KR100851769B1 - 경화성 에폭시 수지 조성물 - Google Patents
경화성 에폭시 수지 조성물 Download PDFInfo
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- KR100851769B1 KR100851769B1 KR1020037017133A KR20037017133A KR100851769B1 KR 100851769 B1 KR100851769 B1 KR 100851769B1 KR 1020037017133 A KR1020037017133 A KR 1020037017133A KR 20037017133 A KR20037017133 A KR 20037017133A KR 100851769 B1 KR100851769 B1 KR 100851769B1
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- epoxy resin
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- 0 *c(cc(Cc(cc1*)cc(*)c1OCC1OC1)cc1*)c1OCC1OC1 Chemical compound *c(cc(Cc(cc1*)cc(*)c1OCC1OC1)cc1*)c1OCC1OC1 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
b, c, d 및 e는 각각 독립적으로 0 또는 양수이며,
Claims (8)
- 결정성 에폭시 수지(A), 페놀 수지(B) 및 화학식 1의 평균 단위식을 갖는 실리콘 수지(C)를 포함하며, 여기서 성분(C)가 성분(A)와 성분(B)를 합한 100중량부에 대하여 0.1 내지 500중량부의 양으로 사용되는, 경화성 에폭시 수지 조성물.화학식 1(R1SiO3/2)a(R2R3SiO2/2)b(R4R5R6SiO1/2)c(SiO4/2)d(XO1/2)e위의 화학식 1에서,R1, R2, R3, R4, R5 및 R6은 동일하거나 상이한 1가 탄화수소기 또는 에폭시 함유 유기기이고, 단 분자 중의 R1 내지 R6의 합량에 대하여 0.1 내지 40몰%는 에폭시 함유 유기기이고 10몰% 이상은 페닐기이며,X는 수소원자 또는 알킬기이며,a는 양수이고,b, c, d 및 e는 각각 독립적으로 0 또는 양수이며,b/a는 0 내지 10의 수이고,c/a는 0 내지 0.5의 수이며,d/(a+b+c+d)는 0 내지 0.3의 수이고,e/(a+b+c+d)는 0 내지 0.4의 수이다.
- 제1항에 있어서, 성분(A)가 비페닐형 에폭시 수지임을 특징으로 하는, 경화성 에폭시 수지 조성물.
- 제1항에 있어서, 성분(B)가 페놀아르알킬형 페놀 수지임을 특징으로 하는, 경화성 에폭시 수지 조성물.
- 제1항에 있어서, 성분(C)의 연화점이 25℃ 내지 150℃임을 특징으로 하는, 경화성 에폭시 수지 조성물.
- 제1항에 있어서, 성분(C)가, 160℃에서 20분 동안 유지시킨 후의 용융 점도 변화율이 10% 이하인 실리콘 수지임을 특징으로 하는, 경화성 에폭시 수지 조성물.
- 제1항에 있어서, 성분(C)의 중량 평균 분자량이 500 내지 50,000임을 특징으로 하는, 경화성 에폭시 수지 조성물.
- 제1항에 있어서, 성분(C)가, 화학식 R7SiO3/2의 단위(i)(여기서, R7은 1가 탄화수소기이다), 화학식 R8R9SiO2/2의 단위(ii)(여기서, R8 및 R9는 동일하거나 상이한 1가 탄화수소기이다), 화학식 R10R11R12SiO1/2의 단위(iii)(여기서, R10, R11 및 R12는 동일하거나 상이한 1가 탄화수소기이다) 및 화학식 SiO4/2의 단위(iv)로 이루어진 그룹으로부터 선택된 하나 이상의 단위를 갖는 실란 또는 실록산 중의 1종 또는 2종 이상의 혼합물(I)과 화학식 R13R14 fSi(OR15)(3-f)의 에폭시 함유 알콕시실란 또는 이의 부분 가수분해물(II)(여기서, R13은 에폭시 함유 유기기이고, R14는 1가 탄화수소기이며, R15는 알킬기이고, f는 0, 1 또는 2이다)을 염기성 촉매에 의해 반응시킨 실리콘 수지임을 특징으로 하는, 경화성 에폭시 수지 조성물.
