment date: 20161227

Year of fee payment: 8

LAPS Lapse due to unpaid annual fee