KR100833382B1 - 동 충진 마이크로비아의 함몰 또는 돌기의 분석 방법 - Google Patents
동 충진 마이크로비아의 함몰 또는 돌기의 분석 방법 Download PDFInfo
- Publication number
- KR100833382B1 KR100833382B1 KR1020060079972A KR20060079972A KR100833382B1 KR 100833382 B1 KR100833382 B1 KR 100833382B1 KR 1020060079972 A KR1020060079972 A KR 1020060079972A KR 20060079972 A KR20060079972 A KR 20060079972A KR 100833382 B1 KR100833382 B1 KR 100833382B1
- Authority
- KR
- South Korea
- Prior art keywords
- copper
- microvia
- depression
- altitude
- area
- Prior art date
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- Quality & Reliability (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Theoretical Computer Science (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094141861A TWI270656B (en) | 2005-11-29 | 2005-11-29 | Analysis method for sag or protrusion of copper-filled micro via |
TW094141861 | 2005-11-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070056927A KR20070056927A (ko) | 2007-06-04 |
KR100833382B1 true KR100833382B1 (ko) | 2008-05-28 |
Family
ID=38209141
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060079972A KR100833382B1 (ko) | 2005-11-29 | 2006-08-23 | 동 충진 마이크로비아의 함몰 또는 돌기의 분석 방법 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4514742B2 (zh) |
KR (1) | KR100833382B1 (zh) |
TW (1) | TWI270656B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114674207B (zh) * | 2022-04-28 | 2024-04-12 | 马鞍山钢铁股份有限公司 | 一种平底盲孔的底面平面度测量装置和方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20000053413A (ko) * | 1999-01-08 | 2000-08-25 | 하이든 마틴 | 패턴화된 기판에서의 결함 검출방법 및 장치 |
JP2002050873A (ja) * | 2000-07-27 | 2002-02-15 | Kermel | 導電路、パッド及びマイクロビアより成る回路の製造方法、並びにプリント回路及び高集積密度を有する多層モジュールの製造へのこの方法の使用方法 |
JP2004128365A (ja) * | 2002-10-07 | 2004-04-22 | Sumitomo Electric Printed Circuit Inc | フレキシブル銅張回路基板 |
KR20040104693A (ko) * | 2002-05-02 | 2004-12-10 | 오르보테크 엘티디. | 불균일하게 수정된 이미지를 이용하여 인쇄 회로 보드를제조하는 시스템 및 방법 |
JP2004356493A (ja) * | 2003-05-30 | 2004-12-16 | Sumitomo Metal Mining Co Ltd | 多層プリント配線基板の製造方法 |
KR20050042732A (ko) * | 2003-11-04 | 2005-05-10 | 인터내셔널 비지네스 머신즈 코포레이션 | 높은 배선 능력을 갖춘 고밀도 마이크로비아 기판 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0786477B2 (ja) * | 1987-09-28 | 1995-09-20 | 株式会社東芝 | 表面検査装置 |
JPH03188307A (ja) * | 1989-12-19 | 1991-08-16 | Fujitsu Ltd | バイアホール検査装置 |
JP4005211B2 (ja) * | 1998-04-02 | 2007-11-07 | イビデン株式会社 | 両面基板の充填スルーホールの形成方法 |
US6166819A (en) * | 1998-06-26 | 2000-12-26 | Siemens Aktiengesellschaft | System and methods for optically measuring dielectric thickness in semiconductor devices |
JP2001144444A (ja) * | 1999-11-17 | 2001-05-25 | Ibiden Co Ltd | 多層プリント配線板並びにそのコア材となる両面プリント配線板及びその製造方法 |
-
2005
- 2005-11-29 TW TW094141861A patent/TWI270656B/zh active
-
2006
- 2006-08-23 KR KR1020060079972A patent/KR100833382B1/ko active IP Right Grant
- 2006-09-29 JP JP2006267114A patent/JP4514742B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20000053413A (ko) * | 1999-01-08 | 2000-08-25 | 하이든 마틴 | 패턴화된 기판에서의 결함 검출방법 및 장치 |
JP2002050873A (ja) * | 2000-07-27 | 2002-02-15 | Kermel | 導電路、パッド及びマイクロビアより成る回路の製造方法、並びにプリント回路及び高集積密度を有する多層モジュールの製造へのこの方法の使用方法 |
KR20040104693A (ko) * | 2002-05-02 | 2004-12-10 | 오르보테크 엘티디. | 불균일하게 수정된 이미지를 이용하여 인쇄 회로 보드를제조하는 시스템 및 방법 |
JP2004128365A (ja) * | 2002-10-07 | 2004-04-22 | Sumitomo Electric Printed Circuit Inc | フレキシブル銅張回路基板 |
JP2004356493A (ja) * | 2003-05-30 | 2004-12-16 | Sumitomo Metal Mining Co Ltd | 多層プリント配線基板の製造方法 |
KR20050042732A (ko) * | 2003-11-04 | 2005-05-10 | 인터내셔널 비지네스 머신즈 코포레이션 | 높은 배선 능력을 갖춘 고밀도 마이크로비아 기판 |
Also Published As
Publication number | Publication date |
---|---|
KR20070056927A (ko) | 2007-06-04 |
TW200720623A (en) | 2007-06-01 |
TWI270656B (en) | 2007-01-11 |
JP4514742B2 (ja) | 2010-07-28 |
JP2007147591A (ja) | 2007-06-14 |
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