- 제1항에 있어서, 무기 충전제(D)를 성분(A) 내지 성분(C)를 합한 100중량부에 대하여 400 내지 1,200중량부의 양으로 추가로 함유함을 특징으로 하는, 경화성 에폭시 수지 조성물.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2001-00199185 | 2001-06-29 | ||
JP2001199185A JP4948716B2 (ja) | 2001-06-29 | 2001-06-29 | 硬化性エポキシ樹脂組成物 |
PCT/JP2002/006620 WO2003002662A1 (fr) | 2001-06-29 | 2002-06-28 | Composition de resine epoxyde durcissable |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20040014595A KR20040014595A (ko) | 2004-02-14 |
KR100851769B1 true KR100851769B1 (ko) | 2008-08-13 |
Family
ID=19036509
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020037017133A KR100851769B1 (ko) | 2001-06-29 | 2002-06-28 | 경화성 에폭시 수지 조성물 |
Country Status (10)
Country | Link |
---|---|
US (1) | US7105614B2 (ko) |
EP (1) | EP1408083B1 (ko) |
JP (1) | JP4948716B2 (ko) |
KR (1) | KR100851769B1 (ko) |
CN (1) | CN1276023C (ko) |
AT (1) | ATE373046T1 (ko) |
CA (1) | CA2452398A1 (ko) |
DE (1) | DE60222424T2 (ko) |
TW (1) | TWI313283B (ko) |
WO (1) | WO2003002662A1 (ko) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI345576B (en) * | 2003-11-07 | 2011-07-21 | Dow Corning Toray Silicone | Curable silicone composition and cured product thereof |
JP2006188593A (ja) * | 2005-01-05 | 2006-07-20 | Dow Corning Toray Co Ltd | シリコーンレジン組成物、硬化性樹脂組成物、および硬化樹脂 |
JP4577716B2 (ja) * | 2005-01-21 | 2010-11-10 | 日本化薬株式会社 | 加熱硬化型エポキシ樹脂組成物及びその硬化接着層を有する物品 |
WO2006087906A1 (ja) * | 2005-02-18 | 2006-08-24 | Hitachi Chemical Co., Ltd. | 新規硬化性樹脂とその製造方法、及びエポキシ樹脂組成物、電子部品装置 |
JP2006294579A (ja) * | 2005-03-17 | 2006-10-26 | Fujitsu Ltd | 突起体の製造方法 |
JP4931366B2 (ja) * | 2005-04-27 | 2012-05-16 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物および電子部品 |
JP5004433B2 (ja) | 2005-04-27 | 2012-08-22 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物およびその硬化物 |
JP5207591B2 (ja) | 2006-02-23 | 2013-06-12 | 東レ・ダウコーニング株式会社 | 半導体装置の製造方法および半導体装置 |
JP5285846B2 (ja) * | 2006-09-11 | 2013-09-11 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物および電子部品 |
JP5306592B2 (ja) * | 2006-12-04 | 2013-10-02 | 東レ・ダウコーニング株式会社 | 硬化性エポキシ樹脂組成物、硬化物、およびその用途 |
JP5547369B2 (ja) * | 2007-09-28 | 2014-07-09 | 東レ・ダウコーニング株式会社 | 硬化性液状エポキシ樹脂組成物およびその硬化物 |
TWI366421B (en) * | 2008-08-22 | 2012-06-11 | Nanya Plastics Corp | High thermal conductivity, high glass transition temperature (tg) resin composition and its pre-impregnated and coating materials for printed circuit boards |
US8580879B2 (en) | 2009-01-06 | 2013-11-12 | Nan Ya Plastics Corporation | Resin composition of high thermal conductivity and high glass transition temperature (Tg) and for use with PCB, and prepreg and coating thereof |
JP4964928B2 (ja) * | 2009-09-15 | 2012-07-04 | 信越化学工業株式会社 | アンダーフィル材組成物及び光半導体装置 |
WO2012058657A2 (en) * | 2010-10-29 | 2012-05-03 | Hardcoat Surfaces Llc | High hardness low surface energy coating |
US20130338265A1 (en) | 2010-12-27 | 2013-12-19 | Dow Corning Toray Co., Ltd. | Curable Epoxy Resin Composition |
KR101560045B1 (ko) * | 2012-07-27 | 2015-10-15 | 주식회사 엘지화학 | 경화성 조성물 |
US9273225B2 (en) | 2012-09-12 | 2016-03-01 | Momentive Performance Materials Inc. | Siloxane organic hybrid materials providing flexibility to epoxy-based coating compositions |
CN104823110B (zh) * | 2012-12-27 | 2021-06-04 | 昭和电工材料株式会社 | 感光性树脂组合物、感光性膜以及抗蚀图案的形成方法 |
CN110869410B (zh) * | 2017-07-11 | 2022-04-26 | 三菱瓦斯化学株式会社 | 印刷电路板用树脂组合物、预浸料、树脂片、层叠板、覆金属箔层叠板、印刷电路板和多层印刷电路板 |
WO2019087258A1 (ja) | 2017-10-30 | 2019-05-09 | 日立化成株式会社 | 樹脂組成物、硬化物、成形体及びその製造方法、並びに、フィルムコンデンサ及びその製造方法 |
