KR100917516B1 - 전기 광학 장치 및 전자기기 - Google Patents
전기 광학 장치 및 전자기기 Download PDFInfo
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- KR100917516B1 KR100917516B1 KR1020080000696A KR20080000696A KR100917516B1 KR 100917516 B1 KR100917516 B1 KR 100917516B1 KR 1020080000696 A KR1020080000696 A KR 1020080000696A KR 20080000696 A KR20080000696 A KR 20080000696A KR 100917516 B1 KR100917516 B1 KR 100917516B1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29199—Material of the matrix
- H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09027—Non-rectangular flat PCB, e.g. circular
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- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Abstract
Description
Claims (10)
- 제 1 기판과 제 2 기판을 접합하여 이루어지는 전기 광학 패널과, 상기 전기 광학 패널에 접속된 가요성의 배선 기판을 갖는 전기 광학 장치로서,상기 제 1 기판은 상기 제 2 기판으로부터 돌출하는 돌출부를 갖고,상기 배선 기판은, 가요성을 갖는 기재와, 상기 기재 상에 마련되는 도전 패턴을 갖고,상기 배선 기판은 상기 제 1 기판의 돌출부에 접착재를 이용하여 접속되며,상기 배선 기판은, 상기 돌출부에 접착된 광폭 부분과, 상기 광폭 부분에 연속해 있고, 또한 상기 돌출부의 돌출 방향의 단변(端邊)으로부터 외측으로 연장하는 협폭 부분을 갖고,상기 광폭 부분의 상기 협폭 부분쪽의 단변은 상기 돌출부의 돌출 방향의 단변의 위치와 일치하거나 또는 상기 돌출부의 돌출 방향의 단변의 위치보다 내측에 있는 것을 특징으로 하는 전기 광학 장치.
- 제 1 항에 있어서,상기 협폭 부분의 연장 방향과 교차하는 방향에 관해서 상기 광폭 부분이 상기 협폭 부분의 측변으로부터 돌출하는 길이를 La로 했을 때,La ≥ 1.5mm인 것을 특징으로 하는 전기 광학 장치.
- 제 1 항에 있어서,상기 광폭 부분은 그 선단(先端)이 상기 제 1 기판의 돌출부의 측변과 일치할 때까지 연장되는 것을 특징으로 하는 전기 광학 장치.
- 제 1 항에 있어서,상기 광폭 부분은 상기 돌출부에 접착되어 상기 돌출부의 내충격 강도 및 내굽힘 강도를 높게 하는 것을 특징으로 하는 전기 광학 장치.
- 제 1 항 내지 제 4 항 중 어느 한 항에 있어서,상기 배선 기판의 협폭 부분의 연장 방향의 길이를 Lb로 하고, 상기 협폭 부분의 연장 방향과 교차하는 방향의 길이를 Lc로 했을 때,Lb < Lc인 것을 특징으로 하는 전기 광학 장치.
- 제 1 항에 있어서,상기 배선 기판의 협폭 부분에 있어서의 연장 방향과 교차하는 방향의 폭으로서 상기 연장 방향에 따른 전체 영역의 폭은, 상기 광폭 부분과 상기 협폭 부분의 경계 부분에 있어서의 상기 협폭 부분의 폭과 동일하거나 또는 그것보다 좁은 것을 특징으로 하는 전기 광학 장치.
- 제 1 항에 있어서,상기 배선 기판에 있어서의 상기 광폭 부분과 상기 협폭 부분의 경계의 각부(角部) 형상은 곡선 형상인 것을 특징으로 하는 전기 광학 장치.
- 제 1 항에 있어서,상기 제 1 기판의 돌출부에는 상기 전기 광학 패널의 검사에 이용하는 검사용 단자가 마련되고, 상기 검사용 단자는 상기 배선 기판의 광폭 부분 및 상기 접착재에 의해 덮이는 것을 특징으로 하는 전기 광학 장치.
- 제 1 항에 있어서,상기 배선 기판은, 상기 제 1 기판의 돌출부 중의 상기 제 2 기판쪽의 표면에 접속되고, 상기 배선 기판과 상기 접착재를 합친 두께와 상기 제 2 기판의 두께가 일치하고 있는 것을 특징으로 하는 전기 광학 장치.
