KR100817345B1 - 적층체 및 그의 용도 - Google Patents

적층체 및 그의 용도 Download PDF

Info

Publication number
KR100817345B1
KR100817345B1 KR1020027002216A KR20027002216A KR100817345B1 KR 100817345 B1 KR100817345 B1 KR 100817345B1 KR 1020027002216 A KR1020027002216 A KR 1020027002216A KR 20027002216 A KR20027002216 A KR 20027002216A KR 100817345 B1 KR100817345 B1 KR 100817345B1
Authority
KR
South Korea
Prior art keywords
layer
etching
delete delete
insulating layer
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020027002216A
Other languages
English (en)
Korean (ko)
Other versions
KR20020025989A (ko
Inventor
가쓰야 사까요리
시게키 가와노
히로꼬 아마사키
히데쓰구 다자와
가즈나리 이케다
고우헤이 오노
Original Assignee
다이니폰 인사츠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이니폰 인사츠 가부시키가이샤 filed Critical 다이니폰 인사츠 가부시키가이샤
Publication of KR20020025989A publication Critical patent/KR20020025989A/ko
Application granted granted Critical
Publication of KR100817345B1 publication Critical patent/KR100817345B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/147—Structure or manufacture of heads, e.g. inductive with cores being composed of metal sheets, i.e. laminated cores with cores composed of isolated magnetic layers, e.g. sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B2220/00—Record carriers by type
    • G11B2220/20—Disc-shaped record carriers
    • G11B2220/23—Disc-shaped record carriers characterised in that the disc has a specific layer structure
    • G11B2220/235—Multilayer discs, i.e. multiple recording layers accessed from the same side
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B2220/00—Record carriers by type
    • G11B2220/20—Disc-shaped record carriers
    • G11B2220/25—Disc-shaped record carriers characterised in that the disc is based on a specific recording technology
    • G11B2220/2508—Magnetic discs
    • G11B2220/2516—Hard disks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
  • Insulating Bodies (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
KR1020027002216A 2000-06-21 2001-06-21 적층체 및 그의 용도 Expired - Fee Related KR100817345B1 (ko)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JPJP-P-2000-00186564 2000-06-21
JP2000186564 2000-06-21
JP2000232227 2000-07-31
JPJP-P-2000-00232227 2000-07-31
JPJP-P-2001-00030249 2001-02-06
JP2001030249 2001-02-06
JPJP-P-2001-00030171 2001-02-06
JP2001030171 2001-02-06

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020067027265A Division KR100795617B1 (ko) 2000-06-21 2001-06-21 적층체 및 그의 용도

Publications (2)

Publication Number Publication Date
KR20020025989A KR20020025989A (ko) 2002-04-04
KR100817345B1 true KR100817345B1 (ko) 2008-03-26

Family

ID=27481376

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020027002216A Expired - Fee Related KR100817345B1 (ko) 2000-06-21 2001-06-21 적층체 및 그의 용도
KR1020067027265A Expired - Fee Related KR100795617B1 (ko) 2000-06-21 2001-06-21 적층체 및 그의 용도

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020067027265A Expired - Fee Related KR100795617B1 (ko) 2000-06-21 2001-06-21 적층체 및 그의 용도

Country Status (9)