US11339284B2 (en) * | 2017-10-30 | 2022-05-24 | Showa Denko Materials Co., Ltd. | Resin composition, cured product, formed body and manufacturing method thereof, and film capacitor and manufacturing method thereof |
US20230228312A1 (en) * | 2020-06-02 | 2023-07-20 | Sumitomo Bakelite Co., Ltd. | Phenol resin composition for friction material |
Citations (2)
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EP0620242B1 (en) * | 1993-04-15 | 1998-08-19 | Dow Corning Toray Silicone Company, Limited | Epoxy group-containing silicone resin and compositions based thereon |
EP0789057B1 (en) * | 1996-02-07 | 2000-04-05 | Dow Corning Toray Silicone Company Limited | Curable epoxy resin compositions and electronic components |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3263177B2 (ja) * | 1993-04-15 | 2002-03-04 | 東レ・ダウコーニング・シリコーン株式会社 | エポキシ基含有シリコーンレジンおよびその製造方法 |
US5952439A (en) * | 1993-04-15 | 1999-09-14 | Dow Corning Toray Silicone Co., Ltd. | Epoxy group-containing silicone resin and compositions based thereon |
JP3339910B2 (ja) * | 1993-04-15 | 2002-10-28 | 東レ・ダウコーニング・シリコーン株式会社 | 硬化性樹脂組成物 |
JPH10195179A (ja) * | 1997-01-08 | 1998-07-28 | Shin Etsu Chem Co Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
JPH10237273A (ja) * | 1997-02-24 | 1998-09-08 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
JP3388536B2 (ja) * | 1998-05-12 | 2003-03-24 | 信越化学工業株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
JP2000086868A (ja) * | 1998-09-17 | 2000-03-28 | Mitsubishi Electric Corp | エポキシ樹脂組成物及びこれを用いた半導体装置 |
JP3460820B2 (ja) * | 1999-12-08 | 2003-10-27 | 日本電気株式会社 | 難燃性エポキシ樹脂組成物 |
-
2001
- 2001-06-29 JP JP2001199185A patent/JP4948716B2/ja not_active Expired - Lifetime
-
2002
- 2002-06-28 WO PCT/JP2002/006620 patent/WO2003002662A1/ja active IP Right Grant
- 2002-06-28 US US10/482,323 patent/US7105614B2/en not_active Expired - Lifetime
- 2002-06-28 AT AT02738889T patent/ATE373046T1/de not_active IP Right Cessation
- 2002-06-28 EP EP02738889A patent/EP1408083B1/en not_active Expired - Lifetime
- 2002-06-28 CN CNB02812717XA patent/CN1276023C/zh not_active Expired - Fee Related
- 2002-06-28 TW TW091114360A patent/TWI313283B/zh not_active IP Right Cessation
- 2002-06-28 CA CA002452398A patent/CA2452398A1/en not_active Abandoned
- 2002-06-28 DE DE60222424T patent/DE60222424T2/de not_active Expired - Lifetime
- 2002-06-28 KR KR1020037017133A patent/KR100851769B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0620242B1 (en) * | 1993-04-15 | 1998-08-19 | Dow Corning Toray Silicone Company, Limited | Epoxy group-containing silicone resin and compositions based thereon |
EP0789057B1 (en) * | 1996-02-07 | 2000-04-05 | Dow Corning Toray Silicone Company Limited | Curable epoxy resin compositions and electronic components |
Also Published As
Publication number | Publication date |
---|---|
CA2452398A1 (en) | 2003-01-09 |
US7105614B2 (en) | 2006-09-12 |
EP1408083A4 (en) | 2004-11-10 |
CN1639257A (zh) | 2005-07-13 |
TWI313283B (en) | 2009-08-11 |
EP1408083B1 (en) | 2007-09-12 |
US20040198925A1 (en) | 2004-10-07 |
ATE373046T1 (de) | 2007-09-15 |
WO2003002662A1 (fr) | 2003-01-09 |
CN1276023C (zh) | 2006-09-20 |
EP1408083A1 (en) | 2004-04-14 |
DE60222424D1 (de) | 2007-10-25 |
JP2003012767A (ja) | 2003-01-15 |
KR20040014595A (ko) | 2004-02-14 |
DE60222424T2 (de) | 2008-06-12 |
JP4948716B2 (ja) | 2012-06-06 |
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