KR100894663B1 - 도전성 페이스트 조성물 및 프린트 배선판 - Google Patents

도전성 페이스트 조성물 및 프린트 배선판 Download PDF

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Publication number
KR100894663B1
KR100894663B1 KR1020070029642A KR20070029642A KR100894663B1 KR 100894663 B1 KR100894663 B1 KR 100894663B1 KR 1020070029642 A KR1020070029642 A KR 1020070029642A KR 20070029642 A KR20070029642 A KR 20070029642A KR 100894663 B1 KR100894663 B1 KR 100894663B1
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KR
South Korea
Prior art keywords
paste composition
conductive paste
bump
resin
solvent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020070029642A
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English (en)
Korean (ko)
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KR20070098574A (ko
Inventor
츠토무 우치미
마사유키 나가시마
마사루 고바야시
히로유키 시로가네
Original Assignee
다이니폰 인사츠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 다이니폰 인사츠 가부시키가이샤 filed Critical 다이니폰 인사츠 가부시키가이샤
Publication of KR20070098574A publication Critical patent/KR20070098574A/ko
Application granted granted Critical
Publication of KR100894663B1 publication Critical patent/KR100894663B1/ko
Expired - Fee Related legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020070029642A 2006-03-31 2007-03-27 도전성 페이스트 조성물 및 프린트 배선판 Expired - Fee Related KR100894663B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2006-00097825 2006-03-31
JP2006097825A JP4736901B2 (ja) 2006-03-31 2006-03-31 導電性ペースト組成物およびプリント配線板

Publications (2)

Publication Number Publication Date
KR20070098574A KR20070098574A (ko) 2007-10-05
KR100894663B1 true KR100894663B1 (ko) 2009-04-24

Family

ID=38557465

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070029642A Expired - Fee Related KR100894663B1 (ko) 2006-03-31 2007-03-27 도전성 페이스트 조성물 및 프린트 배선판

Country Status (5)

Country Link
US (1) US7416687B2 (https=)
JP (1) JP4736901B2 (https=)
KR (1) KR100894663B1 (https=)
CN (1) CN101047049B (https=)
TW (1) TW200809877A (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100956074B1 (ko) * 2007-12-06 2010-05-07 제일모직주식회사 범프 형성용 페이스트 조성물
KR100954537B1 (ko) * 2007-12-11 2010-04-23 엘지전자 주식회사 이방성 도전필름 및 이를 포함하는 디스플레이 장치
JP5446131B2 (ja) * 2008-05-28 2014-03-19 株式会社リコー スクリーン版及び複数の個別電極の形成方法
WO2010113892A1 (ja) 2009-03-30 2010-10-07 株式会社トクヤマ メタライズド基板を製造する方法、メタライズド基板
US9374893B2 (en) * 2010-03-02 2016-06-21 Tokuyama Corporation Production method of metallized substrate
CN102248823A (zh) * 2011-05-13 2011-11-23 昆山鼎鑫电子有限公司 一种铝板大尺寸印刷工艺
US20170253750A1 (en) * 2014-09-12 2017-09-07 Sumitomo Metal Mining Co., Ltd. Silver-coated copper powder, and conductive paste, conductive coating material and conductive sheet, each of which uses said silver-coated copper powder
WO2017013866A1 (ja) * 2015-07-22 2017-01-26 信越化学工業株式会社 スクリーン印刷機、スクリーン印刷方法及び太陽電池の電極形成方法
JP6705046B1 (ja) * 2019-12-12 2020-06-03 株式会社ノリタケカンパニーリミテド 低温成形用導電性組成物および導電膜付き基板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000067646A (ja) * 1998-06-12 2000-03-03 Matsushita Electric Ind Co Ltd 導電性ペ―スト
JP2002025338A (ja) 2000-07-11 2002-01-25 Tsuchiya Co Ltd 着色導電ペーストおよびそれを用いる導電積層体とその製造方法
JP2003077337A (ja) 2001-09-04 2003-03-14 Mitsui Chemicals Inc 導電性ペースト組成物及びプリント配線板
JP2004335358A (ja) 2003-05-09 2004-11-25 Fujikura Kasei Co Ltd 導電性銅ペースト組成物

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4765929A (en) * 1986-08-29 1988-08-23 Gte Products Corporation Silk-screenable circuit paste
JP3167840B2 (ja) 1993-04-16 2001-05-21 株式会社東芝 印刷配線板および印刷配線板の製造方法
JPH09286924A (ja) 1996-04-18 1997-11-04 Namitsukusu Kk 導電体の形成方法
JP3588400B2 (ja) 1996-04-18 2004-11-10 ナミックス株式会社 導電性樹脂組成物および導電体の形成方法
JPH10312712A (ja) * 1997-05-14 1998-11-24 Asahi Chem Ind Co Ltd はんだ付け可能な導電性ペースト
JPH11306860A (ja) * 1998-04-15 1999-11-05 Sumitomo Metal Mining Co Ltd 積層セラミックコンデンサ内部電極用ペースト組成物
US6083426A (en) * 1998-06-12 2000-07-04 Matsushita Electric Industrial Co., Ltd. Conductive paste
JP4491534B2 (ja) 1999-06-29 2010-06-30 ナミックス株式会社 電極ペースト組成物およびそれを用いる積層コンデンサの製造方法
JP2002270033A (ja) 2001-03-07 2002-09-20 Mitsui Chemicals Inc 導電性ペースト組成物及びプリント配線板
JP5066779B2 (ja) * 2001-09-28 2012-11-07 日立化成工業株式会社 導電性ペースト及び回路接続方法
JP2003331648A (ja) 2002-05-10 2003-11-21 Tsuchiya Co Ltd 導電ペースト及び電気回路の製造方法
JP4532840B2 (ja) 2003-03-04 2010-08-25 新潟県 金属ペースト

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000067646A (ja) * 1998-06-12 2000-03-03 Matsushita Electric Ind Co Ltd 導電性ペ―スト
JP2002025338A (ja) 2000-07-11 2002-01-25 Tsuchiya Co Ltd 着色導電ペーストおよびそれを用いる導電積層体とその製造方法
JP2003077337A (ja) 2001-09-04 2003-03-14 Mitsui Chemicals Inc 導電性ペースト組成物及びプリント配線板
JP2004335358A (ja) 2003-05-09 2004-11-25 Fujikura Kasei Co Ltd 導電性銅ペースト組成物

Also Published As

Publication number Publication date
TWI374453B (https=) 2012-10-11
KR20070098574A (ko) 2007-10-05
CN101047049B (zh) 2011-09-21
JP2007273271A (ja) 2007-10-18
US20070228336A1 (en) 2007-10-04
US7416687B2 (en) 2008-08-26
TW200809877A (en) 2008-02-16
JP4736901B2 (ja) 2011-07-27
CN101047049A (zh) 2007-10-03

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