Country Link
US (2) US20040043232A1 (cg-RX-API-DMAC7.html)
JP (2) JP5318314B2 (cg-RX-API-DMAC7.html)
KR (2) KR100817345B1 (cg-RX-API-DMAC7.html)
CN (2) CN100350517C (cg-RX-API-DMAC7.html)
AU (1) AU7458201A (cg-RX-API-DMAC7.html)
DE (1) DE10192864T1 (cg-RX-API-DMAC7.html)
SG (1) SG148026A1 (cg-RX-API-DMAC7.html)
TW (4) TW200519973A (cg-RX-API-DMAC7.html)
WO (1) WO2001099124A1 (cg-RX-API-DMAC7.html)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4408277B2 (ja) * 2003-02-18 2010-02-03 三井化学株式会社 ポリイミド金属積層体
US6855404B2 (en) * 2003-03-13 2005-02-15 E. I. Du Pont De Nemours And Company Inorganic sheet laminate
US20080225438A1 (en) * 2005-03-03 2008-09-18 Nippon Steel Chemical Co., Ltd Laminate for Suspension and Method for Producing Same
JP2006244599A (ja) * 2005-03-03 2006-09-14 Nippon Steel Chem Co Ltd サスペンション用積層体およびその製造方法
US20080089072A1 (en) * 2006-10-11 2008-04-17 Alti-Electronics Co., Ltd. High Power Light Emitting Diode Package
DE102009012827A1 (de) * 2009-03-03 2010-10-07 Gebr. Schmid Gmbh & Co. Verfahren zur Texturierung von Siliziumwafern für Solarzellen und Behandlungsflüssigkeit dafür
TWI396482B (zh) * 2010-07-30 2013-05-11 光明電子股份有限公司 線路基板製程及線路基板結構
TWI521016B (zh) * 2012-07-18 2016-02-11 財團法人工業技術研究院 蝕刻含聚亞醯胺之膜層的方法
CN106062895B (zh) * 2014-01-22 2018-12-14 宇部兴产株式会社 形成导体层的方法及使用导电层制备多层布线基板的方法
EP3146560A4 (en) * 2014-05-23 2018-04-18 Materion Corporation Air cavity package
CN104485294A (zh) * 2014-12-12 2015-04-01 浙江中纳晶微电子科技有限公司 一种晶圆临时键合及分离方法
JP6973476B2 (ja) * 2017-04-06 2021-12-01 大日本印刷株式会社 ポリイミドフィルム、積層体、及びディスプレイ用表面材
JP7088173B2 (ja) * 2017-04-10 2022-06-21 大日本印刷株式会社 フレキシブルディスプレイ用表面材

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05235491A (ja) * 1992-02-19 1993-09-10 Fujitsu Ltd 薄膜回路基板とその製造方法
WO1998008216A1 (fr) 1996-08-19 1998-02-26 Nippon Steel Chemical Co., Ltd. Stratifie pour suspension d'entrainement de disques durs et sa fabrication

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52108496A (en) * 1976-03-09 1977-09-10 Showa Electric Wire & Cable Co Ltd Preparation of polyimide resins
JPS6384117A (ja) * 1986-09-29 1988-04-14 Fuji Xerox Co Ltd ポリイミド樹脂のエツチング方法
JPH0314294A (ja) * 1989-06-13 1991-01-22 Hitachi Ltd ポリイミド樹脂膜のパターン形成方法
CA2040994A1 (en) * 1990-05-08 1991-11-09 David D. Ngo Photoimageable polyimide coating
JPH05214101A (ja) * 1992-02-06 1993-08-24 Hitachi Ltd 熱可塑型ポリエステルイミドとそれを用いた電子部品および電子装置
JP3451401B2 (ja) * 1992-12-16 2003-09-29 鐘淵化学工業株式会社 超電導線材被覆用熱融着性積層フィルム
CA2111294A1 (en) * 1992-12-16 1994-06-17 Hiroyuki Furutani Thermoplastic polyimide, polyamide acid, and thermally fusible laminated film for covering conductive wires
US5621068A (en) * 1993-08-03 1997-04-15 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Thermoplastic polyimide polymer; thermoplastic polyimide film; polyimide laminate; and method of manufacturing the laminate
JP3632791B2 (ja) * 1995-12-20 2005-03-23 株式会社カネカ 接着性絶縁フィルム及びその製造方法
US6218022B1 (en) 1996-09-20 2001-04-17 Toray Engineering Co., Ltd. Resin etching solution and process for etching polyimide resins
JP3722610B2 (ja) 1998-01-14 2005-11-30 株式会社リコー 半導体装置の製造方法
US6103456A (en) * 1998-07-22 2000-08-15 Siemens Aktiengesellschaft Prevention of photoresist poisoning from dielectric antireflective coating in semiconductor fabrication
JP2000123512A (ja) * 1998-10-20 2000-04-28 Ube Ind Ltd 磁気ヘッドサスペンションおよびその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05235491A (ja) * 1992-02-19 1993-09-10 Fujitsu Ltd 薄膜回路基板とその製造方法
WO1998008216A1 (fr) 1996-08-19 1998-02-26 Nippon Steel Chemical Co., Ltd. Stratifie pour suspension d'entrainement de disques durs et sa fabrication

