CN101216618B - 电光装置及电子设备 - Google Patents
电光装置及电子设备 Download PDFInfo
- Publication number
- CN101216618B CN101216618B CN2007103058589A CN200710305858A CN101216618B CN 101216618 B CN101216618 B CN 101216618B CN 2007103058589 A CN2007103058589 A CN 2007103058589A CN 200710305858 A CN200710305858 A CN 200710305858A CN 101216618 B CN101216618 B CN 101216618B
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- Prior art keywords
- aforementioned
- substrate
- extension
- liquid crystal
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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Images
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29199—Material of the matrix
- H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09027—Non-rectangular flat PCB, e.g. circular
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007000423A JP4360405B2 (ja) | 2007-01-05 | 2007-01-05 | 電気光学装置及び電子機器 |
JP000423/2007 | 2007-01-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101216618A CN101216618A (zh) | 2008-07-09 |
CN101216618B true CN101216618B (zh) | 2011-10-12 |
Family
ID=39593955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007103058589A Expired - Fee Related CN101216618B (zh) | 2007-01-05 | 2007-12-28 | 电光装置及电子设备 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7710528B2 (zh) |
JP (1) | JP4360405B2 (zh) |
KR (1) | KR100917516B1 (zh) |
CN (1) | CN101216618B (zh) |
TW (1) | TWI497154B (zh) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2245507B1 (en) * | 2008-02-08 | 2016-07-06 | Raytheon Company | Electrophoretic light modulator |
KR101234443B1 (ko) * | 2008-12-15 | 2013-02-18 | 엘지디스플레이 주식회사 | 액정표시장치 |
KR101491163B1 (ko) | 2008-12-16 | 2015-02-06 | 엘지이노텍 주식회사 | 액정표시장치 |
US7894123B2 (en) * | 2009-02-27 | 2011-02-22 | Raytheon Company | Multilayer light modulator |
CN104133314B (zh) | 2009-05-02 | 2019-07-12 | 株式会社半导体能源研究所 | 显示设备 |
JP5610465B2 (ja) | 2010-02-18 | 2014-10-22 | 株式会社ジャパンディスプレイ | 液晶表示装置 |
DE102010023891A1 (de) * | 2010-06-11 | 2011-12-15 | Siemens Aktiengesellschaft | Verfahren und Einrichtung zum Erkennen einer fehlerhaften Darstellung von Bilddaten auf einer Anzeigeeinheit |
JP2012181445A (ja) | 2011-03-02 | 2012-09-20 | Seiko Epson Corp | 電気装置 |
JP5796309B2 (ja) * | 2011-03-15 | 2015-10-21 | セイコーエプソン株式会社 | 電気光学装置及び電子機器 |
KR101861628B1 (ko) | 2011-09-16 | 2018-05-29 | 삼성디스플레이 주식회사 | 액정 표시 장치 |
US20130083080A1 (en) | 2011-09-30 | 2013-04-04 | Apple Inc. | Optical system and method to mimic zero-border display |
JP6071215B2 (ja) * | 2012-02-24 | 2017-02-01 | キヤノン株式会社 | 光学ファインダ及びそれを用いた光学機器 |
KR101947165B1 (ko) * | 2012-10-16 | 2019-02-13 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치와 이의 제조 방법 및 회로 필름의 회전 장치 |
JP2015163941A (ja) * | 2014-01-29 | 2015-09-10 | セイコーエプソン株式会社 | 電気光学装置、電子機器 |
KR101570617B1 (ko) * | 2014-09-05 | 2015-11-20 | 엘지디스플레이 주식회사 | 연성회로기판 및 그를 구비하는 터치패널 |
CN105242427B (zh) * | 2015-10-27 | 2019-06-11 | 南京中电熊猫液晶显示科技有限公司 | Cof柔性电路板 |
KR102659601B1 (ko) | 2016-06-28 | 2024-04-22 | 삼성디스플레이 주식회사 | 표시 장치 |
KR102535363B1 (ko) * | 2016-07-11 | 2023-05-24 | 삼성디스플레이 주식회사 | 표시 패널 및 이를 포함하는 표시 장치 |
