KR100843874B1 - 수산화마그네슘 입자 및 그 제조 방법 및 이를 포함하는수지조성물 - Google Patents

수산화마그네슘 입자 및 그 제조 방법 및 이를 포함하는수지조성물 Download PDF

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Publication number
KR100843874B1
KR100843874B1 KR1020060038371A KR20060038371A KR100843874B1 KR 100843874 B1 KR100843874 B1 KR 100843874B1 KR 1020060038371 A KR1020060038371 A KR 1020060038371A KR 20060038371 A KR20060038371 A KR 20060038371A KR 100843874 B1 KR100843874 B1 KR 100843874B1
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KR
South Korea
Prior art keywords
magnesium hydroxide
hydroxide particles
resin composition
particle
hexagonal
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KR1020060038371A
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English (en)
Korean (ko)
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KR20060113521A (ko
Inventor
아츠야 카와세
히로후미 쿠리스
마사아키 쿠니시게
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다테호 가가쿠 고교 가부시키가이샤
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Publication of KR20060113521A publication Critical patent/KR20060113521A/ko
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Publication of KR100843874B1 publication Critical patent/KR100843874B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F5/00—Compounds of magnesium
    • C01F5/14—Magnesium hydroxide
    • C01F5/16—Magnesium hydroxide by treating magnesia, e.g. calcined dolomite, with water or solutions of salts not containing magnesium
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/30—Particle morphology extending in three dimensions
    • C01P2004/40—Particle morphology extending in three dimensions prism-like
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/2224—Magnesium hydroxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/66—Substances characterised by their function in the composition
    • C08L2666/84—Flame-proofing or flame-retarding additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Inorganic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020060038371A 2005-04-28 2006-04-27 수산화마그네슘 입자 및 그 제조 방법 및 이를 포함하는수지조성물 KR100843874B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005131149A JP4774236B2 (ja) 2005-04-28 2005-04-28 水酸化マグネシウム粒子及びその製造方法及びそれを含む樹脂組成物
JPJP-P-2005-00131149 2005-04-28

Publications (2)

Publication Number Publication Date
KR20060113521A KR20060113521A (ko) 2006-11-02
KR100843874B1 true KR100843874B1 (ko) 2008-07-03

Family

ID=37194575

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KR1020060038371A KR100843874B1 (ko) 2005-04-28 2006-04-27 수산화마그네슘 입자 및 그 제조 방법 및 이를 포함하는수지조성물

Country Status (5)

Country Link
JP (1) JP4774236B2 (ja)
KR (1) KR100843874B1 (ja)
CN (1) CN100455513C (ja)
MY (1) MY142249A (ja)
TW (1) TWI365851B (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4745713B2 (ja) * 2005-04-28 2011-08-10 タテホ化学工業株式会社 水酸化マグネシウム粒子及びその製造方法及びそれを含む樹脂組成物
CN101223235B (zh) * 2005-07-13 2011-07-27 日立化成工业株式会社 密封用环氧树脂组合物及电子零件装置
JP2010030882A (ja) * 2008-06-25 2010-02-12 Kyowa Chem Ind Co Ltd 複合水酸化マグネシウム粒子、難燃剤組成物および難燃性ポリオレフィン樹脂組成物
JP4778111B1 (ja) * 2010-06-29 2011-09-21 貴夫 舩田 水酸化マグネシウム及びその製造方法
JP5944714B2 (ja) * 2012-03-27 2016-07-05 タテホ化学工業株式会社 水酸化マグネシウム粒子、及びそれを含む樹脂組成物
JP5877745B2 (ja) * 2012-03-27 2016-03-08 タテホ化学工業株式会社 複合金属水酸化物粒子、及びそれを含む樹脂組成物
JP6059577B2 (ja) * 2012-11-13 2017-01-11 タテホ化学工業株式会社 水酸化マグネシウム粒子、及びそれを含む樹脂組成物

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03170325A (ja) * 1989-11-27 1991-07-23 Mitsubishi Materials Corp 水酸化マグネシウムの製造方法
JPH0881216A (ja) * 1994-09-09 1996-03-26 Daicel Amiboshi Sangyo Kk 水酸化マグネシウム水懸濁液及びその製造方法
KR20010009179A (ko) * 1999-07-08 2001-02-05 유현식 반도체 소자 봉지용 에폭시 수지 조성물
KR20010086246A (ko) * 1998-12-14 2001-09-10 마쓰시마 게이조 수산화마그네슘 입자, 그 제조방법 및 그 입자를 함유하는수지조성물
KR20040072882A (ko) * 2003-02-11 2004-08-19 주식회사 금강고려화학 환경친화형 반도체소자 봉지용 에폭시수지 조성물

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63277511A (ja) * 1987-05-11 1988-11-15 Shin Nippon Kagaku Kogyo Co Ltd 水酸化マグネシウムの製造方法および表面処理水酸化マグネシウムの製造方法
JP2602436B2 (ja) * 1987-11-17 1997-04-23 宇部化学工業株式会社 高分散性水酸化マグネシウムの製造方法
JPH04362012A (ja) * 1991-06-06 1992-12-15 Mitsubishi Materials Corp 高分散性水酸化マグネシウムの製造方法
JP2944928B2 (ja) * 1995-02-13 1999-09-06 ダイセル網干産業株式会社 水酸化マグネシウムおよびその水懸濁液の製造方法
JPH1059711A (ja) * 1996-08-12 1998-03-03 Daicel Amiboshi Sangyo Kk 水酸化マグネシウムおよびその水懸濁液の製造方法
JP2000233924A (ja) * 1998-12-14 2000-08-29 Kyowa Chem Ind Co Ltd 水酸化マグネシウム粒子およびその製造方法
JP4765150B2 (ja) * 2000-05-29 2011-09-07 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
JP4961635B2 (ja) * 2001-05-30 2012-06-27 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
JP4745713B2 (ja) * 2005-04-28 2011-08-10 タテホ化学工業株式会社 水酸化マグネシウム粒子及びその製造方法及びそれを含む樹脂組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03170325A (ja) * 1989-11-27 1991-07-23 Mitsubishi Materials Corp 水酸化マグネシウムの製造方法
JPH0881216A (ja) * 1994-09-09 1996-03-26 Daicel Amiboshi Sangyo Kk 水酸化マグネシウム水懸濁液及びその製造方法
KR20010086246A (ko) * 1998-12-14 2001-09-10 마쓰시마 게이조 수산화마그네슘 입자, 그 제조방법 및 그 입자를 함유하는수지조성물
KR20010009179A (ko) * 1999-07-08 2001-02-05 유현식 반도체 소자 봉지용 에폭시 수지 조성물
KR20040072882A (ko) * 2003-02-11 2004-08-19 주식회사 금강고려화학 환경친화형 반도체소자 봉지용 에폭시수지 조성물

Also Published As

Publication number Publication date
CN100455513C (zh) 2009-01-28
MY142249A (en) 2010-11-15
KR20060113521A (ko) 2006-11-02
TWI365851B (en) 2012-06-11
CN1854067A (zh) 2006-11-01
TW200637794A (en) 2006-11-01
JP2006306658A (ja) 2006-11-09
JP4774236B2 (ja) 2011-09-14

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