- 청구항 1에 기재된 전기 광학 장치를 갖는 것을 특징으로 하는 전자기기.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JPJP-P-2007-00000423 | 2007-01-05 | ||
JP2007000423A JP4360405B2 (ja) | 2007-01-05 | 2007-01-05 | 電気光学装置及び電子機器 |
Publications (2)
Publication Number | Publication Date |
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KR20080064733A KR20080064733A (ko) | 2008-07-09 |
KR100917516B1 true KR100917516B1 (ko) | 2009-09-16 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020080000696A KR100917516B1 (ko) | 2007-01-05 | 2008-01-03 | 전기 광학 장치 및 전자기기 |
Country Status (5)
Country | Link |
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US (1) | US7710528B2 (ko) |
JP (1) | JP4360405B2 (ko) |
KR (1) | KR100917516B1 (ko) |
CN (1) | CN101216618B (ko) |
TW (1) | TWI497154B (ko) |
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KR101491163B1 (ko) | 2008-12-16 | 2015-02-06 | 엘지이노텍 주식회사 | 액정표시장치 |
US7894123B2 (en) * | 2009-02-27 | 2011-02-22 | Raytheon Company | Multilayer light modulator |
CN104597651B (zh) | 2009-05-02 | 2017-12-05 | 株式会社半导体能源研究所 | 显示设备 |
JP5610465B2 (ja) | 2010-02-18 | 2014-10-22 | 株式会社ジャパンディスプレイ | 液晶表示装置 |
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JP2012181445A (ja) | 2011-03-02 | 2012-09-20 | Seiko Epson Corp | 電気装置 |
JP5796309B2 (ja) * | 2011-03-15 | 2015-10-21 | セイコーエプソン株式会社 | 電気光学装置及び電子機器 |
KR101861628B1 (ko) | 2011-09-16 | 2018-05-29 | 삼성디스플레이 주식회사 | 액정 표시 장치 |
US20130083080A1 (en) | 2011-09-30 | 2013-04-04 | Apple Inc. | Optical system and method to mimic zero-border display |
JP6071215B2 (ja) * | 2012-02-24 | 2017-02-01 | キヤノン株式会社 | 光学ファインダ及びそれを用いた光学機器 |
KR101947165B1 (ko) * | 2012-10-16 | 2019-02-13 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치와 이의 제조 방법 및 회로 필름의 회전 장치 |
JP2015163941A (ja) * | 2014-01-29 | 2015-09-10 | セイコーエプソン株式会社 | 電気光学装置、電子機器 |
KR101570617B1 (ko) * | 2014-09-05 | 2015-11-20 | 엘지디스플레이 주식회사 | 연성회로기판 및 그를 구비하는 터치패널 |
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KR102659601B1 (ko) | 2016-06-28 | 2024-04-22 | 삼성디스플레이 주식회사 | 표시 장치 |
KR102535363B1 (ko) * | 2016-07-11 | 2023-05-24 | 삼성디스플레이 주식회사 | 표시 패널 및 이를 포함하는 표시 장치 |
US10321562B2 (en) * | 2016-07-22 | 2019-06-11 | Lg Innotek Co., Ltd | Flexible circuit board, COF module and electronic device comprising the same |
CN110574095A (zh) * | 2017-04-19 | 2019-12-13 | Agc株式会社 | 罩构件和显示装置 |
CN107134538A (zh) * | 2017-06-29 | 2017-09-05 | 京东方科技集团股份有限公司 | 一种显示基板、制作方法及显示装置 |
CN107123369B (zh) * | 2017-07-11 | 2019-07-30 | 京东方科技集团股份有限公司 | 双面显示结构及其制造平台和制造方法、双面显示装置 |
JP6882232B2 (ja) | 2018-06-28 | 2021-06-02 | パナソニック液晶ディスプレイ株式会社 | 液晶表示装置 |
CN109375436B (zh) | 2018-10-31 | 2020-09-08 | 武汉华星光电半导体显示技术有限公司 | 显示装置 |
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- 2007-11-16 US US11/941,626 patent/US7710528B2/en active Active
- 2007-12-28 CN CN2007103058589A patent/CN101216618B/zh not_active Expired - Fee Related
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2008
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Publication number | Publication date |
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CN101216618B (zh) | 2011-10-12 |
KR20080064733A (ko) | 2008-07-09 |
US7710528B2 (en) | 2010-05-04 |
TWI497154B (zh) | 2015-08-21 |
CN101216618A (zh) | 2008-07-09 |
US20080165316A1 (en) | 2008-07-10 |
TW200844545A (en) | 2008-11-16 |
JP2008165131A (ja) | 2008-07-17 |
JP4360405B2 (ja) | 2009-11-11 |
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