KR100914110B1 - 반도체 발광 소자 - Google Patents
반도체 발광 소자 Download PDFInfo
- Publication number
- KR100914110B1 KR100914110B1 KR1020070084788A KR20070084788A KR100914110B1 KR 100914110 B1 KR100914110 B1 KR 100914110B1 KR 1020070084788 A KR1020070084788 A KR 1020070084788A KR 20070084788 A KR20070084788 A KR 20070084788A KR 100914110 B1 KR100914110 B1 KR 100914110B1
- Authority
- KR
- South Korea
- Prior art keywords
- electrode
- light emitting
- semiconductor layer
- peripheral edge
- virtual straight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/816—Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
Landscapes
- Led Devices (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006243691A JP2008066554A (ja) | 2006-09-08 | 2006-09-08 | 半導体発光素子 |
| JPJP-P-2006-00243691 | 2006-09-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20080023116A KR20080023116A (ko) | 2008-03-12 |
| KR100914110B1 true KR100914110B1 (ko) | 2009-08-27 |
Family
ID=39288981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020070084788A Expired - Fee Related KR100914110B1 (ko) | 2006-09-08 | 2007-08-23 | 반도체 발광 소자 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2008066554A (enExample) |
| KR (1) | KR100914110B1 (enExample) |
| TW (1) | TW200824151A (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101164663B1 (ko) * | 2007-12-28 | 2012-07-12 | 니치아 카가쿠 고교 가부시키가이샤 | 반도체 발광 소자 및 그 제조방법 |
| JP5150367B2 (ja) | 2008-05-27 | 2013-02-20 | 東芝ディスクリートテクノロジー株式会社 | 発光装置及びその製造方法 |
| TWI424587B (zh) * | 2008-06-30 | 2014-01-21 | Luxtaltek Corp | Light emitting diodes with nanoscale surface structure and embossing molds forming nanometer scale surface structures |
| JP5687858B2 (ja) * | 2010-07-30 | 2015-03-25 | スタンレー電気株式会社 | 半導体発光装置 |
| JP5736930B2 (ja) * | 2011-04-19 | 2015-06-17 | 日亜化学工業株式会社 | 半導体発光素子 |
| JP2013183032A (ja) * | 2012-03-02 | 2013-09-12 | Toshiba Corp | 半導体発光素子 |
| CN103887418B (zh) * | 2012-12-22 | 2017-06-30 | 赛恩倍吉科技顾问(深圳)有限公司 | 发光芯片组合 |
| JP6287317B2 (ja) * | 2013-02-28 | 2018-03-07 | 日亜化学工業株式会社 | 半導体発光素子 |
| JP2014229648A (ja) * | 2013-05-20 | 2014-12-08 | シャープ株式会社 | 半導体発光素子 |
| WO2015156123A1 (ja) * | 2014-04-07 | 2015-10-15 | 旭化成イーマテリアルズ株式会社 | 光学基材及びその製造方法、並びに、積層体、レジスト剥離液 |
| JP7413941B2 (ja) * | 2020-07-03 | 2024-01-16 | 信越半導体株式会社 | 接合型半導体素子及び接合型半導体素子の製造方法 |
| JP7354943B2 (ja) | 2020-07-03 | 2023-10-03 | 信越半導体株式会社 | 接合型半導体受光素子及び接合型半導体受光素子の製造方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6649939B1 (en) | 1999-09-10 | 2003-11-18 | Osram Opto Semiconductors Gmbh & Co. Ohg | Light-emitting diode with a structured surface |
| KR20040090465A (ko) * | 2003-04-15 | 2004-10-25 | 마츠시타 덴끼 산교 가부시키가이샤 | 반도체 발광소자 및 그 제조방법 |
| JP2006049855A (ja) * | 2004-06-28 | 2006-02-16 | Matsushita Electric Ind Co Ltd | 半導体発光素子およびその製造方法 |
| JP2006100569A (ja) * | 2004-09-29 | 2006-04-13 | Sanken Electric Co Ltd | 半導体発光素子およびその製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0818100A (ja) * | 1994-06-24 | 1996-01-19 | Showa Denko Kk | 化合物半導体発光ダイオード |
-
2006
- 2006-09-08 JP JP2006243691A patent/JP2008066554A/ja active Pending
-
2007
- 2007-07-17 TW TW096126033A patent/TW200824151A/zh not_active IP Right Cessation
- 2007-08-23 KR KR1020070084788A patent/KR100914110B1/ko not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6649939B1 (en) | 1999-09-10 | 2003-11-18 | Osram Opto Semiconductors Gmbh & Co. Ohg | Light-emitting diode with a structured surface |
| KR20040090465A (ko) * | 2003-04-15 | 2004-10-25 | 마츠시타 덴끼 산교 가부시키가이샤 | 반도체 발광소자 및 그 제조방법 |
| JP2006049855A (ja) * | 2004-06-28 | 2006-02-16 | Matsushita Electric Ind Co Ltd | 半導体発光素子およびその製造方法 |
| JP2006100569A (ja) * | 2004-09-29 | 2006-04-13 | Sanken Electric Co Ltd | 半導体発光素子およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20080023116A (ko) | 2008-03-12 |
| TWI357162B (enExample) | 2012-01-21 |
| TW200824151A (en) | 2008-06-01 |
| JP2008066554A (ja) | 2008-03-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100914110B1 (ko) | 반도체 발광 소자 | |
| US9705043B2 (en) | Light-emitting diode, light-emitting diode lamp, and illumination device | |
| EP2339654B1 (en) | Light emitting diode | |
| JP6722221B2 (ja) | 発光ダイオード | |
| US7560737B2 (en) | Semiconductor light emitting element and fabrication method thereof | |
| KR101017394B1 (ko) | 발광 소자 및 그것을 제조하는 방법 | |
| KR101209163B1 (ko) | 반도체 발광소자 | |
| KR20140078977A (ko) | 고효율 발광 다이오드 | |
| JP2008066554A5 (enExample) | ||
| US9508900B2 (en) | Light-emitting device | |
| KR20200065872A (ko) | 발광 소자 | |
| KR101773582B1 (ko) | 고효율 발광 다이오드 | |
| US20220285593A1 (en) | Micro LED Display Element | |
| KR20160059221A (ko) | 발광소자 및 조명시스템 | |
| US20170352784A1 (en) | Light-emitting diode with multiple n contact structure | |
| KR101239849B1 (ko) | 고효율 발광 다이오드 | |
| KR101895227B1 (ko) | 반도체 발광소자 | |
| KR101643688B1 (ko) | 반도체 발광소자 | |
| KR102701801B1 (ko) | 공정 여유도가 큰 발광 다이오드 | |
| KR20130125609A (ko) | 광추출 효율이 향상된 발광다이오드 | |
| TW202416557A (zh) | 發光元件及其製造方法 | |
| TW202523165A (zh) | 發光元件 | |
| KR20120035576A (ko) | 발광 소자, 그 제조 방법, 및 발광 소자 패키지 | |
| KR20130135632A (ko) | 신뢰성이 향상된 전극구조를 갖는 발광다이오드 및 그의 제조방법 | |
| KR20200010805A (ko) | 발광소자 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| D13-X000 | Search requested |
St.27 status event code: A-1-2-D10-D13-srh-X000 |
|
| D14-X000 | Search report completed |
St.27 status event code: A-1-2-D10-D14-srh-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20120820 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20120820 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |