KR100887387B1 - 인쇄회로기판 제조장치 및 제조방법 - Google Patents
인쇄회로기판 제조장치 및 제조방법 Download PDFInfo
- Publication number
- KR100887387B1 KR100887387B1 KR1020070085774A KR20070085774A KR100887387B1 KR 100887387 B1 KR100887387 B1 KR 100887387B1 KR 1020070085774 A KR1020070085774 A KR 1020070085774A KR 20070085774 A KR20070085774 A KR 20070085774A KR 100887387 B1 KR100887387 B1 KR 100887387B1
- Authority
- KR
- South Korea
- Prior art keywords
- circuit board
- printed circuit
- insulator
- substrate
- roller
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/22—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of indefinite length
- B29C43/28—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of indefinite length incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/44—Compression means for making articles of indefinite length
- B29C43/46—Rollers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53126—Means to place sheath on running-length core
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53187—Multiple station assembly apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (9)
- 전도성 범프에 의하여 층간 도통되는 인쇄회로기판을 제조하는 장치로서,일면에 상기 전도성 범프가 형성된 기판을 이송하는 이송부;상기 전도성 범프가 형성된 기판과 절연체를 압착시키는 상부롤러 및 하부롤러; 및상기 상부롤러의 표면에 형성되며, 실리콘(Si) 또는 테프론을 포함하는 재질로 이루어지는 탄성코팅층을 포함하는 인쇄회로기판 제조장치.
- 삭제
- 제1항에 있어서,상기 탄성코팅층 표면의 이물질을 제거하도록, 상기 상부롤러와 맞물려 회전하는 클리닝 롤러를 더 포함하는 것을 특징으로 하는 인쇄회로기판 제조장치.
- 제1항 또는 제3항에 있어서,상기 탄성코팅층의 두께는 상기 전도성 범프의 높이보다 큰 것을 특징으로 하는 인쇄회로기판 제조장치.
- 제1항 또는 제3항에 있어서,상기 절연체를 예열시키는 예열기(pre-heater)를 더 포함하는 인쇄회로기판 제조장치.
- 전도성 범프에 의하여 층간 도통되는 인쇄회로기판을 제조하는 방법으로서,기판의 일면에 전도성 범프를 형성하는 단계;상기 기판의 상기 일면에 절연체를 로딩하는 단계;상기 절연체와 상기 기판을 압착하는 단계를 포함하되,상기 압착하는 단계는,상기 기판을 지지하는 하부롤러와, 상기 하부롤러와 맞물리며 표면에 실리콘(Si) 또는 테프론을 포함하는 재질로 이루어지는 탄성코팅층이 형성된 상부롤러에 의해 수행되는 것을 특징으로 하는 인쇄회로기판 제조방법.
- 삭제
- 제6항에 있어서,상기 탄성코팅층의 두께는 상기 전도성 범프의 높이보다 큰 것을 특징으로 하는 인쇄회로기판 제조방법.
- 제6항 또는 제8항에 있어서,상기 기판과 상기 절연체를 압착하는 단계 이전에,상기 절연체를 예열시키는 단계를 더 포함하는 인쇄회로기판 제조방법.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070085774A KR100887387B1 (ko) | 2007-08-24 | 2007-08-24 | 인쇄회로기판 제조장치 및 제조방법 |
US12/076,223 US8151446B2 (en) | 2007-08-24 | 2008-03-14 | Apparatus for manufacturing printed circuit board |
JP2008097316A JP2009054986A (ja) | 2007-08-24 | 2008-04-03 | 印刷回路基板の製造装置及び製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070085774A KR100887387B1 (ko) | 2007-08-24 | 2007-08-24 | 인쇄회로기판 제조장치 및 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090021040A KR20090021040A (ko) | 2009-02-27 |
KR100887387B1 true KR100887387B1 (ko) | 2009-03-06 |
Family
ID=40380818
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070085774A KR100887387B1 (ko) | 2007-08-24 | 2007-08-24 | 인쇄회로기판 제조장치 및 제조방법 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8151446B2 (ko) |
JP (1) | JP2009054986A (ko) |
KR (1) | KR100887387B1 (ko) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05162205A (ja) * | 1991-12-13 | 1993-06-29 | Somar Corp | フィルム張付装置 |
JPH07329266A (ja) * | 1994-06-08 | 1995-12-19 | Toyo Alum Kk | 押付ローラ用クリーニング装置 |
JP2003017855A (ja) | 2001-06-29 | 2003-01-17 | Kyocera Chemical Corp | 多層プリント配線板の製造方法 |
JP2003218526A (ja) * | 2002-01-18 | 2003-07-31 | Sumitomo Metal Mining Co Ltd | 第一配線基材と第二配線基材間における配線層の接続方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03225644A (ja) | 1990-01-30 | 1991-10-04 | Sony Corp | ディスク基板製造装置 |
ATE148032T1 (de) * | 1993-04-30 | 1997-02-15 | De La Rue Giori Sa | Wischvorrichtung einer stichtiefdruckmaschine |
JP3042970B2 (ja) | 1994-12-28 | 2000-05-22 | シャープ株式会社 | ドライレジストフィルムのラミネート方法 |
JP3886199B2 (ja) | 1997-03-21 | 2007-02-28 | コニカミノルタホールディングス株式会社 | 電子写真用トナー、熱ローラー定着方法及びトナーリサイクル画像形成方法 |
JP3901798B2 (ja) * | 1997-06-12 | 2007-04-04 | 大日本印刷株式会社 | プリント配線板の製造装置 |
JP3693497B2 (ja) | 1998-05-27 | 2005-09-07 | 大日本印刷株式会社 | プリント配線板の製造方法およびその製造装置 |
JP2000091735A (ja) | 1998-09-09 | 2000-03-31 | Compeq Manufacturing Co Ltd | フィルム適用装置 |
JP3738615B2 (ja) | 1999-03-26 | 2006-01-25 | コニカミノルタホールディングス株式会社 | 定着装置及び該定着装置を有する画像形成装置 |
JP4686860B2 (ja) | 2000-12-28 | 2011-05-25 | パナソニック株式会社 | フレキシブルプリント配線板の製造方法 |
US6435246B1 (en) * | 2001-01-30 | 2002-08-20 | Eastman Kodak Company | Laminator assembly having a pressure roller with a perforated layer and a belt for a laminator |
-
2007
- 2007-08-24 KR KR1020070085774A patent/KR100887387B1/ko active IP Right Grant
-
2008
- 2008-03-14 US US12/076,223 patent/US8151446B2/en not_active Expired - Fee Related
- 2008-04-03 JP JP2008097316A patent/JP2009054986A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05162205A (ja) * | 1991-12-13 | 1993-06-29 | Somar Corp | フィルム張付装置 |
JPH07329266A (ja) * | 1994-06-08 | 1995-12-19 | Toyo Alum Kk | 押付ローラ用クリーニング装置 |
JP2003017855A (ja) | 2001-06-29 | 2003-01-17 | Kyocera Chemical Corp | 多層プリント配線板の製造方法 |
JP2003218526A (ja) * | 2002-01-18 | 2003-07-31 | Sumitomo Metal Mining Co Ltd | 第一配線基材と第二配線基材間における配線層の接続方法 |
Also Published As
Publication number | Publication date |
---|---|
US8151446B2 (en) | 2012-04-10 |
US20090049683A1 (en) | 2009-02-26 |
KR20090021040A (ko) | 2009-02-27 |
JP2009054986A (ja) | 2009-03-12 |
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