JP4514742B2 - 銅充填後微孔の凹みまたは凸起の分析方法 - Google Patents

銅充填後微孔の凹みまたは凸起の分析方法 Download PDF

Info

Publication number
JP4514742B2
JP4514742B2 JP2006267114A JP2006267114A JP4514742B2 JP 4514742 B2 JP4514742 B2 JP 4514742B2 JP 2006267114 A JP2006267114 A JP 2006267114A JP 2006267114 A JP2006267114 A JP 2006267114A JP 4514742 B2 JP4514742 B2 JP 4514742B2
Authority
JP
Japan
Prior art keywords
copper
dent
height
micropore
value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2006267114A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007147591A (ja
Inventor
グアン シア ワン
グオ ウェン ルー
イン カイ フン
ウー ユー シーアオ
クン ジー リー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Machvision Inc
Original Assignee
Machvision Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Machvision Inc filed Critical Machvision Inc
Publication of JP2007147591A publication Critical patent/JP2007147591A/ja
Application granted granted Critical
Publication of JP4514742B2 publication Critical patent/JP4514742B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Quality & Reliability (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP2006267114A 2005-11-29 2006-09-29 銅充填後微孔の凹みまたは凸起の分析方法 Active JP4514742B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094141861A TWI270656B (en) 2005-11-29 2005-11-29 Analysis method for sag or protrusion of copper-filled micro via

Publications (2)

Publication Number Publication Date
JP2007147591A JP2007147591A (ja) 2007-06-14
JP4514742B2 true JP4514742B2 (ja) 2010-07-28

Family

ID=38209141

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006267114A Active JP4514742B2 (ja) 2005-11-29 2006-09-29 銅充填後微孔の凹みまたは凸起の分析方法

Country Status (3)

Country Link
JP (1) JP4514742B2 (zh)
KR (1) KR100833382B1 (zh)
TW (1) TWI270656B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114674207B (zh) * 2022-04-28 2024-04-12 马鞍山钢铁股份有限公司 一种平底盲孔的底面平面度测量装置和方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03188307A (ja) * 1989-12-19 1991-08-16 Fujitsu Ltd バイアホール検査装置
JPH11289138A (ja) * 1998-04-02 1999-10-19 Ibiden Co Ltd 両面基板およびその充填スルーホールの形成方法
JP2000049204A (ja) * 1998-06-26 2000-02-18 Siemens Ag 半導体デバイス内の誘電体層厚さの光学的測定方法及び装置
JP2001144444A (ja) * 1999-11-17 2001-05-25 Ibiden Co Ltd 多層プリント配線板並びにそのコア材となる両面プリント配線板及びその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0786477B2 (ja) * 1987-09-28 1995-09-20 株式会社東芝 表面検査装置
US6252412B1 (en) * 1999-01-08 2001-06-26 Schlumberger Technologies, Inc. Method of detecting defects in patterned substrates
FR2812515B1 (fr) * 2000-07-27 2003-08-01 Kermel Procede de realisation d'une circuiterie comportant pistes, pastilles et microtraversees conductrices et utilisation de ce procede pour la realisation de circuits imprimes et de modules multicouches a haute densite d'integration
DE10392578T5 (de) * 2002-05-02 2005-05-12 Orbotech Ltd. System und Verfahren zur Herstellung von gedruckten Schaltungsplatinen unter Verwendung von nichtgleichmässig modifizierten Bildern
JP4160811B2 (ja) * 2002-10-07 2008-10-08 住友電工プリントサーキット株式会社 フレキシブル銅張回路基板
JP2004356493A (ja) * 2003-05-30 2004-12-16 Sumitomo Metal Mining Co Ltd 多層プリント配線基板の製造方法
US6919635B2 (en) * 2003-11-04 2005-07-19 International Business Machines Corporation High density microvia substrate with high wireability

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03188307A (ja) * 1989-12-19 1991-08-16 Fujitsu Ltd バイアホール検査装置
JPH11289138A (ja) * 1998-04-02 1999-10-19 Ibiden Co Ltd 両面基板およびその充填スルーホールの形成方法
JP2000049204A (ja) * 1998-06-26 2000-02-18 Siemens Ag 半導体デバイス内の誘電体層厚さの光学的測定方法及び装置
JP2001144444A (ja) * 1999-11-17 2001-05-25 Ibiden Co Ltd 多層プリント配線板並びにそのコア材となる両面プリント配線板及びその製造方法

Also Published As

Publication number Publication date
JP2007147591A (ja) 2007-06-14
KR20070056927A (ko) 2007-06-04
TWI270656B (en) 2007-01-11
KR100833382B1 (ko) 2008-05-28
TW200720623A (en) 2007-06-01

Similar Documents

Publication Publication Date Title
CN101690435B (zh) 使用微通路激光钻凿和导电层预布图形成衬底芯层结构的方法以及根据该方法形成的衬底芯层结构
CN101025398B (zh) 微孔填铜后的凹陷或凸起分析方法
JP2009158905A (ja) 埋込型印刷回路基板の製造方法
US8058561B2 (en) Circuit board and manufacturing method thereof
JP4514742B2 (ja) 銅充填後微孔の凹みまたは凸起の分析方法
JP2005311289A (ja) 回路接続構造体とその製造方法
KR101055507B1 (ko) 패턴부의 리페어 구조 및 리페어 방법
TWI359938B (en) Measurement method for laser vias on flip chip sub
CN109769347A (zh) 一种用于pcb钻孔深度的测量判断方法
JP4930073B2 (ja) ビルドアップ基板の製造方法
CN114189987A (zh) 一种pcb及其制作方法
JP2009021401A (ja) プリント配線板およびプリント配線板の検査方法
CN109640520B (zh) 一种埋阻电路板的制作方法
JP2010040751A (ja) プリント配線板およびその製造方法ならびにプリント配線板のフィリングビアの外観検査方法
JP4823605B2 (ja) 露光装置、露光方法、及びパターン製造システム
CN110611997A (zh) 一种印制线路板镀铜孔的加工方法
JP7192423B2 (ja) めっき厚判定方法、並びに多層配線基板の製造方法
CN103298251B (zh) 一种印刷电路板及其制作方法
CN114173492B (zh) 检测电路板填孔能力的通盲孔设计方法
US20220167502A1 (en) Printed circuit board
CN101262741B (zh) 在基板工艺中形成用以量测基板尺寸的量测靶点的方法
JP2009295691A (ja) 配線回路基板の製造方法
TW201719845A (zh) 電子封裝體及形成電氣封裝體之方法
CN118055559A (zh) 印刷电路板及用于制造印刷电路板的方法
KR20240027504A (ko) 인쇄회로기판

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090323

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090519

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20090819

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20090827

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090904

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20091020

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100222

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20100329

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20100413

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20100511

R150 Certificate of patent or registration of utility model

Ref document number: 4514742

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130521

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250