KR100833382B1 - 동 충진 마이크로비아의 함몰 또는 돌기의 분석 방법 - Google Patents

동 충진 마이크로비아의 함몰 또는 돌기의 분석 방법 Download PDF

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Publication number
KR100833382B1
KR100833382B1 KR1020060079972A KR20060079972A KR100833382B1 KR 100833382 B1 KR100833382 B1 KR 100833382B1 KR 1020060079972 A KR1020060079972 A KR 1020060079972A KR 20060079972 A KR20060079972 A KR 20060079972A KR 100833382 B1 KR100833382 B1 KR 100833382B1
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KR
South Korea
Prior art keywords
copper
microvia
depression
altitude
area
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KR1020060079972A
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English (en)
Korean (ko)
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KR20070056927A (ko
Inventor
구앙 시아 왕
구오 웬 루
잉 카이 훙
우 유 시아오
쿤 지 리
Original Assignee
마하비전 아이엔씨.
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Application filed by 마하비전 아이엔씨. filed Critical 마하비전 아이엔씨.
Publication of KR20070056927A publication Critical patent/KR20070056927A/ko
Application granted granted Critical
Publication of KR100833382B1 publication Critical patent/KR100833382B1/ko

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection

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  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Signal Processing (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Quality & Reliability (AREA)
  • Theoretical Computer Science (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
KR1020060079972A 2005-11-29 2006-08-23 동 충진 마이크로비아의 함몰 또는 돌기의 분석 방법 KR100833382B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW094141861 2005-11-29
TW094141861A TWI270656B (en) 2005-11-29 2005-11-29 Analysis method for sag or protrusion of copper-filled micro via

Publications (2)

Publication Number Publication Date
KR20070056927A KR20070056927A (ko) 2007-06-04
KR100833382B1 true KR100833382B1 (ko) 2008-05-28

Family

ID=38209141

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060079972A KR100833382B1 (ko) 2005-11-29 2006-08-23 동 충진 마이크로비아의 함몰 또는 돌기의 분석 방법

Country Status (3)

Country Link
JP (1) JP4514742B2 (zh)
KR (1) KR100833382B1 (zh)
TW (1) TWI270656B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114674207B (zh) * 2022-04-28 2024-04-12 马鞍山钢铁股份有限公司 一种平底盲孔的底面平面度测量装置和方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000053413A (ko) * 1999-01-08 2000-08-25 하이든 마틴 패턴화된 기판에서의 결함 검출방법 및 장치
JP2002050873A (ja) * 2000-07-27 2002-02-15 Kermel 導電路、パッド及びマイクロビアより成る回路の製造方法、並びにプリント回路及び高集積密度を有する多層モジュールの製造へのこの方法の使用方法
JP2004128365A (ja) * 2002-10-07 2004-04-22 Sumitomo Electric Printed Circuit Inc フレキシブル銅張回路基板
KR20040104693A (ko) * 2002-05-02 2004-12-10 오르보테크 엘티디. 불균일하게 수정된 이미지를 이용하여 인쇄 회로 보드를제조하는 시스템 및 방법
JP2004356493A (ja) * 2003-05-30 2004-12-16 Sumitomo Metal Mining Co Ltd 多層プリント配線基板の製造方法
KR20050042732A (ko) * 2003-11-04 2005-05-10 인터내셔널 비지네스 머신즈 코포레이션 높은 배선 능력을 갖춘 고밀도 마이크로비아 기판

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0786477B2 (ja) * 1987-09-28 1995-09-20 株式会社東芝 表面検査装置
JPH03188307A (ja) * 1989-12-19 1991-08-16 Fujitsu Ltd バイアホール検査装置
JP4005211B2 (ja) * 1998-04-02 2007-11-07 イビデン株式会社 両面基板の充填スルーホールの形成方法
US6166819A (en) * 1998-06-26 2000-12-26 Siemens Aktiengesellschaft System and methods for optically measuring dielectric thickness in semiconductor devices
JP2001144444A (ja) * 1999-11-17 2001-05-25 Ibiden Co Ltd 多層プリント配線板並びにそのコア材となる両面プリント配線板及びその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000053413A (ko) * 1999-01-08 2000-08-25 하이든 마틴 패턴화된 기판에서의 결함 검출방법 및 장치
JP2002050873A (ja) * 2000-07-27 2002-02-15 Kermel 導電路、パッド及びマイクロビアより成る回路の製造方法、並びにプリント回路及び高集積密度を有する多層モジュールの製造へのこの方法の使用方法
KR20040104693A (ko) * 2002-05-02 2004-12-10 오르보테크 엘티디. 불균일하게 수정된 이미지를 이용하여 인쇄 회로 보드를제조하는 시스템 및 방법
JP2004128365A (ja) * 2002-10-07 2004-04-22 Sumitomo Electric Printed Circuit Inc フレキシブル銅張回路基板
JP2004356493A (ja) * 2003-05-30 2004-12-16 Sumitomo Metal Mining Co Ltd 多層プリント配線基板の製造方法
KR20050042732A (ko) * 2003-11-04 2005-05-10 인터내셔널 비지네스 머신즈 코포레이션 높은 배선 능력을 갖춘 고밀도 마이크로비아 기판

Also Published As

Publication number Publication date
JP2007147591A (ja) 2007-06-14
KR20070056927A (ko) 2007-06-04
TWI270656B (en) 2007-01-11
JP4514742B2 (ja) 2010-07-28
TW200720623A (en) 2007-06-01

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