Also Published As

Publication number Publication date
TW200427583A (en) 2004-12-16
TWI293177B (cg-RX-API-DMAC7.html) 2008-02-01
TWI293045B (cg-RX-API-DMAC7.html) 2008-02-01
WO2001099124A1 (en) 2001-12-27
TW200519973A (en) 2005-06-16
US20040043232A1 (en) 2004-03-04
SG148026A1 (en) 2008-12-31
KR100795617B1 (ko) 2008-01-17
DE10192864T1 (de) 2002-09-19
JP2012210813A (ja) 2012-11-01
JP5278578B2 (ja) 2013-09-04
AU7458201A (en) 2002-01-02
CN101143500B (zh) 2012-02-29
CN100350517C (zh) 2007-11-21
KR20070007212A (ko) 2007-01-12
TW200518118A (en) 2005-06-01
CN1388975A (zh) 2003-01-01
US20110076855A1 (en) 2011-03-31
TWI293044B (cg-RX-API-DMAC7.html) 2008-02-01
KR20020025989A (ko) 2002-04-04
CN101143500A (zh) 2008-03-19
TWI293467B (cg-RX-API-DMAC7.html) 2008-02-11
US8252423B2 (en) 2012-08-28
JP5318314B2 (ja) 2013-10-16

Similar Documents

Publication Publication Date Title
JP5278578B2 (ja) 積層体およびその用途
JP2004189981A (ja) 熱可塑性ポリイミド樹脂材料および積層体およびプリント配線板の製造方法
GB2265021A (en) Photosensitive materials and their use in preparing printed circuits
US20070120229A1 (en) Wet etched insulator and electronic circuit component
US20030052078A1 (en) Production process of electronic component using wet etching, electronic component, and suspension for hard disk
US7175736B2 (en) Laminate for electronic circuit
JP3586468B2 (ja) 積層体
JPWO2001099124A1 (ja) 積層体およびその用途
JP2012006200A (ja) ポリイミド金属積層体、及びそれを用いたプリント配線板
JPWO1996022597A1 (ja) 積層体
KR20090104656A (ko) 플렉시블 금속장 적층판 및 그 제조 방법
JP3781381B2 (ja) 積層体及びこれを用いた配線板
JP4936729B2 (ja) フレキシブルプリント配線板用基板及びその製造方法
JP5158736B2 (ja) ハードディスクドライブ用サスペンション
JP2005329641A (ja) フレキシブルプリント配線板用基板及びその製造方法
JP4976269B2 (ja) 接着性層を有するポリイミド樹脂層の製造方法及び金属張積層板の製造方法
JP5116001B2 (ja) ウエットエッチングされた絶縁体の製造方法及び電子回路部品の製造方法
JP5229596B2 (ja) ハードディスクドライブ用ワイヤレスサスペンション用の積層体の製造方法
JP3474519B2 (ja) 積層体の使用方法及び回路基板
JP4766214B2 (ja) 絶縁体、積層体及びハードディスクドライブ用ワイヤレスサスペンション
JP5163762B2 (ja) 電子回路部品用積層体の製造方法
JP2008238558A (ja) 金属張積層体及びその製造方法

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

A107 Divisional application of patent
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20130308

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20140307

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20150313

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20160317

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

FPAY Annual fee payment

Payment date: 20170310

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

FPAY Annual fee payment

Payment date: 20180309

Year of fee payment: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20200321

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20200321