US10321562B2 (en) * | 2016-07-22 | 2019-06-11 | Lg Innotek Co., Ltd | Flexible circuit board, COF module and electronic device comprising the same |
CN110574095A (zh) * | 2017-04-19 | 2019-12-13 | Agc株式会社 | 罩构件和显示装置 |
CN107134538A (zh) * | 2017-06-29 | 2017-09-05 | 京东方科技集团股份有限公司 | 一种显示基板、制作方法及显示装置 |
CN107123369B (zh) * | 2017-07-11 | 2019-07-30 | 京东方科技集团股份有限公司 | 双面显示结构及其制造平台和制造方法、双面显示装置 |
JP6882232B2 (ja) * | 2018-06-28 | 2021-06-02 | パナソニック液晶ディスプレイ株式会社 | 液晶表示装置 |
CN109375436B (zh) | 2018-10-31 | 2020-09-08 | 武汉华星光电半导体显示技术有限公司 | 显示装置 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63165683A (ja) | 1986-12-26 | 1988-07-08 | 小俣シヤツタ−工業株式会社 | シ−トシヤツタ−の捲込み昇降装置 |
JPH06265853A (ja) | 1993-03-10 | 1994-09-22 | Seiko Epson Corp | 駆動回路内蔵型tft液晶パネルの実装構造 |
JP2000066204A (ja) | 1998-08-25 | 2000-03-03 | Citizen Watch Co Ltd | 液晶表示装置 |
US6587177B2 (en) * | 2000-02-02 | 2003-07-01 | Casio Computer Co., Ltd. | Connection structure of display device with a plurality of IC chips mounted thereon and wiring board |
JP3840870B2 (ja) | 2000-03-03 | 2006-11-01 | セイコーエプソン株式会社 | 電気光学装置、電子機器、および電気光学装置の製造方法 |
JP2003131250A (ja) | 2001-10-26 | 2003-05-08 | Nanox Corp | 液晶表示装置とそれを用いた携帯用表示装置 |
US20050253773A1 (en) * | 2002-09-25 | 2005-11-17 | Kanetaka Sekiguchi | Display |
JP2004235321A (ja) | 2003-01-29 | 2004-08-19 | Seiko Epson Corp | フレキシブル基板、フレキシブル基板の製造方法、および電気光学装置、ならびに電子機器 |
JP4367222B2 (ja) | 2004-05-07 | 2009-11-18 | カシオ計算機株式会社 | フレキシブルシートの止着構造 |
US7095476B2 (en) * | 2004-10-15 | 2006-08-22 | Wintek Corporation | Liquid crystal module |
JP4251129B2 (ja) | 2004-10-25 | 2009-04-08 | セイコーエプソン株式会社 | 実装構造体、電気光学装置及び電子機器 |
JP2006154324A (ja) | 2004-11-30 | 2006-06-15 | Sanyo Electric Co Ltd | 表示装置 |
JP2006184383A (ja) | 2004-12-27 | 2006-07-13 | Seiko Epson Corp | 電気光学装置および電子機器 |
JP2006201216A (ja) | 2005-01-18 | 2006-08-03 | Seiko Epson Corp | 電気光学装置、電気光学装置の製造方法、電子機器 |
JP2006234975A (ja) | 2005-02-22 | 2006-09-07 | Seiko Epson Corp | 位置合わせ用パターン、表示デバイス、表示デバイスの組立て方法、表示デバイスの位置合わせ検査方法 |
JP2006243428A (ja) | 2005-03-04 | 2006-09-14 | Seiko Epson Corp | 表示装置および表示装置の製造方法、液晶表示装置および液晶表示装置の製造方法、電子機器 |
JP2006301135A (ja) | 2005-04-19 | 2006-11-02 | Sharp Corp | 液晶表示素子及びフレキシブルプリント配線板 |
JP2006349788A (ja) | 2005-06-14 | 2006-12-28 | Sanyo Epson Imaging Devices Corp | 電気光学装置、電気光学装置の製造方法、及び電子機器 |
-
2007
- 2007-01-05 JP JP2007000423A patent/JP4360405B2/ja active Active
- 2007-11-16 US US11/941,626 patent/US7710528B2/en active Active
- 2007-12-28 CN CN2007103058589A patent/CN101216618B/zh not_active Expired - Fee Related
-
2008
- 2008-01-03 KR KR1020080000696A patent/KR100917516B1/ko active IP Right Grant
- 2008-01-04 TW TW097100402A patent/TWI497154B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20080064733A (ko) | 2008-07-09 |
US20080165316A1 (en) | 2008-07-10 |
TWI497154B (zh) | 2015-08-21 |
US7710528B2 (en) | 2010-05-04 |
CN101216618A (zh) | 2008-07-09 |
KR100917516B1 (ko) | 2009-09-16 |
TW200844545A (en) | 2008-11-16 |
JP2008165131A (ja) | 2008-07-17 |
JP4360405B2 (ja) | 2009-11-11 |
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